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The AVIA 355-23-250 from Coherent, Inc. delivers over 8 watts of 355-nm output at repetition rates of 250 kHz and higher. The combination of high average power and high pulse repetition rate translates directly into high process throughput with minimal silicon microcracking, reportedly achieving high-speed IC die singulation with high yields.
Due to Coherent's proprietary PulseEQ technology, the laser can deliver low pulse energy at a 250 kHz repetition rate, which is said to be ideal for gently scribing through thin (typically 10 µm) epitaxial circuitry layers. The same laser can also be operated at lower repetition rates, with pulse energies as high as 80 µJ, making it an optimum tool for dicing through the wafer itself. Because of fully automated active optimization proprietary functions such as PulseEQ, ThermEQ and PosiLock, the pulse repetition rate and pulse energy can be rapidly changed with no effect on the laser's beam quality (M2 < 1.3), high pulse to pulse energy stability (noise < 5% rms at 70 kHz), and beam pointing.
The AVIA 355-23-250 is suitable for high-throughput micromachining applications, such as scribing low-k semiconductors, dicing thin memory chips, and via hole drilling in printed circuit boards. Other applications include solar cell micromachining and direct patterning of thin films. Coherent, Inc. Santa Clara, CA www.coherent.com.
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