Masthead Corporate Logo
Subscribe eNewsletter Magazines

Advanced Packaging Online Article

Click here to enlarge image
Stencil cleaner results.

| Add RSS Feed

Stencil Cleaner and Ultrasonic Immersion Cleaner

Kyzen introduces AQUANOX A4241 stencil cleaner, and AQUANOX A4651US for use in ultrasonic immersion cleaners. Both products provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring; are non-hazardous, biodegradable aqueous solution free of CFCs and HAPs; are multi-metal safe; and have been proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.

AQUANOX A4241 inhibition technology was reportedly designed to be effective on tough soils while protecting sensitive parts from etch or darkening. Suited to a multi-process environment, this aqueous cleaning solution can be used in spray batch, spray in-line, and stencil cleaning processes.

AQUANOX A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. It is suitable for use on all of the latest flux formulations. Kyzen Corp. Nashville, TN www.kyzen.com Stand 7-340


Click here to enlarge image
Ultrasonic immersion cleaner results



| Add RSS Feed


 
Return to Previous Page

 
Webcasts




Trends in Wafer Bonding for MEMS and 3D Integration
September 18, 2008








Building Blocks and Roadmaps for 3D Integration
Original broadcast on
June 26, 2008






Advances in 3D Packaging: Focus on Lithography
Original broadcast on
April 30, 2008



More

Sponsored White Papers Library
Recently Added White Papers

We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008, Henkel Corporation)

Die Attach Film Technologies for Next-Generation Devices (03/04/2008, Henkel Corporation)

More
Featured White Papers

We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008)
 

More