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Industry News 2003 P31
INDUSTRY NEWS TODAY
Teradyne Announces New President for Semiconductor Test
BOSTON
Teradyne announced the promotion of Mark E. Jagiela to president of the Semiconductor Test Division, replacing Michael Bradley, who was recently promoted to president of the corporation.
(July 7)
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THOUGHTS ON THE NEWS
Micronas Knows Its Market
News Analysis
I can't recall seeing a press release previously from Micronas, the German chip-maker, but some recent news from them about an approach to packaging for automotive ICs shows that they really understand the unique challenges of that market.
(July 7)
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NEW PRODUCT HIGHLIGHTS
Ultratech Metrology Tool Addition
(July 3)
SUSS MicroTech Full-field Lithography
(July 3)
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INDUSTRY NEWS TODAY
Matheson Tri-Gas Inc. Announces Future Expansion in Johnsonville, Tenn. Plant
PARSIPPANY, N.J.
The Electronics Group of Matheson Tri-Gas Inc. announced it is moving forward with an aggressive expansion to their existing state-of-the-art hydride plant in New Johnsonville, Tenn.
(July 3)
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THOUGHTS ON THE NEWS
Outsourcing Trend Continues
News Analysis
Outsourcing has gotten a bad name recently, since it often means that manufacturing jobs move overseas. Still, it's a business model that makes sense, and the recent example of IC-maker Cirrus Logic selling its test operation to subcontractor ChipPAC demonstrates that the trend is continuing.
(July 3)
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NEW PRODUCT HIGHLIGHTS
EV Group Bonding/Debonding Technology
(July 2)
Cascade Microtech RF Probing Station
(July 2)
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INDUSTRY NEWS TODAY
ASML Maintains Momentum in China with Sale to ASMC; ASMC Selects ASML System for New Facility
VELDHOVEN, THE NETHERLANDS
ASML Holding NV (ASML) today announced booking a multiple product order from Advanced Semiconductor Manufacturing Corporation (ASMC), a wafer foundry in Shanghai, China.
(July 2)
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THE WEEKLY WRAP FROM WAFER NEWS
Nokia handset announcement good news for chipmakers, says market research firm
Cell phone giant Nokia recently announced that it has started commercial shipments of its dual-mode WCDMA/GSM handset, a development that may be a "turning point" for suppliers of handset integrated ICs, says a research firm.
(July 2)
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INDUSTRY NEWS TODAY
Industry Experts to Present at 3-D Packaging Symposium
SAN JOSE, CALIF.
Tessera Inc. today provided further details of the agenda for its upcoming 3D Packaging Symposium, to be held Tuesday, July 15, 2003, at the Fairmont Hotel in San Jose.
(July 1)
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NEW PRODUCT HIGHLIGHTS
Electronic Materials UV/Heat Curable Material
(July 1)
Leica Microsystems Microscopy Platform
(July 1)
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