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ASM Pacific Technology's latest generation large-area chip bonder, the MCM12, is said to address the growing market for MCM, SIP, and hybrid applications. It is a fully automatic multiple die, SMD, and flip chip bonding system with up to 300-mm wafer handling capability. Direct die, flip chip, stack die, and SMD bonding can all be integrated into this single platform tool.
The flexible MCM12 can reportedly handle a range of die sizes and presentation modes. It features a fully programmable dispensing system, and automatic pick-up and ejector tool changing systems. The bondhead achieves up to 800g force and is programmable to automatically change up to 14 different pick up tools. The linear motor driven, gantry-style platform delivers high accuracy and throughput. In flip chip operation, the machine is capable of +/- 10 µm accuracy.
The MCM12 material handling system addresses leadframe and substrate sizes up to 200 mm × 300 mm in stand-alone and SMEMA configurations. Workholder conversion is simplified by motorized tracks with dedicated vacuum anvil blocks.
For die presentation, the MCM12 can accommodate sawn wafers up to 300-mm diameter on film frames, sawn wafers on rings, and waffle packs. In addition, up to 5 types of passive components in tape and reel format can be accommodated on the optional front loading SMD handling module.
The three-in-one operation linear motor driven process head contains the bondhead, writing dispense system, and down-looking inspection and alignment camera. Full-vision capability includes alignment and inspection of epoxy dispense pattern, die, and post placement inspection. The optional up-looking camera allows for high accuracy flip chip operation.ASM Pacific Technology Hong Kong www.asmpacific.com.
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