Advanced Packaging Online Article |  | |
Hysol FF6000, from the electronics group at Henkel, is a reflow curable material formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. Unlike traditional capillary underfill processes, this material enables an in-line alternative that affords thorough device protection as well.
With the epoxy flux process, bottom side spheres are dipped into Hysol FF6000 prior to component placement. The device is placed onto the PCB or substrate and then travels through reflow, during which the flux provides the action necessary for solder joint formation and the epoxy encapsulates each solder sphere. This streamlined approach effectively eliminates the need for dispensing equipment and the time required for underfill application and cure.
Though relevant for a varity of applications, Hysol FF6000 is particularly suited for package-on-package (PoP) device configurations and/or very large BGAs and CSPs where traditional underfill processes may be problematic. the electronics group at Henkel, Irvine CA www.henkel.com/electronics.
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