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Industry News 2003 P49
THOUGHTS ON THE NEWS
Reality Check Index: Heading Up at SEMICON West
I had the privilege recently of participating in the selection of papers to be given at the IEMT Symposium at SEMICON West coming up in July. One of the hottest areas, earning a session all to itself, was ... yes ... wirebonding. In the meantime, optoelectronic packaging appeared only once or twice in the submitted abstracts. (March 21)
THE WEEKLY WRAP FROM WAFERNEWS
SEZ Group Exits Wet Bench Business
The SEZ Group has taken steps to refocus its resources on single-wafer wet surface preparation technology. This move includes the closing of its wet bench production facility in Donaueschingen, Germany, which was acquired by the SEZ Group in February 2001. (March 19)
NEW PRODUCT HIGHLIGHTS
Transene Conductive Epoxy
(March 18)
Wafer Inspection Solutions from August Technology
(March 18)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
Ignis Optics Signs Volume Order for 10 Gb/S Pluggable Transceivers
SAN JOSE, CALIF.
Ignis Optics has signed its first high-volume customer order for 10 Gb/s XFP-compatible transceiver modules. (March 24) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
Back to School
MEPTEC just introduced a new type of program to add to its successful line-up of one-day technical symposiums and luncheon presentations. Its first event in the MEPTEC Education Network Series is scheduled for April 9, and the topic is wafer-level packaging. It looks like it will be a good start. (March 17)
NEW PRODUCT HIGHLIGHTS
Cadence Stacked-die Package Software
(March 14)
Colibri Aerostatic Spindle
(March 14)
Click here for these and more product briefs.
THOUGHTS ON THE NEWS
Good Idea
According to a recent report, Flomerics will be introducing software that combines thermal analysis and electromagnetic compatibility (EMC) analysis into one tool. At first glance, this might seem like an odd combination, but it does make a lot of sense. (March 14)
NEW PRODUCT HIGHLIGHTS
Air Products Recovery and Recycle System
(March 12)
SCS Programmable Spin Coaters
(March 12)
Click here for these and more product briefs.
THE WEEKLY WRAP FROM WAFERNEWS
Final Manufacturing -- Moving to the Front
If Ultratech Stepper's Art Zafiropoulo's recent prediction that in the next 10 to 12 years more than 50% of all ICs will be bumped, it will no doubt come at the expense of some in the industry. But are there enough indicators to point to a "real" trend in the merging of backend processing with frontend wafer level processing?(March 12)
NEW PRODUCT HIGHLIGHTS
Photon Dynamics Vision Inspection Software
(March 11)
Sensor Products Pressure Sensitive Film
(March 11)
Click here for these and more product briefs.
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