Skip Fehr
(April 25, 2007) SAN JOSE, CA — Gerald K. "Skip" Fehr, Ph.D., joined Mirror Semiconductor's technical advisory board (TAB), to develop the company's wire-bonding designs, named Mirrored Pinout. Fehr, an industry consultant in San Jose, has served at Fairchild Semiconductor, Intel, LSI Logic, and Texas Instruments (TI).
Mirror plans to produce, sell, and license its wire-bonding technology by agreement with Liberty University (Lynchburg, VA), and will locate a facility in Irvine, CA. The proprietary Mirrored Pinout concept is based on clockwise wire bonding, opposite traditional wire-bonding designs. Performance benefits are suggested, as a mirrored-pinout package, mounted to a PCB with a standard package, creates shorter circuit routing, reportedly by up to 80%. Additional benefits include a smaller PCB or other substrate material.
Mirror is developing applications such as parallel data-bus circuits, buss buffers, power-management circuits, power-control systems, analog, and logic products. The Mirrored Pinout fits most types of package formats, including BGA, LGA QFN, and most chip-scale packages (CSPs).
Co-founder of IPAC, a semiconductor assembly and packaging company in San Jose, Fehr holds a doctorate in material science and engineering from Iowa State University.
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