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Industry News 2002 P7
NEW PRODUCT HIGHLIGHTS
Custom Packaging Solutions from appli-tec
(November 25)
Semiconductor Wafer Dicing Technology from NanoVia
(November 25)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
ChipPAC Extends Fine Pitch Multi-Row Wire Bond Technology Into High I/O Flip Chip Applications
FREMONT, CALIF.
ChipPAC Inc., one of the world's largest and most diversified providers of semiconductor assembly and test services, has introduced three-row staggered wire bonding technology at 20 micron effective pitch. (November 22) Click here for this and other news briefs.
THE WEEKLY WRAP FROM WAFERNEWS
Looking for Funding? China May Be a Good Place to Set Up Shop
Acquiring VC funding in the post dot com era is nothing short of challenging. However, there are ways to convince investors to part with their cash, and having a manufacturing facility already running in China is a good place to start. (November 21)
NEW PRODUCT HIGHLIGHTS
SPI Metrology Tool
(November 21)
Ceramics from Morgan Advanced Ceramics
(November 21)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
Cookson Electronics Equipment and SigmaPrint Technologies Launch European Field Service and Technical Support Agreement
FRANKLIN, MASS.
PORTLAND, UK
Cookson Electronics Equipment and SigmaPrint Technologies have entered into a service and support agreement for the European market. (November 21) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
And the Award Goes To...
Advanced Packaging and MEPTEC presented the Fourth Annual Microelectronics Packaging Technologist award last week to Al Seiling and Mak Shinohara for their pioneering work in mold compound. One of the criteria for selecting the winners was the pervasiveness of the technology created by the nominees, and it would certainly be a challenge to pick something more widespread that mold compound. (November 20)
NEW PRODUCT HIGHLIGHTS
High-Speed Packages from StratEdge
(November 20)
Stages from Polytec
(November 20)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
NPL Launches Electronics Interconnection Reports on CD
TEDDINGTON, UK
For the first time all the major relevant reports from the National Physical Laboratory (NPL), written over the last six years, have been brought together and condensed onto a single CD. The detailed reports cover a wide range of technical subjects. (November 20) Click here for this and more news briefs.
NEW PRODUCT HIGHLIGHTS
Bond Tester from Dage
(November 19)
Ceramic-on-Metal Technology from Lamina Ceramics
(November 19)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
IMAPS Honors Semi Dice with Corporate Recognition Award
LOS ALAMITOS, CALIF.
Semi Dice Inc. is the 2002 recipient of the International Microelectronics and Packaging Society's (IMAPS) Corporate Recognition Award. (November 19) Click here for this and other news briefs.
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