2008 |
2007 |
2006 |
2005 |
2004 |
2003 |
2002 |
2001 |
2000 |
Web Exclusive Articles
SEMICON News |
Industry News |
Archives Home
Industry News 2002 P33
THE WEEKLY WRAP FROM WAFERNEWS
APC, Productivity, Fab Yields All Key at Manufacturing Conference
Automatic process control, productivity, shorter cycle times, improved yields, faster fab ramps, and even fab layout were all explored at the IEEE/SEMI Advanced Semiconductor Manufacturing Conference in Boston. (July 18)
NEW PRODUCT HIGHLIGHTS
Flexopresses from Precision Industrial Operation
(July 19)
Master Bond Epoxy Adhesive
(July 19)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
TEL Plans to Begin Deliveries of Next Generation 300mm Process Coater/Developer in January 2004
TOKYO
Tokyo Electron Ltd. is developing the next generation 300mm process coater/developer targeting the 300mm wafer market. (July 19) Click here for this and other news briefs.
NEW PRODUCT HIGHLIGHTS
On-Wafer Solution from Cascade Microtech
(July 17)
X-ray System Upgrade from FeinFocus
(July 17)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
Lumenon Pursues Fully Automated Manufacturing
MONTREAL
Lumenon Innovative Lightwave Technology Inc. and ATS Automation Tooling Systems Inc. have initiated beta testing of the ATS Flexsys 2000 automated Planar Lightwave Circuit Tester (PLCT). (July 16) Click here for these and other news briefs.
NEW PRODUCT HIGHLIGHTS
Phoenix Contact Mini Spring Cage Blocks
(July 16)
White Electronic Multi-chip Package
(July 16)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
Xsil Wins European Semiconductor Wacker/Siltronic Prize for Best New Company
DUBLIN
Xsil Ltd., a provider of innovative laser micromachining systems for high volume manufacturing, was awarded with this year's annual European Semiconductor Wacker/Siltronic prize for Best New Company. (July 15) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
Off to the Races
This week I say goodbye to family and friends and begin the annual campaign through the show floor at SEMICON West. My schedule tells me that I have 42 appointments at the moment, and if I survive, I will tell you what I have learned. If you don't hear from me again, don't send anyone in after me.
INDUSTRY NEWS TODAY
SECAP Hosts Wafer-Level Packaging Seminar 2002 at SEMICON West
MUNICH, GERMANY
The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) is holding a seminar at SEMICON West on Tuesday, July 23, aimed at providing the industry with a comprehensive overview on wafer-level packaging with a special focus on practical aspects of process technology. (July 12) Click here for this and other news briefs.
NEW PRODUCT HIGHLIGHTS
Micromanipulator RF/Microwave Manipulator
(July 12)
phoenix|x-ray X-ray System Option
(July 12)
Click here for these and more product briefs.
PAGE:
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 |
16 |
17 |
18 |
19 |
20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 | 34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
42 |
43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
51 |
52 |
53 |
54 |
55 |
56 |
57 |
58 |
59 |
60 |
61 |
62 |
63 |
64 |
65 |
66 |
67 |
68 |
69 |
70 |
71 |
72 |
73 |
|
|
|
|
Search Articles
Advanced Search
|
Return to Previous Page
|
Web Exclusives 