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SEMICON News 2002 P1
Ultratech CEO Arthur W. Zafiropoulo Elected SEMI Chairman
SEMICON WEST, SAN FRANCISCO, July 23 /PRNewswire-FirstCall/ -- Ultratech Stepper, Inc. (Nasdaq: UTEK), a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, today announced that its chairman and CEO, Arthur W. Zafiropoulo, has been elected by the membership of Semiconductor Equipment and Materials International (SEMI) as chairman of the industry association's board of directors for 2002.
Ultratech Unveils First Line of Nanotechnology Lithography Steppers
New NanoTech(TM) Family Builds on Ultratech's Proven Technology Expertise to Provide Highly Flexible, Productive and Cost-Effective Steppers for Emerging Markets
Ultratech Stepper Honored With Safety Award by Workers' Compensation Carrier For Seventh Time
Award Recognizes Ultratech's Commitment to Employee Health and Safety; Ranks Among the Lowest Workers' Compensation Claims in Electronics Industry
TRADE NEWS: Agilent Technologies, ACCRETECH and Cascade Microtech to Provide New Cost-Saving Parametric Test Solution
Companies to Jointly Offer DC/RF Parametric Test Solution to Enable Customers to Reduce Test Time and Improve Yields
IMEC Sets Up New Center of Excellence in Reliability
IMEC's new Reliability Center invites industrial partners and research centers to collaborate in the area of reliability and failure physics on the basis of shared cost, risk and IP.
Universal Reveals New Flip Chip Capabilities
San Jose, California, July 22, 2002 -- Universal Instruments is launching its newest flip chip capabilities at SEMICON West 2002 in San Jose at booth 11627. These new offerings include the ability to process bumped devices directly from wafers using either ink dot recognition or wafer map input.
Amkor and Unitive Form Manufacturing Alliance for Asian Supply Chain
CHANDLER, Ariz. and RESEARCH TRIANGLE PARK, N.C., July 18, 2002 -- Amkor Technology, Inc. (Nasdaq: AMKR) and Unitive, Inc. have expanded their two-year relationship by entering into a strategic manufacturing alliance to collaborate on turn-key manufacturing services using Unitive's wafer level packaging solutions and Amkor's advanced ackaging and test capabilities.
ESEC Introduces Revolutionary Bondhead Technology at Semicon West
Cham/Switzerland, July 18, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, will be presenting a revolutionary technology based on a rotating bondhead, at the world's largest semiconductor trade fair, Semicon West, taking place on July 17-19, 2002, in San Jose, California/USA.
ESEC Introduces 5 µm Die Attach Solution
Cham/Switzerland, July 17, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC's customers and will insure more accurate bonding performance and overall superior results.
Tessera Introduces µZ-Ball Stacked Memory Package for Computing and Portable Electronic Products
Breakthrough Technology Delivers up to Eightfold Increase in Memory Density while Significantly Driving Down Stacked Package Costs
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