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Zestron Showcases FAST Technolgy at NEPCON China

(April 8, 2008) Mansassas, VA — ZESTRON announced it will showcase its latest fast acting surfactant technology (FAST) during the 2008 NEPCON Shanghai tradeshow from April 8th to April 11th at the Everbright Convention and Exhibition Center, Shanghai, China.

According to the company, when compared to traditional surfactant based cleaning agents, the structure of the FAST Technology molecule is smaller, and is said to allow for quick removal of a variety of lead-free and eutectic flux residues. FAST Technology-based cleaning agents are specifically designed for spray-in-air cleaning applications. Furthermore, FAST Technology cleaning agents reportedly require fewer active ingredients to bond more contaminants. Thus, when compared to traditional surfactants, FAST Technology ensures a longer bath life associated with limited bath replacements and reduced overall costs.

All FAST Technology cleaning agents have no flash point and meet the latest RoHS & WEEE guidelines as well as current worker safety standards and the actual applicable environmental requirements.




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