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(July 25, 2008) IRVINE, CA — Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel has announced its executive team to take the company forward. Under the direction of Alan Syzdek, corporate senior V.P. the electronics group of Henkel will be organized on a global basis by industry sector. The intention is to offer local support and flexibility within each region to afford operational and supply chain efficiencies while providing visibility of customers' global requirements. The new leadership at Henkel reportedly draws on the talents of both the Henkel and National Starch teams.
Michael Todd, Ph.D., will lead Henkel's global product development initiatives as V.P. of product development and engineering. Todd's near-term priorities are said to include aligning the organization's 13 global product development sites, the integration of the complimentary technologies and products brought together through the acquisition, and leveraging the strengths of certain materials to facilitate the widespread growth of synergistic product lines.
Todd said the company has committed significant investment increases for advanced materials development in the areas of new polymer technologies, applied nano-technology research, and manufacturing and process innovations. "With many acquisitions you see a tightening of the belt in this area but, with Henkel, quite the opposite is true," he said.
"This enables our ability to anticipate technology requirements well into the future and develop materials solutions today."
Former Ablestik general manager, Andreas Mader, has been tapped to head Henkel's semiconductor group where he will focus on supporting customers' transition to new technologies. Having spent over 20 years of his career working with specialty materials at Dow and National Starch, Mader brings perspective to his position and is said to be enthusiastic about the accelerated solution capabilities of the new organization.
For semiconductor packaging, Mader says he envisions several breakthrough materials advances which include further developments and more widespread adoption of film die attach materials as well as enhanced capabilities of the company's Wafer Backside Coating (WBC) materials technology.
To direct its electronics assembly business, Henkel has selected former Emerson & Cuming general manager, Joe DeBiase, who has over 20 years of experience in electronic materials for the PCB fabrication and electronic assembly industries. The integration of two very broad product portfolios is intended to deliver front-to-back solutions in assembly materials requirements.
Rounding out the customer-facing executive appointments is Doug Dixon, global marketing director. "One of the most exciting, yet most challenging parts of this new organization is prioritizing brand and product rollout initiatives," says Dixon.
Michael Reilly, Ph.D., former National Starch VP of global operations will handle management of the operational organization, and ZhiWei Cai, former Henkel global V.P. of product management, will oversee the development the business through organic growth, strategic partnerships and acquisition opportunities.
Other key appointments to the leadership team include Luc Godefroid, who heads up the project management office (PMO), with responsibility for developing and integrating the business and driving offensive synergies through best practices of both the Henkel and National Starch operations; and, Ms. Hilary Norris, who leads the company's financial team.
"I have every confidence that this dedicated team will lead our organization with experience, integrity, ingenuity and passion while maintaining the customer as our top priority," said Syzdek.
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