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Industry News 2002 P24



NEW PRODUCT HIGHLIGHTS
International Rectifier Schottky Diodes
(August 29)

Dispensing System from DL Technology
(August 29)
Click here for these and more product briefs.


WEB EXCLUSIVE BRIEF
S.E.C. Leverages Manufacturing Program MOORPARK, CALIF. Semiconductor Equipment Corp. (S.E.C.) has been working with the California Manufacturing Technology Center (CMTC) to implement improved manufacturing processes for its product offering of die bonders, pick-and-place systems, rework stations, wafer/frame tape applicators, and die ejector systems. (August 27)

THOUGHTS ON THE NEWS
Packaging Saves Photonics It would have been easy to skip over yet another press release discussing "cost reduction plans and reorganization," but I'm glad that I fought my way through one that came out last week. In this one, a fiber optic/photonics organization is being merged in with a packaging group. Who would have predicted this reversal from one to two years ago? (August 30)

INDUSTRY NEWS TODAY
Autosplice Provides Complete Engineering Solutions for Integrating Nitinol 'Muscle Wire' Actuators SAN DIEGO Autosplice has become a leading innovator in the design and assembly of "muscle wire" applications using nickel titanium (nitinol) materials that can be effectively used as alternatives to conventional solenoid assemblies. (August 30) Click here for this and other news briefs.

THOUGHTS ON THE NEWS
Wafer-level Update from MEPTEC The latest MEPTEC conference gave a very thorough update on where things stand in the world of wafer-level packaging. We all know the basic story of the efficiencies associated with creating the "package" on a wafer rather than with singulated chips, but this conference had some of the real specifics about how it will work -- and how it is already working. (August 28)

INDUSTRY NEWS TODAY
AIM Signs Exclusive North American Representative Agreement with Umicore for Ceramic ITO Sputtering Targets CRANSTON, R.I. AIM Inc. has signed an exclusive representative agreement with Umicore Indium Products. (August 28) Click here for this and other news briefs.

THOUGHTS ON THE NEWS
'Deskilling' X-ray Inspection at Dage The last work-related stop on my vacation in England was a visit to Dage Precision Industries in Aylesbury. Dage recently expanded its scope to include X-ray inspection equipment, and its new approach includes "deskilling" the process so that nearly anyone can run it. A demonstration of the ease and speed of the system was impressive. (August 26)

INDUSTRY NEWS TODAY
Hans Wunderl New Chief Executive Officer of ESEC CHAM, SWITZERLAND The Board of Directors of ESEC has appointed Hans Wunderl as chief executive officer as of October 1. (August 26) Click here for this and other news briefs.

THOUGHTS ON THE NEWS
Finally, the Next Killer App That Will Drive the Recovery It took two weeks of brain-cleansing vacation, but it finally became clear to me what will drive the long-awaited recovery in the high-tech industries -- closed circuit television systems. During my vacation in England, I noticed many more CCTV systems than exist in the U.S., and a high-profile abduction there emphasized the benefits. (August 23)

THE WEEKLY WRAP FROM WAFERNEWS
Next Outsourcing Step? Process Integration Companies Woo Fabless Customers Traditional outsourcing has fabless companies designing chips then throwing the designs over the wall to foundries for manufacturing. That worked fairly well until design rules shrunk below 0.18-micron while 300mm wafers and new materials like copper emerged, multiplying the chances that something will go wrong at the foundry. (August 22)

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