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The XF3 lead-free solder paste from Balver Zinn was reportedly developed to accommodate extended reflow profiles without the use of nitrogen. It completes the family of Cobar products based on Nihon Superior's patented SN100C-alloy.
SN100C has demonstrated long-term fatigue strength over silver-containing SAC-alloys. Being completely free of silver, SN100C is a remedy against Cu-migration into the Sn regions of the solder joint. With XF3, wetting on all common metal surfaces yields shiny joints reminiscent of leaded solders. It exhibits a robust printing window, printing at 150-200 mm per second. SN100C-XF3 is said to eliminate voiding better than SAC-alloys.
Balver Zinn offers a coherent system of SN100C soldering materials, ranging from solder bars to cored solder wire, compatible fluxes, and solder paste. Balver Zinn Balve, Germany www.balverzinn.com Stand 9-524
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