Advanced Packaging - Fundamental Reliability Issues Addressed at Workshop

(February 27, 2008) Owego, NY — Members of Unovis Solutions' 2008 Advanced Research in Electronics Assembly Consortium are gathering for the last day of this two-day conference to review this year's research plan and to review results of recent investigations. Attendees from more than 30 companies and institutions are expected to congregate for an in-depth look at process and reliability-related research in electronics assembly.

During the workshop, Unovis' research scientists will review their 2007 findings pertaining to the consortium's research tracks. More specifically, progress reports will highlight development in the consortium's lead-free studies, critical in the fundamental understanding of these new interconnect structures. Reliability issues pertaining to surface finishes, underfilling and repair are also topics of discussion. Finally, recent investigations on the TSV stacking process are being presented.

As George Westby, Director of the Advanced Process Laboratory states, "The AREA Consortium is at the core of Unovis' unique offerings of knowledge-driven solutions for today's most advanced electronics assemblies. After 15 years, our goal remains the same: to arm our members with the tools and knowledge to quickly and efficiently introduce new technology and solve complex problems. The AREA consortium becomes our customers' knowledge engine, enabling them to offer the timely release of high quality and high reliability products, essential to their success in today's competitive marketplace."

Led by Peter Borgesen, PhD, the unique and longstanding Advanced Research Consortium tackles materials and microstructure-related reliability issues that are critical to high-quality electronics assembly. Borgesen highlights the workings of the Consortium as follows: "Our research goals are established by continual consultation with current and potential members, insuring relevancy and responsiveness to industry requirements. Additionally, the research is conducted in close consultation with other industry and academic scientists, guaranteeing research that takes full advantage of current knowledge. Establishing assembly reliability, and Failure Effect and Mode Analysis, have been a mainstay of our development strategy throughout our long history."

Members can join at any time and have access to the comprehensive Consortium knowledge database. For more information, go to unovis-solutions.com.

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