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Industry News 2002 P60
NEW PRODUCT HIGHLIGHTS
SMD Placement Machines from Fuji America.
(March 7)
Board Printer from Speedline Technologies
(March 7)
Click here for these and more product briefs.
THOUGHTS ON THE NEWS
Wafer Bumping Not For Everyone
Carsem recently announced that it is forming a wafer bumping partnership with Ellipsiz MicroFab, a Singapore-based wafer bumping company. Carsem made a deliberate decision to outsource its wafer bumping, rather than bringing it in-house. This decision is an indicator of the challenges involved in wafer bumping.
INDUSTRY NEWS TODAY
ECTC Conference Program Detailed
SAN DIEGO, CALIF.
The 52nd Electronic Components & Technology Conference, sponsored by the Electronic Components, Assemblies and Materials Association and the IEEE Components, Packaging and Manufacturing Technology Society, will be held May 28-31 in San Diego. Nearly 300 technical papers are planned. (March 5)
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PUZZLE OF THE WEEK
Think Tank Classics: List Price of Goods
One popular section in Advanced Packaging magazine is the Think Tank puzzle page. Every Tuesday, we post a new word problem for you to solve. Are you up to this week's challenge?
Click here for the answer to last week's puzzle and this week's challenge!
NEW PRODUCT HIGHLIGHTS
Precision Assembly Platform from Adept Technology
(March 5)
Wafer Shuttle Stage from Prior Scientific
(March 5)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
New Partnership Development Group Established
SAN JOSE, CALIF.
Olympus Integrated Technologies America Inc., a wholly owned subsidiary of Olympus Optical Co. Ltd. (Tokyo), has formed the Olympus Partnership Development Group (PDG) to enhance the success of partner companies through technology and business alliances. (March 4)
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THOUGHTS ON THE NEWS
Packaging Leads the Semiconductor Industry ... Again
The semiconductor industry is investing a lot of resources in Internet-based integration of the manufacturing flow. The new chairman of RosettaNet, one of the broadest such efforts, is not from Intel or TSMC or Applied Materials, but Amkor.
NEW PRODUCT HIGHLIGHTS
Inspection Technology from Viscom
(March 4)
Adhesives from Ablestik
(March 4)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
PWB Fabrication Product Selection Guide Released
WEST HAVEN, CONN.
Enthone Inc. has released a product selection guide, PWB Fabrication Chemical Processes and Products. The comprehensive guide provides and overview of the company's processes and products used by PWB fabricators, assemblers and OEMs. (March 1)
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THOUGHTS ON THE NEWS
One More Step in Supply Chain Integration
Who else but Tessera would find a new licensing opportunity for its technology? In a recent announcement, electronic manufacturing services (EMS) provider Plexus Corp. will be licensing Tessera's chip-scale packaging (CSP) technology, making it the first EMS company to do so.
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