Advanced Packaging Online Article |  |
Click here to enlarge image
EP21LM-3, a two component, medium-viscosity epoxy resin system from Masterbond is suitable for high-performance bonding, encapsulation and coating. EP21LM-3 readily develops high physical strength properties including a tensile modulus greater than 100,000 psi (690 MPa) and a tensile shear strength greater than 2300 psi (16 MPa). A viscosity of 37,000 cps allows the product to flow evenly and smoothly without application of pressure. Additionally, it wets surfaces and fills volumes quickly and completely.
The cured polymer has a Shore D hardness of 64.It is resistant to thermal cycling and many chemicals, including most organic solvents over the temperature range of -65°F to +250°F. Adhesion to metals, glass ceramics, wood, vulcanized rubbers and many plastics is excellent. The EP21LM-3 system has a dielectric strength over 350 V/mil and a volume resistivity of 1014 ohm-cm. Masterbond Hackensack, NJ www.masterbond.com
|
Return to Previous Page
Webcasts |  |
|
Sponsored White Papers Library |  | |
|
|
|
|
|