Masthead Corporate Logo
Subscribe eNewsletter Magazines

Advanced Packaging Online Article

| Add RSS Feed

EoPlex to Manufacture Innovative Cell Phone Antennas

(May 15, 2008) Redwood City, CAEoPlex Technologies disclosed $4M additional funding to build its first full-scale production plant for the manufacture of state-of-the-art cell phone antennas. The company had previously announced its Series C funding of $8M in 2007. That round was lead by ATA Ventures with the backing of all current investors, including Draper Fisher Jurvetson, Labrador Ventures and Draper-Richards. The current increase brings the total for the C-round to $12M.

"As cell phones continue to expand in services, yet shrink in size, the demand has increased for small, integrated antennas." explained Arthur L. Chait, EoPlex CEO. "The industry has been shifting from metal antennas to complex ceramic-metal antennas where the dielectric properties of the ceramic provide better performance in a smaller package."

Manufacturing these antennas requires the ability to combine complex ceramic and metal structures in a tiny, monolithic part, and to create features such as buried conductors, voids, and different dielectric materials in separate parts of the structure. This must be done at low cost. "All of these requirements are a perfect match for the EoPlex process," continued Chait. "We see the opportunity to supply the cell phone industry with the capability to manufacture small and very unique designs at low cost and high volume. Our board wanted to move quickly on this opportunity and, therefore, the decision was made to increase the C-round."

EoPlex is building the new facility in the space adjacent to its present location in Redwood City. Construction has already begun and the new facility is expected to be ISO9001 certified and in production by Q4 of this year.





| Add RSS Feed


 
Return to Previous Page

 
Webcasts






Building Blocks and Roadmaps for 3D Integration
Original broadcast on
June 26, 2008






Advances in 3D Packaging: Focus on Lithography
Original broadcast on
April 30, 2008








Sockets that Meet Today's Needs
Original broadcast on
March 25, 2008



More

Sponsored White Papers Library
Recently Added White Papers

We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008, Henkel Corporation)

Die Attach Film Technologies for Next-Generation Devices (03/04/2008, Henkel Corporation)

More
Featured White Papers

We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008)
 

More