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(April 29, 2008) San Jose, CA — – Tessera Technologies and Nemotek S.A. announced that Nemotek has licensed Tessera's SHELLCASE MVP wafer-level chip-scale packaging (WLCSP). SHELLCASE MVP is the latest member of Tessera's image sensor CSP family, and is reportedly the industry's first to implement through silicon via (TSV) processes. Nemotek, based in Rabat, Morocco, provides a broad range of wafer-level packaging and consumer optics solutions. It was also the first licensee of OptiML, Tessera's wafer level camera technology.
"We are making the transition from traditional packaging technology to the latest TSV wafer-level packaging technology possible by offering high-volume capabilities to image sensor makers around the world," said Youssef Benmokhtar, director of marketing and business development, Nemotek. He added that production ramp is expected to start in the first quarter of 2009.
SHELLCASE MVP reportedly addresses market demand for more advanced technologies in image sensor packaging, including a thinner package, higher yield, enhanced reliability and lower cost. It provides manufacturers with the ability to develop thinner, more sophisticated consumer devices faster at a lower overall cost; it also complies with JEDEC Level 1 requirements, making it suitable for harsher applications such as automotive.The SHELLCASE MVP solution also enables manufacturers to utilize image sensor wafers without requiring any chip design modification.
The SHELLCASE MVP solution, which Tessera announced on March 18, 2008, will enable Nemotek to provide original equipment manufacturers (OEMs) and camera module manufacturers with the ability to build smaller, thinner and more sophisticated consumer devices, such as camera phones, digital cameras, PDAs and laptops.
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