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Industry News 2002 P20
NEW PRODUCT HIGHLIGHTS
Transene Electronics Cleaning Materials
(September 18)
CAD Library from Dorner
(September 18)
Click here for these and more product briefs.
THOUGHTS ON THE NEWS
Good Career Move!
NEMI recently announced that it is sponsoring a workshop on the emerging critical area of "product take-back and recycling."(September 20)
INDUSTRY NEWS TODAY
Pac Tech USA to Complete Wafer Bumping Services Facility by November
SANTA CLARA, CALIF.
Pac Tech USA, a wholly owned subsidiary of Pac Tech GmbH, has begun construction of its new 2,000 sq. ft. wafer bumping and solder stencil printing production facility. (September 23) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
MEMS Synergy
Some bright people made an interesting deal in the MEMS arena recently. RF MEMS switch maker Teravicta signed up recording head manufacturer Read-Rite to be its partner for high-volume production of its parts. The term "win-win" is overused, but this is a great example of a small company identifying a good resource for its production ramp, as well as a larger company finding a way of broadening its scope. (September 13)
INDUSTRY NEWS TODAY
LIGHTCONNECT Attracts $9 Million Backing
NEWARK, CALIF.
LIGHTCONNECT, a leading global supplier of dynamic components and modules for optical networks, has raised $9 million in its third round of financing, led by Sevin Rosen Funds. (September 16) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
Substrates Prominent at IMAPS
It was hard to miss the focus on substrate materials at the IMAPS symposium last week in Denver. The Ceramic Interconnect Initiative wasn't the only game in town, with several suppliers discussing organic substrates that are pushing the envelope too. (September 11)
NEW PRODUCT HIGHLIGHTS
MARKEM Laser Marking System
(September 11)
Diamond Heat Spreaders from Morgan Advanced Ceramics
(September 11)
Click here for these and more product briefs.
THE WEEKLY WRAP FROM WAFERNEWS
Outsourcing Key to Quick Ramp for Electroglas
Wafer probe/inspection company Electroglas Inc. handled the last upturn in stride, and has made some strategic moves this time around to meet the next ramp even quicker, including a big manufacturing move into Asia, developing tools for outsourcing, and sharing key forecast information with suppliers. (September 12)
NEW PRODUCT HIGHLIGHTS
Bump Stepper from Ultratech Stepper
(September 12)
Asymtek Pump
(September 12)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
Entegris Selects Patrick McKinney to Head Semiconductor Market Segment
CHASKA, MINN.
Entegris Inc., the materials integrity management company, has appointed former Amkor Technology senior vice president Patrick McKinney to the position of president of Entegris' semiconductor market segment. (September 11) Click here for this and other news briefs.
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