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(December 7, 2005) Phoenix, AZ — Rohm and Haas Electronic Materials CMP Technologies' new Asia-Pacific Manufacturing and Technical Center at the Hsinchu Science Park, Chunan satellite campus in Taiwan is now open, adding to the company's growing business in Asia. Commercial production will begin by the first quarter of 2007.
"With the majority of our business currently based in Asia, Taiwan makes the ideal location for our significant investment in this multi-purpose plant and technical center," says Nick Gutwein, CMP Technologies' president and CEO. "This will be the production site for our next-generation IC1000 polishing pads, as well as the setting for a sophisticated applications lab and sales and customer support offices. We'll be able to meet customers' specific requirements quickly, reduce their cycle time, and speed up production as they focus on building new, 300-mm advanced technology node fabs over the next decade."
The facility will include a 4,500-sq.-m plant for advanced manufacturing of next-generation CMP products, as well as a 2,000-sq.-m technical center and 3,000 sq. m of office space. The applications lab will encompass standard analytical equipment for pad and slurry analysis, along with a 300- to 500-sq.-m Class 10 cleanroom equipped for CMP polishing, cleaning, and metrology.
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