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(May 12, 2008) San Jose, CA — Avago Technologies, supplier of analog interface components for communications, industrial, and consumer applications; announced what it believes to be a breakthrough in packaging technology that it says will provide a new level of design flexibility. Called WaferCap CSP, it is reportedly the industry's first semiconductor-based chip scale packaging (CSP) technology.
With potential to reach the 100 GHz frequency range for SMT packaging, WaferCap CSP has the same dimensions as an 0402 component and can reportedly reduce the amount of PCB space an RF device occupies by over 50% to reduce the thickness of any assembly.
Avago's technology allows high frequency devices to be batch-packaged cost-effectively using standard semiconductor processing techniques. The air cavity created under the lid and immediately above the circuit makes it possible to achieve higher frequency ranges. The use of vias removes the need for bond wires. Additionally, direct contact between the package substrate and the RF MMIC improves RF performance because it reduces the RF signal path and provides less resistance when compared to typical SMT designs. It also improves the heat transfer from the device to the assembly by removing the intervening package.
The elimination of wire bonds in the packaging process gives the device the flexibility and simplicity to fit in a variety of positions in a wide range of RF architectures.
No special tooling is required as assembly is done with standard SMT techniques. The devices can be directly soldered onto a board using standard soldering techniques. Traditional mass-production pick-and-place or chip shooter machines can easily place a WaferCap packaged device onto any RF architecture.
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