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(August 1, 2007) SANTA CLARA, CA — Promex Industries, Inc., will use Microbond's (Ontario, Canada) technologies and Mirror Semiconductor's (Irvine, CA) designs to develop advanced, complex packages. Introducing next-generation technologies requires engineering collaborations, said representatives of each company.
Using Microbond's X-Wire bonding wires, Promex will build and test packages for end-users, and will prepare packages for volume assembly. X-Wire enables reverse wire bonding, with crossing wires, without shorts, due to an insulator coating. It is said to improve use of X, Y, and Z package dimensions. For more on the technology, see Insulated Wire Technology Hits Mainstream. Mirror's Chip Packaging 2.0 products and services will contribute to substrates and circuit boards with shorter copper traces and fewer layers, said representatives. By combining the technologies, the companies target flexibility in increasing package densification, without increasing layer counts or costs.
Bringing these emerging technologies to high-volume production requires focus on the end-customers' goals, said Richard Otte, CEO, Promex. The collaboration is designed to minimize time-to-market, cost, and risks in adoption, added John Scott, CEO, Microbonds. Mirrored Pinout products were chosen to best demonstrate capabilities of X-Wire bonding.
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Martin Hart, president, Mirror; John Scott, president and CEO, Microbonds; and Richard Otte, president and CEO, Promex.
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