Advanced Packaging Online Article |  | |
Yield improvement and test processing speed are major issues for high-volume manufacturers of LCD driver ICs. The M7522 dynamic test handler from Advantest Corp. was developed to addresses such issues. It offers processing speed and positioning accuracy for fine-pitch tape automated bonding (TAB) and chip-on-film (COF) package devices used in liquid crystal display (LCD) panel ICs.
The M7522's newly-developed feed mechanism incorporates a high-performance servo motor, enabling 0.7-second index time for tape and film mounted package devices. The unit's optical lens, which works to recognize the position of the device and the test probe, is reportedly twice as powerful as that of Advantest's earlier model, offering a positioning accuracy of +/-3um.
It supports fine-pitch driver ICs necessary for increasingly high definition LCDs, thus contributing to great improvements yield. Precision contact eliminates need for test pads. Contact between the device and the test probe is currently achieved through the use of test pads on the tape of the device. Once testing is complete, these test pads are removed. Automated needle alignment facilitates operation, and automated device and test probe positioning capabilities afford greater precision and eliminate the problems associated with manual operation. Advantest Corp Tokyo www.advantest.com
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