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(June 30, 2008) FLANDERS, NJ — Rudolph Technologies, Inc. has received a follow-on order from Micronas for both an an NSX Inspection System and Discover in-line defect analysis and data management software. The purchase will reportedly allow Micronas — supplier of integrated circuits (ICs) and sensor system solutions for consumer and automotive electronics — to provide additional inspection capacity demanded by the 100% inspection requirements of Micronas' customers in the automotive market.
The NSX 115 joins an existing NSX 105 system in Micronas' Freiburg, Germany-based fab. Discover software will link the systems to provide intelligent sampling strategies and identification of actionable events and trends. "This purchase was driven by rapid growth in demand for our automotive products," staid Nikolaus-Viktor Kaeppeler, V. P. operations at Micronas. "High quality is a no-compromise area for our customers, as well as for us."
According to Martin Molan, GM of Rudolph's European business, Discover software has demonstrated overall throughput enhancement of over 20% for the inspection and review step necessary to achieve zero defects. Macro defects (defects 0.5 —m and larger) can be created during wafer manufacturing, probing, bumping, dicing, or general handling, and can have a major impact on the performance and quality of a microelectronic device. The NSX system reportedly detects yield-inhibiting defects, ensuring product quality and providing valuable process information.
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