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(May 7, 2008) Burlingame, CA — When the IEEE International Interconnect Technology Conference convenes at the Hyatt Regency San Francisco Airport Hotel, Burlingame, CA, June 1-4, the focus will be squarely on 3D technologies. Attendees will have the opportunity to gain both fundamental knowledge and practical manufacturing advice from 3D experts at chip companies and universities from around the world.
Many invited and submitted papers will directly address different approaches and challenges involved with manufacturing through-silicon vias (TSVs) and other 3D-related structures. Monday's session will be dedicated to 3D, as well as the Short Course preceding IITC on Sunday, June 1. Meanwhile, other papers throughout the course of the conference will address various 3D issues as they touch on other important interconnect topics.
Presentations will address numerous 3D developments, ranging from an overview of a production-worthy 3D TSV interconnect technology at TSMC, to more nuts-and-bolts work on how IMEC is using microspectroscopy to realistically model TSVs; from TSVs for extremely miniaturized integrated wireless sensor networks at the Fraunhofer Institute, to Freescale's copper/tin alloy interconnects that form simultaneously as an adhesive bond in a die-to-wafer attach process; and from self-assembled 3D integration at NEC to Georgia Tech's integrated microfluidic cooling channels for stacked chips.
These are just a few illustrative examples. The Short Course 3D module will review features and options for different 3D technologies, as well as the design/technology gaps and opportunities associated with emerging 3D technologies.
Avoiding the Need to Shrink Transistors
"Three-dimensional interconnect architectures may represent one way we can achieve the performance and circuit-density advantages of scaling without actually having to shrink transistors," said Dr. Michael Shapiro, IITC 2008 Publicity Chair and Senior Technical Staff Member/Chief Engineer for 3D Development at IBM. "We have had 3D papers at IITC previously, but they were scattered throughout the program. This year, we will have an entire session devoted to 3D, along with two invited speakers addressing important aspects of the topic."
"Besides the 3D area, IITC 2008 will offer presentations that hone into the details of all individual unit processes associated with interconnect technology. For example, instead of a presentation offering an overview of how copper lines are integrated into a wiring structure, a presentation might actually describe the copper plating process. This level of detail will provide IITC attendees with the knowledge they need to advance the state-of-the-art in interconnect," Shapiro said.
Presentations at IITC 2008 will include the following topics:
3D Processes and Integration
Materials and Unit Processes
Process Modeling
Reliability
Process Integration
Interconnect Systems
System-in-a-Package
System-on-a-Chip
Novel Materials and Concepts
IITC Began with Copper Technology
The IITC conference began in response to IBM's stunning announcement in September, 1997 not only that it had developed a fully integrated copper interconnection system to increase the performance of advanced chips, but that it soon would begin full-scale manufacturing. Motorola and Texas Instruments soon followed with their own copper announcements, and TI also said it was working on new "low-k" insulators to go along with the copper lines.
These announcements sparked feverish R&D activity by chip-makers all over the world, and the following year the IITC was established as a forum to discuss and disseminate the fruits of that R&D work, and as a place where leading suppliers could exhibit their products and services.
Until now, the conference has been held in Burlingame each year, but true to the word "International" in its name, in 2009 IITC will begin rotating annually among locations in Asia, Europe and the U.S. IITC 2009
While the IITC conference has featured presentations on 3D in the past, they will assume a larger and more prominent role beginning this year. Entering its second decade, the IITC is reportedly changing focus to better align its technical program with the evolving interconnect needs of the semiconductor and photonics industries.
IITC 2008 will offer three days of technical presentations by the experts on interconnections within and among computer chips and their packaging. Each year, approximately 600 professionals involved with semiconductor processing, photonics, advanced materials, equipment development, interconnect systems and packaging gather at IITC to present, discuss, and debate new interconnect science and technology through oral and poster presentations, exhibits and supplier seminars.
For registration and other information, interested persons should visit the IITC 2008 home page at www.ieee.org/conference/iitc.
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