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Industry News 2004 P11
Amkor Technology Announces Intent to Enter $300 Million Term Loan
(October 14, 2004) Chandler, Ariz.—Amkor Technology announces that it has begun discussions with a group of institutional lenders concerning entering into a credit facility for a $300 million term loan.
Amkor Discloses Informal SEC Inquiry
(October 13, 2004) Chandler, Ariz.—Amkor Technology announces that the Securities and Exchange Commission (SEC) is conducting an informal inquiry into trading in the securities of Amkor.
FlipChip International Opens Reliability & Design Center
(October 13, 2004) Phoenix, Ariz.—FlipChip International (FCI) announces the opening of a Reliability & Design Center for wafer level packaging (WLP) and flip chip bumping technologies within its Phoenix, Ariz. facility.
Kester to Hold Lead-free Mini-Clinic at Mexitrónica 2004
(October 13, 2004) Des Plaines, Ill.—As the WEEE and RoHS directives take effect in Europe, and with the increased production of lead-free products in Asia, lead-free assembly in North America is gaining momentum.
Kester, Metcal, BTU International, and STI Will Present Upcoming Lead-free Assembly Seminar
(October 12, 2004) Des Plaines, Ill.—Kester, Metcal, BTU International, and Soldering Technology Inc. (STI) will present a series of Lead-free Technology Seminars scheduled to take place throughout 2004. The next seminar will take place Tuesday, November 9 through Wednesday, November 10, 2004, in Atlanta, Ga.
U.S. Can Still Compete with Rest of World in Semiconductor Manufacturing and R&D, Texas Instruments Executive to Tell at Upcoming ISMI Symposium
(October 12, 2004) Austin, Texas—American communities can hold onto high-tech manufacturing, if they become creative in partnering with companies and give employers solid financial reasons to stay in town, a key Texas Instruments (TI) executive will tell the International SEMATECH Manufacturing Initiative (ISMI) Symposium later this month.
SEMI Silicon Manufacturers Group Announces Silicon Wafer Shipment Consensus Forecast
(October 12, 2004) San Jose, Calif.—The SEMI Silicon Manufacturers Group (SMG) forecasts year-end wafer shipments for 2004 to be 23% higher than
2003 shipments.
MEPTEC to Offer Technical Symposium in November
(October 8, 2004) San Jose, Calif.—MEPTEC, the MicroElectronics Packaging and Test Engineering Council, plans to shake things up a bit with its next technical symposium, titled "Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration," on November 11, 2004 at the Hyatt San Jose.
Indium Corporation Opens China Facility
(October 6, 2004) Clinton, N.Y.—Indium Corporation of America announced the opening of their newest facility. Located in the Suzhou Industrial Park in Jiangsu, China, the facility houses solder-paste manufacturing and quality operations as well as fully integrated sales and technical support teams. This new facility offers prompt responses to customer needs to ensure world-class service throughout China.
STATS ChipPAC reaches milestone in wafer-level chip scale package (WLCSP) production
(October 5, 2004) Singapore and Fremont, Calif.—STATS ChipPAC announces reaching a milestone in its scale-up of full turnkey wafer-level chip scale package (WLCSP) wafer bumping, probe, and back-end processing services, with production run rates exceeding 4 million packaged units per month.
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