2008 |
2007 |
2006 |
2005 |
2004 |
2003 |
2002 |
2001 |
2000 |
Web Exclusive Articles
SEMICON News |
Industry News |
Archives Home
Industry News 2002 P42
INDUSTRY NEWS TODAY
ASAT Holdings Ltd. Appoints Rozakis As New CEO
HONG KONG AND FREMONT, CALIF.
ASAT Holdings Limited has appointed Harry R. Rozakis as chief executive officer. (June 4)
Click here for this and more news briefs.
PUZZLE OF THE WEEK
Think Tank Classics: Border Tax
One popular section in Advanced Packaging magazine is the Think Tank puzzle page. Every Tuesday, we post a new word problem for you to solve.
Click here for the answer to last week's puzzle and this week's challenge!
INDUSTRY NEWS TODAY
SEZ Japan Names New President and COO
The SEZ Group has appointed Dr. Masaaki Yashiro, former vice president of TEL (Tokyo Electron Ltd), to president and chief operating officer of SEZ Japan Inc. (June 3)
Click here for this and more news briefs.
NEW PRODUCT HIGHLIGHTS
Fiber Arrays from Radiall Inc.
(June 3)
Simulation Software from Ansoft Corp.
(June 3)
Click here for these and more product briefs.
THOUGHTS ON THE NEWS
Attendance up at ECTC
The 52nd installment of ECTC last week saw significantly larger crowds than last year, which was a pleasant surprise to the organizers of the event. It could easily have been another casualty of the recent industry downturn, but the healthy attendance indicates perhaps that if you only have money for one or two packaging conferences per year, this should be one of them. (June 3)
THE WEEKLY WRAP FROM WAFERNEWS
Biggest China Opportunity May Be for Older Equipment
It may not be the big guys who benefit most from China's expanding semiconductor production. While the top tool companies focus on shipping the latest technology, smaller equipment makers and remarketers of used equipment may actually find a bigger market for their older generation products.
INDUSTRY NEWS TODAY
Tessera and Toshiba Expand Agreement
SAN JOSE, CALIF.
Tessera Technologies Inc. has signed an expanded technology licensing agreement with Toshiba Corp. that enables Tessera to act as the licensor of Toshiba's fine-pitch BGA (FBGA) assembly process for "face-up" chip-scale packages (CSP). (May 31)
Click here for this and more news briefs.
THOUGHTS ON THE NEWS
Conference Season
While we packaging engineers get the big download at ECTC this week and the whole industry gears up for SEMICON West, there have been many other conference announcements recently. Upcoming IPC and IMAPS events in particular caught my eye. (May 30)
INDUSTRY NEWS TODAY
ApiA Seminar Announced
The Advanced Packaging and Interconnect Alliance will host an advanced packaging seminar on July 18 in San Jose. (May 29)
Click here for this and more news briefs.
PUZZLE OF THE WEEK
Think Tank Classics: Employees
One popular section in Advanced Packaging magazine is the Think Tank puzzle page. Every Tuesday, we post a new word problem for you to solve.
Click here for the answer to last week's puzzle and this week's challenge!
PAGE:
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 |
16 |
17 |
18 |
19 |
20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
42 | 43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
51 |
52 |
53 |
54 |
55 |
56 |
57 |
58 |
59 |
60 |
61 |
62 |
63 |
64 |
65 |
66 |
67 |
68 |
69 |
70 |
71 |
72 |
73 |
|
|
|
|
Search Articles
Advanced Search
|
Return to Previous Page
|
Web Exclusives 