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(May 5, 2008) Cham, Switzerland and Singapore — Oerlikon Esec, provider of automated chip assembly equipment and system solutions for the semiconductor industry, formally introduced the introductory platform of an entirely new product family at an official unveiling during SEMICON Singapore. The Die Bonder 2100 xP targets the high-volume epoxy die attach market.
Kurt Trippacher, Head of Oerlikon Esec and Segment CEO, who spoke at the ceremony, said the first machines are producing in high volumes at customer locations in Europe and in Asia.
According to the company, there are three significant developments incorporated into this platform. First, a pick-and-place feature combines pivoting and linear movements for minimal distances between pick and place positions. Designed for highest stiffness and speed, and in conjunction with vibration control the pick and place reportedly achieves an average dry cycle time of only 167 ms and placement accuracy of 20 µm (3 sigma) under high volume process conditions. A strip handler automatically adjusts its four independent clamps according to substrate requirements. Process plates are self-centered and exchangeable without any tools, while a wafer expansion unit exchange is accomplished in less than one minute. Corresponding software parameters are loaded automatically and feature fully guided set-up procedures. Complete recipe transfer is enabled by advanced set-up and calibration techniques.
Reportedly unique to this tool is an advanced human-machine interface that is said to support the operators, technicians and engineers during all stages of the manufacturing process. Full access to all production related real-time data, including vision, wafer mapping and a strip viewer for different process stations is provided by the interface. The real-time strip viewer enables the operator to verify the production status of every single bond position during production. In addition to the three live images from the pick, bond, and dispense vision systems, a fourth user configurable image (such as post- or pre-bond inspection) can provide a total production overview at a glance. Real-time digital zoom for close up inspection further facilitates quality control – another key element for highest production yield and throughput.
This flexible 300- mm platform is said to be capable of producing the full range of epoxy-based die-attach applications. A new model is expected to be added for processing the most advanced stacked-die applications. Equipped with an optional third process station, this die bonder generation is easily adapted to future leading-edge applications.
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