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Industry News 2002 P18
NEW PRODUCT HIGHLIGHTS
Flex Circuit Design Guide from Samtec
(October 1)
DC/DC Converter Catalog from DATEL
(October 1)
Click here for these and more product briefs.
INDUSTRY NEWS TODAY
'Top 10 Developments' in Ceramic Interconnect Technology' Announced at IMAPS 2002
WASHINGTON, D.C.
The latest advances and challenges -- "The Top Ten Developments in Ceramic Interconnect Technology" -- were recognized at a recent press event hosted by the CII at IMAPS 2002, The 35th International Symposium on Microelectronics in Denver, Colo. (October 1) Click here for this and other news briefs.
THOUGHTS ON THE NEWS
Software in the Packaging World
An upcoming editorial in Advanced Packaging magazine congratulates the packaging industry for several signs of new-found maturity, but we ran out of space to discuss some of the interesting related things happening on the software front. Cimetrix and Kinesys, for example, are making strides in dragging packaging toward the capabilities found in the front end of the industry. (September 30)
INDUSTRY NEWS TODAY
Endevco Signs Cooperative Research and Development Agreement with Sandia National Laboratories
SAN JUAN CAPISTRANO, CALIF.
Endevco Corp has signed a cooperative research and development agreement (CRADA) with Sandia National Laboratories. (September 30) Click here for this and other news briefs.
NEW PRODUCT HIGHLIGHTS
Epoxy System from Master Bond
(September 30)
Denver Semiconductor Equipment Flip Chip Bonder
(September 30)
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THE WEEKLY WRAP FROM WAFERNEWS
What Toll Will Accounting Crisis Take on Capital Equipment Industry?
Enron. WorldCom. Arthur Anderson. The list of companies dragged in by accounting scandals seems to grow weekly, but executives in the chip gear and materials industry generally indicated that this sector was more grounded in reality, and less likely to be caught in the frenzy. (September 26)
NEW PRODUCT HIGHLIGHTS
Marking System from GSI Lumonics
(September 26)
Creative Materials Conductive Ink and Coating
(September 26)
Click here for these and more product briefs.
THE WEEKLY WRAP FROM WAFERNEWS
IEMT Keynote: Chip Industry Leads Early Push to Integrate Photonics-Electronics
The semiconductor industry, not the optics world, is leading the early development of integrated optical and electronic circuits, according to Richard Dasher, director of the US-Asia Technology Management Center and the Center for Industry Studies at Stanford's school of engineering, and keynote speaker at the IEMT Symposium at SEMICON West. (September 19)
NEW PRODUCT HIGHLIGHTS
MARKEM Automated Tray Handling System
(September 19)
Leica Stereomicroscope
(September 19)
Click here for these and more product briefs.
THOUGHTS ON THE NEWS
Good Career Move!
NEMI recently announced that it is sponsoring a workshop on the emerging critical area of "product take-back and recycling."(September 20)
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