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Industry News 2003 P3
ChipPAC expects 120% growth in 2004
(December 16, 2003) Fremont, Calif. — ChipPAC Inc., a provider of assembly and test services, announced that it expects continued, significant growth in the stacked-die packaging market share over the next several years. ChipPAC estimates that it already has a 65 percent market share for 3+ stacked-die packages, which shipped in approximately 10 percent of cell phones in 2003.
THOUGHTS ON THE NEWS
Pushing the Envelope
News Analysis by Jeffrey C. Demmin, Advanced Packaging Contributing Editor
Fujitsu recently announced ultrafine pitch flip chip bumping — 35 micron — and the details of the announcement tell us something about the state of advanced packaging these days.
(December 16, 2003)
CMP market to approach $3.3 billion by 2008
(December 15, 2003) Norwalk, Conn.—The global market for chemical mechanical planarization (CMP) and post-CMP equipment, CMP slurries, and CMP pads, conditioners and others consumables is estimated at $1.7 billion in 2003, according to a report from Business Communications Company Inc. This market is expected to approach $3.3 billion by 2008.
Fujitsu technology increases connection density
(December 15, 2003) Tokyo, Japan— Fujitsu Ltd. has developed technology that enables the formation of ultrafine-pitch 35-micron solder bumps, and high-precision flip chip bonding interconnection—increasing connection density approximately 50 times compared to conventional flip chip interconnections.
Price cuts and tech advances driving market adoption of silicon chip fingerprint sensors
(December 15, 2003) Palo Alta, Calif. — Falling silicon fingerprint sensor prices resulting from decreasing sensor sizes and technological advancements in packaging will boost adoption, according to Frost & Sullivan, an international growth consultancy.
BTU achieves ISO 90001:2000 certification
(December 12, 2003) North Billerica, Mass. —
BTU International Inc., a supplier of advanced thermal processing equipment for semiconductor packaging, surface mount and advanced materials processing, has achieved ISO 9001:2000 certification.
X-ray inspection may meet computer chip-making need
(December 11, 2003) Gaithersburg, Md. — A decades-old, x-ray-based method for studying the atomic structure of materials may be the answer to a looming semiconductor industry need—a rugged, high-throughput technology for measuring dimensions of chip circuitry packed with devices approaching molecular proportions.
NEMI's lead-free initiatives attract new members
(December 11, 2003) Herndon, Va. — Attracted by the National Electronics Manufacturing Initiative's lead-free initiatives, Endicott Interconnect Technologies (Endicott, N.Y.), Dell Inc. (Round Rock, Texas), and Senju Comtek Corp. (San Jose, Calif.) have jointed NEMI.
THOUGHTS ON THE NEWS
Separated at Birth
News Analysis by Jeffrey C. Demmin, Advanced Packaging Contributing Editor
I recently reviewed the latest quarterly results for packaging sub-contractors, and while there are certainly differences among them, it is quite striking how similar many of the reports are.
(December 10, 2003)
IEEE's Components, Packaging and Manufacturing Technology Society announces officers for 2004
(December 9, 2003) Piscataway, N.J. — IEEE's Components, Packaging and Manufacturing Technology Society (CPMT) has announced its new officer lineup beginning January 1, 2004.
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