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Industry News 2003 P62
INDUSTRY NEWS TODAY
Philips and General Atomics Intend to Collaborate on Development of Ultra-Wideband Chipsets
SAN JOSE, CALIF.
SAN DIEGO
Royal Philips Electronics and General Atomics (GA) have signed a Memorandum of Understanding (MoU) to jointly develop Ultra-Wideband (UWB) wireless communication chipsets and support the standardization process. (January 7) Click here for this and other news briefs.
NEW PRODUCT HIGHLIGHTS
Online Interactive Program from Cobar
(January 7)
Thin Film Resistor Products from TT electronics
(January 7)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
NEPCON West, Assembly West and Fiberoptic Automation Expo Converge in Silicon Valley
NORWALK, CONN.
NEPCON West, Assembly West and Fiberoptic Automation Expo, three co-located manufacturing tradeshows in Silicon Valley, mirrored an industry convergence between electronic manufacturing, final product assembly and fiberoptics. (January 6) Click here for this and other news briefs.
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