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Industry News 2003 P7

MEMS packaging survey says Europe has lots of suppliers, but U.S. handles larger volume (November 12, 2003) Berlin, Germany—Research conducted by an international team of micro- and nano- technology experts known as 'enablingMNT,' on MST/MEMS Equipment Manufacturers shows that in the area of MEMS packaging, Europe has a large number of suppliers, while the U.S. seems to handle larger volumes.
ChipPac takes six stacked-die CSP to market (November 11, 2003) Fremont, Calif.—ChipPAC Inc., a provider of semiconductor assembly and test services, has delivered a six stacked-die CSP in a thin, 1.6-mm profile.
K&S, Nidec Tosok team to provide reel-to-reel packaging services (November 10, 2003) Willow Grove, Penn.—Kulicke & Soffa Industries Inc. and Nidec Tosok Corp. of Zama City, Japan are combining products and technologies to provide integrated solutions for high-speed, reel-to-reel packaging of discreet devices.
Forecast comes with a warning (November 10, 2003) Saratoga, Calif.—In its latest forecast, Advanced Forecasting is warning its clients that an inevitable repetition of the year 2000 Boom-to-Bust looms on the horizon for the Silicon Cycle.
SIA sees 'robust' growth ahead (November 7, 2003) San Jose, Calif.—The Semiconductor Industry Association (SIA) has released its annual forecast for 2003-2006, highlighting a strong growth forecast for 2004. The association expects global sales of semiconductors in 2003 to increase by 15.8 percent to $163 billion, and it projects 2004 revenues to increase by 19.4 percent to $194.6 billion.
World's fastest transistor just got faster (November 7, 2003) Champaign, Ill.—Researchers at the University of Illinois at Urbana-Champaign have broken their own record for what is believed to be the world's fastest transistor. Their latest device, with a frequency of 509 gigahertz, is 57 gigahertz faster than their previous record holder and could find use in applications such as high-speed communications products, consumer electronics and electronic combat systems.
Nanowire film brings cheaper, faster electronics a step closer (November 6, 2003) Cambridge, Mass.—Researchers at Harvard University have demonstrated for the first time that they can easily apply a film of tiny, high-performance silicon nanowires to glass and plastic, a development that could pave the way for the next generation of cheaper, lighter and more powerful consumer electronics.
INDUSTRY NEWS WSTS forecasts market growth
(November 6, 2003) Brussels, Belgium—The World Semiconductor Trade Statistics (WSTS) recently released its Fall 2003 forecast, which says market indicators are pointing to growth from 2003 through 2005.
Sold! Speedline goes to KSP for $10 million (November 5, 2003) New York, N.Y.—KSP Special Situations Fund II spent $10 million to buy the stock and related assets of Franklin, Mass.-based Speedline Technologies Inc., a producer of manufacturing equipment and services for the printed circuit board and semiconductor packaging industries, from Cookson Group.
INDUSTRY NEWS University of Texas, Optonics form partnership
(November 5, 2003) Mountain View, Calif.—Optonics Inc., a photon emission-based optical diagnostic company, has formed a technology partnership with the Microelectronics Research Center at the University of Texas (UT) at Austin. The partnership will focus on the further development of photon counting detector technology for ICs.
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