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Industry News 2002 P29
INDUSTRY NEWS TODAY
TEL Plans to Begin Deliveries of Next Generation 300mm Process Coater/Developer in January 2004
TOKYO
Tokyo Electron Ltd. has developed the next generation 300mm process coater/developer targeting the 300mm wafer market. (August 8) Click here for this and other news briefs.
THE WEEKLY WRAP FROM WAFERNEWS
New Tech Centers Add More than Just Square Footage
As more tool companies open new technology centers in the US, analysts are pointing to yield enhancement and working closely with customers as underlying reasons for the trend. (August 8)
THOUGHTS ON THE NEWS
One Last Thing About SEMICON West
My last meeting at SEMICON turned out to be one of the best -- even without that appetizer and drink at Il Fornaio across the street. I had the chance to meet with the CEO of Ziptronix, a North Carolina start-up with one of the most intriguing technologies around. They have a wafer bonding process that opens many doors. (August 7)
INDUSTRY NEWS TODAY
Shadow Moire Testing Forms Solid Foundation in Pacific Rim
ATLANTA
AkroMetrix and its exclusive agent for Japan, Cermatronics Boeki Co. Ltd., have received a growing list of confirming orders for the TherMoire(r) in-process warpage analysis system. (August 7) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
New Package / Chip Integration Scheme
One of the slickest things I saw at SEMICON West was a stacked chip technology from Fujitsu that included 25 micron thick chips. The chips are so thin that they were electrically connected with deposited dielectric and interconnect layers, instead of wire bonds or some complicated bumping scheme. (August 5)
INDUSTRY NEWS TODAY
OMM, Lightwave Systems to Develop Wavelength Management and Switching Modules
SAN DIEGO
OMM Inc. and Lightwave Microsystems Corp. have formed an agreement to develop a new generation of wavelength management and switching products based on micro-electromechanical systems (MEMS) and planar lightwave circuits (PLCs). (August 5) Click here for this and other news briefs.
NEW PRODUCT HIGHLIGHTS
Thick Film Capability from Remtec
(August 5)
I&J Fisnar Autocan System
(August 5)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
Henkel Loctite Adds Seminar on Lead-free Solder Technology
INDUSTRY, CALIF.
Henkel Loctite Corp. has announced the latest in its a series of technical seminars on "Understanding Lead Free Solder." (August 2) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
Packaging Squeezed Out?
At the Gartner Dataquest breakfast at SEMICON West, Jim Walker proposed an interesting scenario in which the packaging function gets divided up by wafer fabs and contract manufacturers. (August 2)
THE WEEKLY WRAP FROM WAFERNEWS
The HARI Side of Defect Inspection
Among the 2001 ITRS grand challenges for yield enhancement, detecting defects associated with high aspect ratio trenches, contacts, and vias continues to be difficult and complicated by simultaneous needs for high sensitivity and high throughput with cost effective detection tools. (August 1)
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