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(May 13, 2008) SINGAPORE — STATS ChipPAC Ltd. announced the completion of full internal qualification of its Fan-in Package-on-Package (FiPoP) technology. Fully functional electrical samples are available, and production volumes are expected to ramp by the end of 2008.
"STATS ChipPAC has internally qualified both top and bottom packages in various body sizes. This qualification opens the door for a multitude of package configurations and provides semiconductor companies a flexible solution to meet their integration and miniaturization demands much sooner and at a lower overall cost," said Han Byung Joon, Ph.D., Executive VP and CTO, STATS ChipPAC.
FiPoP technology addresses the industry demand for smaller, thinner package stacks with increased device integration for advanced mobile phone and handheld applications by allowing multiple logic, analog, and memory die to be integrated in the bottom PoP package, while accommodating larger die sizes in a reduced footprint. In conventional PoP designs, the top package must be the same size as the bottom package to interconnect them during the board level reflow process. This approach presents physical limitations in the reduction of the overall package size and height while maintaining acceptable surface mount yields and reliability levels.
The key to the FiPoP design is an exposed array of land pads on the top center surface of the package instead of a peripheral array around the top of the bottom package substrate. This allows the top and bottom packages to be different sizes, for greater flexibility in stacking thinner, smaller memory packages on top. In addition, the FiPoP structure reportedly reduces package warpage and related board mount issues, as well as enabling ball interconnect down to 0.4mm pitch between the top and bottom package; and high package-to-package interconnect pincount.
The inherent design of FiPoP reportedly provides a more balanced structure that achieves high final assembly yields, meets rigorous package level reliability requirements and performs well above JEDEC board level reliability requirements for mobile phone and handheld applications. FiPoP was the 2007 recipient of the Advanced Packaging Award for 3D packaging.
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