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(February 29, 2008) Scottsdale, AZ — The IMAPS Global Business Council (GBC) is pleased to announce that Bi Keyun, PhD and president of the China Electronic Packaging Society, will head a delegation from China and will speak at GBC Spring Conference in Scottsdale, AZ, on March 16 and 17, 2008.
Keyun's presentation is titled "The Development of the Semiconductor Packaging and Testing Industry in China." He will cover the rapid development of the Chinese semiconductor industry, which has experienced an average increase of 33.6% between 2001–2007.
Keyun is also president of the Packaging Branch of the China Semiconductor Industrial Association, which has 250 members and produces the annual International Conference on Electronic Packaging Technology.
"We are extremely pleased that Dr. Keyun will present at our Spring Conference. We know that the information he will impart will be valuable to our attendees. We look forward to welcoming the delegation from China," stated GBC Chair, Howard Imhof, Metalor Industries.
The GBC 2008 Spring Conference will address cost and performance driven challenges throughout the semiconductor packaging supply chain. For more conference information, go to www.imaps.org/programs/gbc08spring.htm.
The GBC provides value to IMAPS corporate members by producing conferences, webinars, presentations, and related publications. Their focus is on the business side of technology for microelectronics and packaging.
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