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Industry News 2003 P35

THOUGHTS ON THE NEWS All Eyes on FormFactor IPO
News Analysis
The intriguing company FormFactor went public last week, and as one of the first high-tech IPOs in a long, long time, many investors were watching closely.
(June 16) Click here for these and more thoughts.
NEW PRODUCT HIGHLIGHTS Datacon Technology Single-chip Die Attach (June 13)
DEK International Ball Placement (June 13) Click here for these and more product briefs.
INDUSTRY NEWS TODAY NEMI's Test Strategy Project Releases Cost Model that Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
HERNDON, VA.
The Test Strategy Project of the National Electronics Manufacturing Initiative (NEMI) has released a manufacturing test strategy cost model designed to ...
(June 13) Click here for these and more news briefs.
NEW PRODUCT HIGHLIGHTS Instron's Microtest Systems (June 12)
ESEC's Wire Bonder (June 12) Click here for these and more product briefs.
INDUSTRY NEWS TODAY Amkor Names Oleg Khaykin to Head Corporate Development
CHANDLER, ARIZ.
Amkor Technology Inc. announced that Oleg Khaykin has joined the company as executive vice president, corporate development. Khaykin will be responsible for managing Amkor's corporate development, M&A and intellectual property initiatives.
(June 12) Click here for these and more news briefs.
THOUGHTS ON THE NEWS Consortium Update
News Analysis
The two major advanced packaging consortia, the Advanced Packaging and Interconnect Alliance (APiA) and the Semiconductor Equipment Consortium for Advanced Packaging (SECAP), have been quiet recently, but they are still chugging along. Both have seminars coming up, and APiA also has a new member.
(June 12) Click here for these and more thoughts.
NEW PRODUCT HIGHLIGHTS Master Bond Epoxy Adhesive (June 11)
Amkor Technology RF Tester (June 11) Click here for these and more product briefs.
INDUSTRY NEWS TODAY IPC, HKPCA Reschedule International Exhibition for PCB and Assembly Industries
NORTHBROOK, ILL.
IPC -- Association Connecting Electronics Industries and Hong Kong Printed Circuit Association (HKPCA) have rescheduled the International Printed Circuit and Electronics Assembly Fair due to the worldwide outbreak of severe acute respiratory syndrome (SARS).
(June 11) Click here for these and more news briefs.
THE WEEKLY WRAP FROM WAFER NEWS Global chip sales in April unchanged from March, says SIA
Worldwide sales of semiconductors totaled $12.1 billion in April, essentially the same total as March but a 9.7 percent increase from April 2002 revenue of $11.3 billion, according to data from the Semiconductor Industry Association (SIA).
(June 11) Click here for these and more WaferNews briefs.
NEW PRODUCT HIGHLIGHTS Palomar Technologies Eutectic Die Bonder (June 10)
Dymax Corp.'s High-Intensity UV Curing (June 10) Click here for these and more product briefs.
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