This intuitive cost-of-ownership (CoO) tool model is specifically designed to evaluate the cost of a given through-silicon-via (TSV) process flow. It has been developed using Excel so as to be widely exploitable and upgradable. This CoO tool will enable evaluation of the cost/wafer level for manufacturing TSVs using user inputs or pre-defined parameters. This cost analysis tool is dedicated to 3D IC manufacturing for defining and tuning fab parameters such as: number of wafers/year processed, global process yield, number of working days/year, operator cost/year, and engineer cost/year. The tool will provide precise descriptions on cleanroom (CR) class, CR maintenance cost ($/m²/year), CR electricity consumption ($/m²/year), CR amortization period (year), and equipment amortization period (year). Additionally, a user can consider the level of automation in his fab and its geographical location and then directly access the TSV cost breakdown, showing the location of cost "pain points". Yole Développement, Lyon, France; www.yole.fr.
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