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Industry News 2004 P1
Advanced Packaging Wishes You a Happy New Year!
The editors and staff at Advanced Packaging would like to wish you all a happy and healthy 2005.
Newport Updates Financial Guidance for Q4 2004
(December 30, 2004) Irvine, Calif. — Newport Corp. has updated its financial guidance for Q4 2004, confirming that it expects its sales for Q4 2004 to be within the range announced in October 2004 of $100 million to $103 million.
NIST's Chip Scale Magnetic Sensor Draws on Mini Clock Design
(December 29, 2004) Gaithersburg, Md.—A low-power, magnetic sensor about the size of a grain of rice that can detect magnetic field changes as small as 50 picoteslas — a million times weaker than the Earth's magnetic field — has been demonstrated by researchers at the National Institute of Standards and Technology (NIST).
Freescale Plans Inaugural Technology Forum for June 2005
(December 29, 2004) Austin, Texas — Freescale Semiconductor's inaugural Freescale Technology Forum is slated to be held June 20-23, 2005, in Orlando, Fla. This event combines elements of prior Freescale events, such as the Smart Networks Developer Forum and Embedded Connectivity Summit, offering technical education and hands-on training.
Advance Made in Transparent Electronics
(December 29, 2004) Corvallis, Ore.—Researchers at Oregon State University and Hewlett Packard have reported their first example of an entirely new class of materials that could be used to make transparent transistors that are inexpensive, stable, and environmentally benign. This could lead to new industries and a broad range of new consumer products, scientists say.
NPL Looking for Lead-free Reliability Project Partners
(December 28, 2004) Teddington, Middlesex, U.K.—The National Physical Laboratory (NPL) will soon begin a new project to investigate the reliability of existing substrates manufactured using a lead-free process. This project will include investigation of the reliability of microvias, non-functional pads, and design/build aspects of the substrate. It will also investigate these substrates in terms of conductive anodic filamentation (CAF) susceptibility.
MagnaChip closes $750M Offering of High-yield Notes
(December 28, 2004) New York, N.Y.—MagnaChip Semiconductor recently announced the successful sale of US$750 million of high-yield notes in a private offering. The company plans to use the proceeds from this offering to refinance existing indebtedness, redeem existing preferred equity interests of MagnaChip Semiconductor LLC, and for general corporate purposes
FROM THE EDITOR
(December 27, 2004) Nashua, N.H.—Advanced Packaging, Connector Specifier, and SMT are presenting a FREE Webinar on Lead-free Equipment Specifics, Tuesday, January 18, 2005, at 1:00 p.m. EST.
Packaging & Assembly Equipment Market to Decline 22% in 2005
(December 21, 2004) Stamford, Conn.—Worldwide semiconductor capital equipment spending is on pace to increase 61% in 2004, but spending in 2005 is projected to decline 15%, according to Gartner Inc. The packaging and assembly equipment market will experience a 22% decline in 2005, with revenue of approximately $3.5 billion.
SEMI's November Book-to-bill: 1.00
(December 17, 2004) San Jose, Calif.—As expected, North America-based semiconductor equipment manufacturers' orders and billings were down in November 2004. The book-to-bill for the month was 1.00, SEMI reports.
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