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(May 1, 2008) Bannockburn, IL. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta. Hosted by Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies, led by speakers from JIC and the industry.
Topics include environment-friendly manufacturing, 3D integration, interposer substrates, and standards activities. Attendees should expect a comprehensive presentation of integrated electronics development and manufacturing, in addition to insight on interconnect technologies that will impact the electronics industry over the next 10 years.
Seven sessions, moderated by experts in interconnection technologies, will comprise the two-day event. Session topics include an overview of the major areas of the total package solution; the total package solution by Jisso level; reliability and quality; thermal management solutions: energy conservation and generation; nano-materials; printed and embedded electronics; and system-in-package (SiP), through-silicon vias (TSVs), and 3D packaging.
The seminar represents a total view of interconnection, assembly, packaging, mounting, and system design for advanced and future technologies, said Jean Hebeisen, IPC director of professional development.
For more information on this seminar or to register, visit www.ipc.org/JF0508
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