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Industry News 2003 P1
ChipMos granted NT$2 billion in loans for capacity expansion
(December 31, 2003) Hsinchu, Taiwan—ChipMOS Technologies Inc., an IC packaging and testing company, has signed syndicated loan agreements with five Taiwanese banks worth NT$2 billion to purchase equipment to expand its assembly and testing capacity.
Mobile phone and PC replacement cycles expected to drive recovery in 2004
(December 31, 2003) Framingham, Mass.—As 2003 closes, growth expectations for the semiconductor market are on the rise, particularly after a very strong recovery in the second half of the year. Market research group IDC is forecasting a healthy growth rate of 18 percent in 2004.
Unitive announces expansion plans
(December 31, 2003) Research Triangle Park, N.C.—Unitive has completed its $12.6 million financing to fund a major expansion that will add die-level processing to the company's service offerings for companies in the wafer-level chip scale packaging market.
STATS appoints Eleana Tan Ai Ching to board
(December 31, 2003) Singapore—ST Assembly Test Services Ltd. (STATS), an independent semiconductor test and advanced packaging service provider, has appointed Eleana Tan Ai Ching as alternate director to non-executive director, Tay Siew Choon, effective January 2, 2004. She replaces Gan Chee Yen, who stepped down.
THOUGHTS ON THE NEWS
Cost of Design
News Analysis by Jeffrey C. Demmin, Advanced Packaging Contributing Editor
I was reading the new update to the ITRS, the International Technology Roadmap for Semiconductors, and one interesting tidbit was a discussion on the cost of design.
(December 31, 2003)
Fujitsu, Sumitomo Electric announce joint venture
(December 29, 2003) Tokyo, Japan—Fujitsu Ltd.
and Sumitomo Electric Industries, Ltd. recently announced that they have reached a basic agreement to create a joint venture that will consolidate the operations of Fujitsu Quantum Devices Ltd. with the electronic devices business of Sumitomo Electric's compound semiconductor operations.
STATS, Simmtech form substrate alliance
(December 29, 2003) Singapore—ST Assembly Test Services Ltd. (STATS), an independent semiconductor test and advanced packaging service provider, has announced the formation of a strategic alliance with SimmTech Co. Ltd., a provider of semiconductor substrate material and telecommunications-related printed circuit boards (PCB) for substrate support and technology.
THOUGHTS ON THE NEWS
Sorrow in the Packaging World
News Analysis by Jeffrey C. Demmin, Advanced Packaging Contributing Editor
The semiconductor packaging industry was deeply saddened to learn of the sudden death of Bob Hilton, a true pioneer in our field.
(December 29, 2003)
NSF awards nanotechnology consortium $70 million
(December 23, 2003) Washington, D.C.—The National Science Foundation (NSF) recently designated a 13-member national consortium as the National Nanotechnology Infrastructure Network (NNIN), creating the world's largest and most accessible nanoscale laboratory.
Low-cost, digital displays through ink jet printing?
(December 23, 2003) Palo Alto, Calif.—Convergent technology is one thing, but using your computer's printer to make a new TV screen? Not quite, but close. In a breakthrough for low-cost electronics manufacturing, researchers at Palo Alto Research Center (PARC), a Xerox subsidiary, have successfully created a transistor array of the type used to control a flat-panel display using a modified ink-jet printer and semiconductor "ink."
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