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Industry News 2003 P22
INDUSTRY NEWS TODAY
Suzanne Craven Promoted to Regional Sales Manager for SMT magazine and Advanced Packaging magazine
NASHUA, N.H.
PennWell Corporation announced that Suzanne Craven was promoted to Regional Sales Manager for SMT magazine and Advanced Packaging magazine.
(August 21)
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THOUGHTS ON THE NEWS
ESEC Merges into Unaxis
News Analysis
I was surprised to run across a press release this week about the Swiss back-end equipment company ESEC being merged into Unaxis, its parent company. The ESEC brand will still exist, but the company will be financially and organizationally part of Unaxis Semiconductors.
(August 21)
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NEW PRODUCT HIGHLIGHTS
Kester, Northrop Grumman Corp. Capillary Underfill
(August 20)
GPAX Packaging and Feeding System
(August 20)
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INDUSTRY NEWS TODAY
Toshiba Establishes New Engineering Company To Reinforce Discrete Semiconductor Business
TOKYO, JAPAN
Toshiba Corp. announced that it would establish a new engineering company dedicated to providing advanced engineering support for discrete devices, a major pillar of Toshiba's semiconductor business.
(August 20)
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THE WEEKLY WRAP FROM WAFER NEWS
Japanese equipment numbers on the rise
Based on the latest semiconductor equipment sales figures from the Semiconductor Equipment Association of Japan (SEAJ), that country is poised to lead a strong rebound in the equipment market.
(August 20)
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NEW PRODUCT HIGHLIGHTS
Juki Automation Systems High-speed Mounter
(August 19)
YESTech X-ray Inspection
(August 19)
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INDUSTRY NEWS TODAY
FeinFocus Expands Relationship With APiA
GARBSEN, GERMANY
FeinFocus announces the expansion of their membership with the Advanced Packaging & Interconnect Alliance (APiA).
(August 19)
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THOUGHTS ON THE NEWS
Where the Action Is
News Analysis
It sure seems like the test half of "packaging and test" is much of the news these days in our industry. Many of the developments involve new alliances, which I see as a good sign that test challenges are being addressed seriously these days.
(August 18)
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NEW PRODUCT HIGHLIGHTS
Metcal Array Package Rework
(August 18)
GOEPEL Electronic GmbH Dual-mode System
(August 18)
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INDUSTRY NEWS TODAY
Kulicke & Soffa Announces Large Order
WILLOW GROVE, PA.
Kulicke & Soffa Industries Inc. announced that Global Advanced Packaging Technology Co. Ltd. (GAPT) of Shanghai has placed a blanket order for 140 Maxum Ball Bonders.
(August 18)
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