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(December 7, 2007) PALO ALTO, CA — The Surface and Mount Technology Group at Frost & Sullivan will hold its 2007 Quarterly Analyst Briefing Presentation on the flip chip bonder equipment market on Wednesday, December 12, at 12:00pm CST/1 pm EST.
As the call for higher integration and increased functionality of semiconductor packages continues, various end-user segments will likely become more receptive to flip chip technology, Frost & Sullivan reports. Equipment suppliers continue to develop more system solutions to accommodate this demand and offer higher accuracy machines in response to new package types.
This briefing will benefit equipment manufacturers, distributors, component suppliers, and package developers by discussing current and future trends for the world flip chip bonder equipment market. Highlights of the briefing include: analysis of current and future trends, market drivers, and challenges.
"New package types, such as flip-chip-in-package, are expected to increase the attractiveness of the market and encourage equipment suppliers to implement smaller footprint designs and better machine components," notes Frost & Sullivan research analyst Julian Harris.
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