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LPKF Releases Pulsonix Chip Packaging Toolkit
Wilsonville, Ore.—LPKF Laser & Electronics announcee the release of the Chip Packaging Toolkit option for Pulsonix PCB design software. Targeted to chip packaging and chip-on-board designers the toolkit reportedly provides the option to create and annotate die, bond pads and bond wires, and the automatic placing of bond pads around bare die components. Online DRC (design rule check) and batch design rules can be set for minimum and maximum length of the bond pad from the die pad, and for crossing over of insulated and non-insulated wires.
www.lpkfusa.com.
(October 28)

Enertron 1U Heat Sink for AMD Opteron CPU
Mesa, Ariz.—Enertron announced the release of the PB64-1U Cooler, a compact heat sink for the AMD Opteron and Athlon 64 CPUs for use in 1U servers. Reportedly, this compact cooler will dissipate as much as 90 Watts of heat in a 40°C environment. The compact cooler was designed to fit within the limited height of 1U environments. The heat sink features a copper base and high-density array of thin copper fins. Two dual-intake blowers are integrated into the heat sink to provide the forced convection, no other airflow ducting is required. The two blowers also offer redundancy protection; in case one blower fails, the second blower continues to cool the heat sink. The total thermal resistance (θc-a) of the PB64-1U cooler is 0.32°C/Watt. A high performance interface pad is preinstalled. The heat sink is mounted to the CPU using the standard mounting plate.
www.enertron-inc.com.
(October 28)

DEK Mass Imaging Process
Flemington, N.J.—DEK is said to have successfully applied mass imaging techniques to improve the uniformity of Thermal Interface Material (TIM), deposited between a silicon die and its package lid during semiconductor packaging processes. By mass imaging the TIM using ProFlow DirEKt Imaging , semiconductor manufacturers can now be sure that the die surface is covered by a uniform thickness of TIM. Advantages include better thermal connectivity between the die and the lid, which improves reliability, as well as greater coplanarity of the lid.
www.dek.com.
(October 27)

Pulse RF Splitter for CATV and HDTV Products
SAN DIEGO—Pulse announced the availability of its new radio frequency (RF) differential splitter/combiner, model C4020, for video products such as cable television (CATV) networks, set-top boxes, cable modems, residential gateways, and television equipment including high definition television (HDTV) sets. The C4020 targets equipment that integrates a high level of video features, for example, multiple tuners supporting picture-in-picture and personal video recorders (PVR). The C4020 RF splitter reportedly has an operating bandwidth of up to 864 MHz. Intended for CATV set-top box applications, the C4020 is said to receive a differential signal from an amplifier at its input port and divide the signal into two differential output signals for interfacing to downstream differential video tuners.
www.pulseeng.com.
(October 27)

Universal Device Programmer from BP Microsystems
HOUSTON—BP Microsystems recently announced the availability of 1400, a universal device programmer, designed to support all device technologies. The system's advanced pin drivers operate as low as 2.4 V for advanced low-voltage devices, according to the company, and rely on high-speed circuitry to deliver programming and testing performance. The 1400 is equipped with 240 pin drivers standard, and the system's interchangeable socket modules are designed to provide universal support for each package type. The system includes a 3-year warranty and free software updates eight times a year.
BP Microsystems also announced its intention to display its "One stop" product at the Productronica Tradeshow in Munich Germany, scheduled to take place November 11 to 14, 2003.
www.bpmicro.com.
(October 24)

Position Sensing Encoders from MicroE Systems
NATIC, MASS.
The Mercury family of position encoders from MicroE Systems reportedly features high-performance sensors, the smallest measuring just 8.4mm tall and weighing only 5 grams. Other features are said to include operating speeds at up to 7.2 meters/second at full resolution, programmable resolution, instrument-free alignment, and SmartSignal software. The Mercury encoder family contains 15 models in four styles: programmable, digital, analog, and vacuum. Linear resolutions range from 5 microns to 5 nanometers; rotary resolution ranges from 6,600 counts per rev. (CPR) to 67.1 million CPR. Additionally, the same sensor works in both linear and rotary applications.
www.microesys.com.
(October 24)

Vishay LEDs
MALVERN, PA.
TLMS3000 and TLMS3001 super red LEDs from Vishay reportedly feature a dominant wavelength of 630 nm and typical luminous intensities from 2.5 mcd to 12.5 mcd, available with a dominant wavelength of 606 nm. TLMO3000 and TLMO3001 orange LEDs are said to feature typical luminous intensities from 5.0 mcd to 20 mcd, with a dominant wavelength of 587 nm. The TLMY3000 and TLMY3001 yellow LEDs offer typical luminous intensities from 4.0 mcd to 20 mcd. The TLMx300x series is rated for a 125 DegreesC junction temperature, a thermal resistance junction of 400 K/W, and an operating temperature range of minus 40 DegreesC to plus100 DegreesC.
www.vishay.com.
(October 23)

RPMC Laser Device
ST. CHARLES, MO.
The Staccato laser from RPMC reportedly delivers 13 picosecond (0.000000000013 seconds) long, diffraction limited pulses with as high as 38 megawatts of peak power, higher peak power than most conventional industrial lasers. The Staccato laser is also available in the harmonic wavelengths of 532, 355 and 266 nm; and with the ultraviolet (UV) wavelength, the laser can have its beam focused to spots of approximately 2 microns (0.00008 inches).
www.rpmclasers.com.
(October 23)

Electro Standards Extensometer
CRANSTON, R.I.
ESLTest II with Extensometer from Electro Standards Laboratories (ESL) reportedly assures accurate measurements by utilizing an advanced counterbalance design technique of attachment to the test specimen. The ESL Extensometer includes a spring-loaded, plunger style attachment closure that clamps directly to the sample for accurate elongation and reahes limits up to 35 inches of follower separation.
www.electrostandards.com.
(October 22)

Ironwood Probing and Prototyping Adapters
EAGAN, MINN.
PA-MLF48A-P-Z-02 probing adapter from Ironwood Electronics reportedly is constructed with gold plated solder-tail machined pins for when the adapter is socketed; MLF/QFN prototyping adapter is available with wire-wrap pins for inexpensive wire-wrap panels. This adapter nterfaces the 48 position MLF/QFN ZIF socket to a 0.100" center pin grid array (PGA).
www.ironwoodelectronics.com.
(October 22)

Boundary Scan Software from GOEPEL
SYSTEM CASCON boundary scan software, version 4.1 from GOEPEL reportedly is compliant to IEEE 1149.1 and includes Scan Vision II, a next generation graphical viewer product based on Router Solutions' CAMCAD package. The Router Solutions tool is said to be fully integrated into GOEPEL boundary scan software suite, providing the customer complete nteractive visualization of schematics, data and layout of the UUT.
www.goepel.com.
(October 21)

Pac Tech Solder-Ball Bumping Equipment
SANTA CLARA, CALIF.
SB2-Jet sequential solder-ball attach machine with integrated laser reflow from Pac Tech reportedly is one of the fastest single-step solder-ball placement machines available, with a ball-placement speed of 10 balls per second. It is said to handle solder balls ranging in diameter from 80 microns to 760 microns and a wide range of solder alloys (eutectic, high-lead, lead-free, gold and tin). The system reportedly is suitable for wafer or substrate sizes up to 300mm and flexible materials.
www.pactech-usa.com.
(October 21)

Thermagon Gap Filler
CLEVELAND
T-flex 200 V0 series, a commercial grade gap filler from Thermagon is said to meet UL 94 V0 flammability rating. T-flex 200 V0 is said to be naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance. It is available in thicknesses of 20 to 200 mils (0.25mm to 5.08mm) and is electrically insulating. Applications for T-flex 200 V0 include plasma display panels, RDRAM memory modules, high-speed mass storage drives and wireless communication hardware.
www.thermagon.com.
(October 20)

Physik Scanning Systems
AUBURN, MASS.
P-363 PicoCube XY and XYZ piezo stages from Physik Instrumente are reportedly ultra-high-performance, closed-loop piezoelectric scanning systems. Designed for AFM (Atomic Force Microscopy), SPM (Scanning Probe Microscopy) and nanomanipulation applications, they are said to combine an extremely low-inertia (10 kHz resonant frequency!), high-speed piezo scanner with non-contact, direct-measuring, parallel-metrology capacitive feedback capable of 50 picometers resolution.
www.polytecpi.com.
(October 20)

GOEPEL Boundary Scan Solutions
GERMANY
FXT/96 CION module family of boundary scan I/O accessories from GOEPEL reportedly provides 96 I/O channels, with the I/O voltage programmable between 1.8V and 5V for three groups of 32 channels, allowing for mixed voltage applications. Each channel can be configured independently as input, output, tri-state, and bi-directional, driving/sinking up to 24 mA, and provides a special "un-stress" feature to avoid interface destruction by high fault currents. Reportedly boundary scan devices on the module support various boundary scan instructions for fast execution of test and FLASH ISP procedures and feature hot swap capability.
www.goepel.com.
(October 17)

Hesse & Knipps Underfill Dispensing and Equipment for Backend Assembly
SAN JOSE, CALIF.
The Hesse & Knipps dispenser DJ 335 for the flip chip underfill dispensing processes includes a high resolution pattern recognition system reported to guarantee precise chip detection. Two independently programmable light sources with vertical light through the camera lens and a diffuse ring light with exchangeable light color capability reportely offer optimal illumination, which is necessary for pattern recognition. Reportedly, even tilted chips can be detected with this system. An installed suction system allows the DJ 335 to process materials which may be harmful to health.

Hesse & Knipps GmbH equipment wire bonders, pick-and-place machines, dispensers, flip chip bonders, and customized systems reportedly are for semiconductor backend assembly. These machines are said to have inline capability and can be equipped with a range of different standardized or customized Handling- and Lift- systems. PC-based "process data control system", tracks manufacturing information of up to 50 machines and communicates with other systems like SAP.
www.hesse-knipps.com.
(October 17)

Axsys Distance Measuring Device
ROCHESTER HILLS, MICH.
LaserTrac autofocus distance measuring device from Axys Technologies reportedly provides real-time autofocus of microscope systems used for the inspection of semiconductor wafers, microvia plates, flat panel displays, glass reticles and many other substrates. LaserTrac is reportedly proven for objectives ranging from 5x to 150x. Through the use of direct drive systems, piezoelectric elements, and voice coil type actuators, the system is said to be able to obtain band widths of 10 to greater than 100 Hz depending on the application.
www.axsys.com.
(October 16)

Creative Automation Displacement Pump
SUN VALLEY, CALIF.
True Volume piston positive displacement pump from Creative Automation reportedly is a digital dispensing system for volume control in fluid dispensing. True Volume pumps are said to maintain accuracy in the most demanding circimstances. Variations in temperature, viscosity or target deposit size reportedly will not impact the accuracy or speed of the True Volume pump. The pump is said to be unaffected by viscosity changes and allows dispensing of materials from 1 to 1,000,000 cps. Patented tips and pistons are available for single pixel volumes ranging from 0.001 to 274 microliters.
www.creativedispensing.com.
(October 16)

Stencil Frame Handling Carts from Bliss
FREEMONT, CALIF.
Dross handling carts, with fume covers, from Bliss Industries reportedly are designed to eliminate the fumes and particulates that escape into the air. The carts are available in 3.5 and 30 gallon sizes. The baffled fume cover seals the top of the drum and attaches to vacuum with a H.E.P.A. air purification system that prevents the escaping of fumes and particulates. Dross is transferred through the drum with the use of a hinged door in the top cover.
www.blissindustries.com.
(October 15)

STATS Die Stacking Technology
SINGAPORE and MILPITAS, CALIF.
Same size die stacking technology from ST Assembly Test Services reportedly allows the vertical integration of multiple ICs within a single package without increasing package height. This technology enables the upper die to be equal or larger than the lower die in the package, thereby increasing the number of die stacking combinations available and resulting in more functionality and capacity within the same package.
www.stts.com .
(October 15)

OZ Optics' Variable Optical Attenuator
OTTAWA, CANADA
Miniature variable attenuators from OZ Optics reportedly are the smallest in its class. The new form factor measures 15mm long by 14mm high by 5mm thick. The design is stackable --16 attenuators in a space only 3 inches thick. The miniature design reportedly features insertion losses as low as 0.6dB, better than 55dB return losses, power handling up to 2 Watts, low PDL, and wavelength insensitive performance, allowing operation over L, C, S, and 1300nm operating wavelength bands.
www.ozoptics.com.
(October 14)

Palomar Die Attach Service
VISTA, CALIF.
Thermosonic die attach service available from Palomar Technologies reportedly can do both stud bumping and precision attachments (plus or minus 10 micron placements) in house for quick-turn processing. This method is said to be preferred for dies that are thin, brittle (such as RF devices or MEMS), or intolerant of high heat, because application of ultrasonic energy may reduce the need for heat and force. This interconnect method is an alternative to solder reflow and improves thermal and electrical conductivity. The process is used with gold stud bumping for flip chip applications.
www.palomartechnologies.com.
(October 14)

National Semiconductor Signaling Devices
SANTA CLARA, CALIF.
SCAN928028 and SCAN926260 low voltage differential signaling (LVDS) serializer/deserializer (SerDes) devices from National Semiconductor reportedly reduce power, board space and costs for communication systems.They are reportedly designed for 3G base stations, wireless local loop (WLL) systems, fixed access equipment, imaging/display interfaces and high-speed industrial links. SCAN928028 integrates eight 10-bit SCAN921023 serializers on one chip and features IEEE 1149.1 JTAG test support as well as at-speed BIST.
www.national.com.
(October 13)

Vishay Capacitors, Optocoupler and Transformers
Vishay Electro-Films NC series of thin film, single-value chip and wire capacitors reportedly improves hybrid circuit design with small 0.020-inch-squared dimensions and capacitance values up to 1000 pF.
CNY65Exi high-voltage optocouplerare reportedly consists of a phototransistor optically coupled to a gallium arsenide (GaAs) infrared- emitting diode in a four-lead, plastic package.
LPE-3325-CST series of surface-mount, current-sensing transformers reportedly features secondary inductance ranging from 180 microhenrys to 3000 microhenrys at 100 kHz and 0.1 V and a maximum secondary resistance range of 1.00 ohms to 7.70 ohms.
www.vishay.com.
(October 13)

Sensor Film from Sensor Products
EAST HANOVER, N.J.
Pressure Points tactile force indicating films from Sensor Products are said to determine pressure distribution within a laminating press for multilayer printed circuit boards. When manufacturing hybrid circuits, reportedly the sensor film reveals inconsistencies in resistor thickness across large area substrates. Pressure Points are available in sizes ranging from 0.8 cm (0.3") to 2.5 cm (1") diameter.
www.sensorprod.com .
(October 10)

Asymtek Dispensing Software
CARLSBAD, CALIF.
Fluidmove for Windows NT (FmNT) Version 4.7 dispensing software from Asymtek reportedly features Delta Z dispensing for close dispensing tolerances on such applications as wafer level packages and optical display components. FmNT 4.7 integrates Asymtek's calibrated process jetting (CPJTM) system with its high-speed DispenseJet technology for dispensing surface mount adhesives and underfilling small fillets.
www.asymtek.com.
(October 10)

Cygnal USB to UART Bridge
AUSTIN, TX
CP210 USB-to-UART Bridge Chip from Cygnal Integrated reportedly provides USB 2.0 Full Speed to 921.6k Baud UART data transfer in a 5x5mm Micro-Lead Frame Package. The CP2101 reportedly requires no external crystal, voltage regulator, or EEPROM, providing the smallest available PCB footprint for a USB to UART bridge,

JPSA Eye Beam Homogenizer
HOLLIS, N.H.
JPSA Laser's Fly's Eye Beam Homogenizer reportedly converts the characteristically non-uniform beam of a UV Excimer laser into a homogeneous beam with 95% uniformity while utilizing >80% of the laser power. The JPSA Fly's Eye Beam Homogenizer's long working distance - typically between 1 - 2 meters - provides a beam size ranging from 8mm to 1.5 cm. It is said to easily re-image due to the long working distance and slow optical F-number.
www.jpsalaser.com.
(October 9)

Ironwood BGA Sockets
EAGAN, MN.
Ironwood Electronics' solderless SG-BGA-6085 and SG-BGA-6086 reportedly are designed to allow socketing of Intel BGA256L and BGA196L packaged IC's and allow system operate at full speed. The socket is said to guide the IC to the exact position for connection of each ball and uses an aluminum compression screw to provide compressive force. The solderless socket has 6.5 GHz bandwidth interconnects and accommodates the cavity down die of these two packages. The SG-BGA-6085 accepts a 17 mm IC with 1.0mm pitch with a 16X16 array. The SG-BGA-6086 is designed for a 15 mm body IC with 1mm pitch and a 14X14 array.
www.ironwoodelectronics.com.
(October 8)

Dual Band Wireless Access from Accton Technology
HSINCHU, TAIWAN
WA6102 from Accton Technology reportedly is the only 802.11a/g dual band wireless access point that has the security features that make wireless networking practical for Enterprise applications. Fully compatible with IEEE 802.11g at 2.4GHz and with 802.11a at 5GHz, the WA6102 is said to have the flexibility to connect wireless users whether their computers are equipped with 802.11a, b or g wireless adapters.
www.accton.com.
(October 8)

Picker ComponentsTelecom Relay
CARROLTON, TEXAS
PC302 and PC302S ultra miniature DIL telecom relays from Picker Components are 5mm in height, weigh 1.5g, and are available in .300" pitch DIL through hole or gull wing surface mount configurations. Available in a 2 form C contact configuration with single side stable (.140W), single coil latching (.100W) or dual coil latching (.200W) coils. The PC302 is reportatedly suitable for use in telecommunications equipment, alarm systems, computer peripherals, medical equipment, etc. and are completely sealed for automatic soldering processing.
www.pickercomponents.com.
(October 7)

Gryphics BGA Contact System
PLYMOUTH, MINN.
The Grypper(tm) from Gryphics reportedly is designed for use in near-device-size foot-print applications where PCB holes for external fasteners and additional hardware cannot be accommodated. The Grypper connector is SMT, soldered to the target PCB using conventional reflow methods. Available in 1.0 mm & .8 mm pitches with electrical performance of greater than 10 GHz @ less than -1 db.
www.gryphics.com.
(October 7)

Intellitech Parallel Tester
CHARLOTTE, N.C.
PT100 Parallel Tester from Intellitech Corporation reportedly is designed to off-load in-circuit testers and in-line programmers and optimize throughput of digital test and configuration of PCBs incorporating the IEEE 1149.1 standard. The tester cards are housed in a 19" 3U height rack mountable box with room for 16 plug-able cards, each one supporting 24 re-configurable tester channels and one IEEE 1149.1 controller. Each 19" rack of 16 parallel tester cards can then be connected to another 19" rack of PT100 tester cards, expanding the tester channels as physical space and AC power permits. The physical flexibility of the tester enables it to interface with a variety of UUTs from small cell phones to large telecom blades. The 24 tester channels and 1149.1 interface have a programmable logic high output level from .8v to 5V with a current drive of up to 84ma. The IEEE 1149.1 interface is said to deliver and test boundary-scan data to and from the UUT at 64 Megabits per second on each tester card simultaneously.
www.paralleltest.com/products/paralleltest.asp.
(October 6)

Production Solutions Tooling Pin
POWAY, CALIF.
Universal tooling pins from Production Solutions reportedly are for semi-automatic screen printing applications. The adjustable universal tooling pin is said to register printed circuit boards (PCB), regardless of tooling hole size. It is manufactured of heavy-duty stainless steel and incorporates built-in set screws to eliminate the possibility of board movement. Tooling pin adjusts to board hole sizes .095" to .195" for single tool solution.
www.production-solutions.com.
(October 6)

Buffalo Technology Memory Modules
AUSTIN, TEXAS
DDR533 modules from Buffalo Technology support data sizes of 256MB (DD533-256/HB) and 512MB (DD533-512/HB). Reportedly this next-generation of memory products features 533 MHz, 64Mbit x 64 DDR (Double Data Rate) synchronous modules, with transfer rates up to 8.4GB/s (in dual DDR mode). The DDR533 are said to offer the speed and performance needed to support the most demanding motherboard and CPU configurations. Buffalo's DD533-256/HB and DD533-512/HB modules consist of 8/16 Hynix 32M x 8 bit SDRAM's, and a 1K/2K Serial EEPROM, on a 184-pin unbuffered DIMM.
www.buffalotech.com.
(October 3)

Fairchild Video Filters
SAN JOSE, CALIF.
Fairchild Semiconductor FMS6417 is a five-channel, video reconstruction filter that includes selectable RGB (YUV) high definition and standard definition (HD/SD) filters with Y, C, composite, and modulator outputs. Reportedly, this integrated product combines video line drivers, sound notch, and multiple video input/output standards--all in one chip. The FMS6417 consists of a triple 6th order filter with selectable 30MHz and 8.0MHz frequencies and a dual 8.0MHz filter for filtering Y/C. This filter is offered in a 32-Pin LQFP package, and is available in tape and reel packaging.
www.fairchildsemi.com/pf/FM/FMS6417.html.
(October 3)

Kulicke & Soffa Ball Bonding Wire
WILLOW GROVE, PA.
AW-66 4-N Ball Bonding Wire from Kulicke & Soffa reportedly provides bonding process robustness in ball bond applications, ranging from standard to ultra fine pitch. Available in diameters from 15 micrometre to 33 micrometre, the AW-66 4-N Ball Bonding Wire is said to support various looping requirements with excellent bondability. When tested in K&S laboratories, wires displayed superior ball bond stability during thermal aging after 1000 hours at 175 degrees C.
www.kns.com.
(October 2)

BEST's Solder and Rework Training Kits
ROLLING MEADOWS, ILL.
BEST Inc introduced a series of training kits reportedly designed to test students desiring to master the skills of SMT soldering. The kits are available in five formats.Options include conductive soldering, convective soldering, combination conductive and convective, fine pitch and BGA. Included in the kit are 0402 chip style parts, 20 mil pitch TSOP 32's, QFP 208's, 0201, 15 mil pitch LQFP and 50 mil pitch PLCCs. Both perimeter, full array Bags and micro BGAs are included in the kit.
www.solder.net.
(October 2)

Zymet Underfill
EAST HANOVER, N.J.
Zymet introduced a new reworkable underfill encapsulant, CN-1432, designed for CSP and BGA encapsulation. CSP's and BGA's are not normally encapsulated. However, it has reportedly been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations. CN-1432 has a viscosity of 4500 cps at room temperature, said to be capable of flowing a distance of 18 mm, with only a single-side dispense, in as little as 15 seconds. CN-1432 can be cured in an in-line oven, in 5 minutes at 165 degrees C.
www.zymet.com.
(October 1)

Etching System from Unaxis Semiconductors
ST. PETERSBURG, FLA.
Unaxis Semiconductors VERSALINE(tm) deposition and etching system reported has a simple and reliable wafer handling and user interface. The process modules wafer sizes up to 200 mm. The system can be equipped with a Large Area PECVD deposition module or the following etching modules: Inductively Coupled Plasma (ICP), Pulsed High Frequency (PHF) RIE or High Performance Oxide Etching (HiPOE).
www.semiconductors.unaxis.com.
(October 1)

SmartScope MVP Systems from OGP
ROCHESTER, N.Y.
Optical Gaging Products introduces a new family of six low-cost SmartScope MVP video measurement and inspection systems, reportedly designed for small shops and customers with limited quality budgets. The benchtop models feature measurement ranges from 6 x 3 x 5 inches (150 x 75 x 125 mm) to 12 x 12 x 6 inches (300 x 300 x 150 mm). Offers 6.5 to 1 zoom lens with manual or motorized operation, high-resolution color CCD camera, and 1.0 micrometre linear scales.
www.ogpnet.com.
(September 30)

Vishay Schottky Rectifiers
MALVERN, PA.
The MBR Series 150-V H-type dual-rectifier devices from Vishay Intertechnology reportedly offer low forward voltage drop, low leakage, and maximum junction temperature of 175°C. A reverse surge capability of 25 kV ESD and inductive reverse avalanche energy ratings up to 20 mJ enhance reliability. Forward voltage options of 10 A, 20 A, and 30 A are available for devices in TO-220, ITO-220, and TO-262 package outlines. They are said to be intended for use in high-frequency inverters, freewheeling, SMPS, and polarity protection applications in power supplies and adapters.
A HREF="http://www.vishay.com">www.vishay.com.
(September 30)

Cascade Microtech Thermal Probe Station
BEAVERTON, ORE.
A series of 300 mm semiautomatic and manual probing stations, S300 from Cascade Microtech uses the ERS AirCool + high-performance thermal system. The new stations are available with an integrated AirCool + chuck (-55 degree to 200 degree C range) or AirCool + chuck (0 degree to 300 degree C range). All probe stations are said to be available with the company's industry standard RF/DC/CV measurement tools. The probe station reduces thermal test time due to fast temperature transition in both heating and cooling. The system with AirCool + reportedly integrates an automatic dry air control system, which eliminates manual control of dry airflow for hot or cold probing.
www.cascademicrotech.com.
(September 29)

Oluma Integrated Photodiode TVOA
CARLSBAD, CALIF.
Telcordia GR-1209 from Oluma is announced for its integrated photodiode Tap and VOA (TVOA). The compact TVOA is said to attenuate and monitor fiber optic signals with reduced fiber handling and splicing for high-density network applications. The TVOA is reportedly well suited for transceiver protection, OADM signal balancing, and integration into all-optical switches.
www@oluma.com.
(September 29)

Electronic Materials Delayed Reaction Epoxies
BRECKENRIDGE, COLO.
EMCAST V-150 and V-151 from Electronic Materials represent a new class of delayed reaction epoxy adhesive systems. Two UV blocking substrates reportedly can be mated with high strength by pre-exposing the epoxy adhesive with UV and visible light. After the surfaces are mated, a room temperature or heat cure will solidify the bond. The delayed reaction feature is said to make this a good adhesive for colored plastics and some metals. These materials are a continuation of the company's V-140 series Visible Cure Epoxy systems. Additionally, they offer good shear strengths to plastics, particularly PVC because they are designed for laminating chips to "smart card" phone and credit card assemblies.
www.electronicmaterialsinc.com.
(September 26)

Royal Philips Leadless Packages
SAN JOSE, CALIF.
Royal Philips introduced a new generation of small discrete leadless packages using QFN technology. The SOT88x family reportedly provides designers of space-constrained applications a good choice for optimizing system performance in terms of PCB area and height while adding discrete functionality in a true mass production package. The high-performance and small size of the family make it ideal for applications such as LCD backlight-related devices, DC/DC conversion, ESD protection devices and small-signal switching transistors. With dimensions of 1.0 x 0.6 x 0.5 mm and bottom contact pads, the SOD882 and SOT883 packages are said to feature small board space requirements while offering power dissipation capability comparable to the industry standard SOT23.
www.semiconductors.philips.com.
(September 26)

Variable Beam Attenuator from JPSA Laser
UM-VA UV Excimer laser Variable Beam Attenuator from JPSA Laser is said to be an invaluable tool for applications requiring precise, on-target laser intensity control. The attenuator allows laser users to perform optics adjustments at low-power settings for safer conditions and less chance of optical damage to complicated optical beam delivery systems. The dynamic range specification is nominally from 5 to 90 percent, plus 100 percent transmission. However, the typical transmission range is less than 2 to greater than 94 percent. The attenuator system features a proprietary variable transmission filter that reportedly allows a wide range of energy adjustment. It also permits 100 percent transmission for zero transmission losses.
www.jpsalaser.com.
(September 25)

Pac Tech Flip Chip Placer
LAPLACE, an advanced flip chip placement machine from Pac Tech is said to provide good process flexibility and enable flip chip placement, solder reflow with underfill or NCP/ACF curing in one step. The laser heating also makes a fluxless assembly process possible. The main advantage of the placement system over thermode bonding reportedly is the higher throughput owing to the integration of prealignment and underfill ACF or NCP curing in the bondhead of the tool, and performing chip placement and laser heating simultaneously. Compared to standard solder reflow or thermode bonding procedures, the system offers the additional advantage of reducing thermal and mechanical stress by heating with laser pulses for only a few milliseconds duration. The laser light is coupled from the die's backside directly into the silicon where the generated heat is dissipated onto the chip surface and the pad/bump interface. Using these process steps reduces common alignment problems arising from differing thermal expansion behaviors of substrate and chip.
www.pactech-usa.com.
(September 25)

Aries Test Socket
Aries Electronics released an RF test socket for devices up to 13 mm wide, with pitches of 0.50 mm and higher, in applications with speeds from 1 to more than 10 GHz. The socket's signal path during test reportedly is 0.77", providing minimal signal loss for higher bandwidth capability and a longer cycle life in automated handling testing. A four-point spring probe crown is said to ensure scrub on solder ball oxides for reliable contact mating. Additionally, the raised point probe ensures accurate placement and scrub on small pads used on MLF and QFN packages. The socket incorporates solderless, pressure-mount compression spring probes, accurately located by two molded plastic alignment pins and secured with four stainless steel screws.
www.arieselec.com.
(September 24)

Newport Underfill Dispenser
Newport Corp.'s MRSI-175UF Underfill Dispense System for flip chip assembly reportedly offers high throughput and performance to the flip chip packaging market. The system is a flexible platform that may be configured to meet application-specific customer requirements. Additionally, it is available with single or dual dispense heads, rotary or linear positive displacement pumps, and single or dual conveyors depending on customer throughput and process requirements. The dispenser's conveyors are said to incorporate universal fixturing, which makes product changeovers fast and easy.
www.newport.com.
(September 24)

Siemens Dematic AG Parallel Gantry Placement
NUREMBERG, GERMANY
Siemens Dematic AG presents the first three-gantry Siplace HF as an evolution of the modular Siplace platform with an optimum cost-benefit ratio. Siplace HF/3 is based on the proven Siplace platform and is equipped with all the innovative features of the Siplace HF--the new placement head, transport system, and drives for flexible and fast placement. Reportedly the first multifunctional parallel gantry placement system, a third gantry enhances the placement machine's production and flexibility even further. Like the other two gantries, this additional gantry can accept any available placement head, depending on the job requirements: an additional twin-head for even more flexibility, a six-segment collect & place head for more speed with larger components, or a twelve-segment collect & place head for maximum speed with smaller components. The system also is said to add even more performance to the technological innovations of the Siplace HF platform and can be used with maximum flexibility. The machine places components that range from 0201, flip chips and CCGAs to custom components with 100 g and dimensions of 85 x 85/125 x 10 mm at a rate up to 45,000 components per hour.
www.siplace.com.
(September 23)

Ultrasonic Systems Photoresist Applicator
HAVERHILL, MASS.
A Prism coating system for the application of photoresist to semiconductor wafers reportedly applies a 3 to 5 micrometre film with uniformity and repeatability to rectangular shaped wafers with hundreds of laser-cut micro vias. Conventional spin coating techniques proved unsuitable for this application because of micro via clogging. The system is said to be ideal for applying thin films to flat substrates and can spray virtually any liquid from low-viscosity fluxes and solvents to more viscous adhesives, conformal coatings, conductive inks and photo imageable materials. Additionally, the system features an 18 x 18" spray application area with a conveyor for either inline or batch mode operation.
www.ultraspray.com.
(September 23)

ConProTec Adhesive Dispensing
SALEM, N.H.
MIXPAC S-50 System from ConProTec is for two-component adhesive dispensing. The system reportedly is designed to work with manually operated dispensers from the company, as well as with a battery-powered EZ-mix HI handheld dispensing unit from DTIC Dispensing Technologies. Because of the unique design of these two systems, when used in conjunction, end users are said to be able to obtain a higher flow rate and dispense thicker materials safely. The dispenser also can accommodate the following volumetric ratios of 1:1, 2:1, 4:1, 10:1 and an additional ratio of 3:2.
www.conprotec.com.
(September 22)

Electrically Conductive Adhesive from Rogers Corp.
ROGERS, CONN.
Rogers' BISCO EC-2000 Electrically Conductive Solid Silicone Series is said to be the industry's softest electrically conductive elastomeric material available in wide, continuous rolls. The series features compression-set resistance, low compression force deflection and easy processing to increase yields. The shielding effectiveness achieved by the adhesive reportedly is comparable to that of silver-filled products, while offering the lower cost advantage of a nickel graphite filler. Additionally, the acrylic- and carbon-based conductive adhesive broadens the application range for the series, which addresses EMI/RFI solutions in shielding applications.
www.rogerscorporation.com.
(September 22)

Micromanipulator Test Probe
CARSON CITY, NEV.
Said to be ideal for testing ground and signal contacts on high-frequency hybrid and ICs, the Micromanipulator Model 44RF Probe's return loss can be increased by the addition of internal loss. It is designed for use with standard manipulators and cables for accurate positioning of the probe tips. The probe reportedly is a low-cost alternative that has been designed for those RF/microwave applications in the DC to 3 GHz frequency range. With more than 20 versions of the model available, the company offers either series resistive elements within the probe housing or parallel terminations. Typical element values available include 45, 50, 550 and 950 Ohm. Other values can be special ordered.
www.micromanipulator.com.
(September 19)

Nikon Semiconductor Inspection System
MELVILLE, N.Y.
Reportedly the most versatile semiconductor inspection system available, the Nikon Instruments Optistation 3200 offers enhanced features, including two load ports and an improved optional DUV module to support micro inspection at the latest design nodes. The inspection system is said to provide three-mode macro inspection capability--front, back, center and backside peripheral--as well as high-performance lighting techniques that allow for detection of various process defects and particle/scratch detections. The system reportedly meets user demand for flexibility and convenience. It features an extensive option base that allows users to incorporate multiple equipment types into one base platform, helping to reduce cost of ownership.
www.niconusa.com.
(September 19)

Henkel Loctite Epoxy Molding Compound
INDUSTRY, CALIF.
Hysol GR725 from Henkel Loctite is a semiconductor grade molding compound that is said to be designed for use on power ICs and power discrete devices that operate at high temperatures and require good electrical stability. The molding compound is a green, non-Bromine/Antimony, epoxy cresol novolac-type material with reported excellent molding characteristics. The product is flame retardant and offers good adhesion to Ni/Pd/Au and Cu/Ag lead frames. This high-productivity epoxy molding compound offers a wide processing window and provides 20,000 hours at 200 degreesC HTSL. The compound meets JEDEC Level 1 260 degreesC reflow requirements and UL 94 V-O at 1/8" thickness.
www.loctite.com/electronics.
(September 18)

JPSA Laser Drilling Services
HOLLIS, N.H.
JPSA Lases announces ink jet nozzle and other high-precision laser drilling services in polymers, glass, ceramics, sapphire and metals. High-precision, high-repeatability drilling reportedly is achieved using UV DPSS lasers with one-hole-at-a-time drilling at a high repetition rate, or parallel processing of multiple nozzles per step and repeat using high-energy excimer lasers with special telecentric lasers and beam shaping homogenizers, depending on the application's needs. Drilling accuracy is said to be high: better than plus or minus 5 micons hole-to-hole tolerances, with telecentric holds to better than 10 arc seconds. Additionally, the drilling services offer controlled taper angle processing generation of hydrodynamic shaped nozzles or low taper angle nozzles.
www.jpsalaser.com.
(September 18)

Universal Instruments Placement Machine
BINGHAMTON, N.Y.
AdVantis placement machine from Universal Instruments reportedly builds on the value and versatility of the Vantis platform to improve performance and further reduce cost per placement in the mid-range market segment. The system reportedly reduces the cost of entry for manufacturers needing high-mix capacity, increased speed and greater accuracy. The machine leverage's the company's platform concept to deliver a low priced but highly scalable solution for low-margin assembly applications. Like its predecessor, the machine features a single-beam position system. To reduce the machine entry price further, the system is more basic in its standard format, while an extensive list of options is said to make the machine readily configurable. This allows the system to be personalized and means customers pay only for the features required to meet specific production criteria.
www.uic.com.
(September 17)

Newport Flip Chip Bonder
IRVINE, CALIF.
A high-speed, automated flip chip bonder, Mach FC Plus from Newport Corp. reportedly is based on a unique, parallel processing gantry machine platform designed for high-speed flip chip bonding. The patent-pending machine platform performs parallel processing of flip chip devices to achieve high throughput. The various process steps of picking, flipping, fluxing, vision alignment and controlled die placement are performed with asynchronous parallel motion, thus maximizing throughput. Advanced features include 8 micron placement accuracy, an automatic 300 mm wafer changer compatible with industry-standard wafer cassette docking carts, state-of-the-art wafer picking with flipper, closed-loop placement force control, patent-pending flux dipping station, up to 53 mm sq large-die handling capability, and advanced vision and lighting.
www.newport.com.
(September 17)

Hesse & Knipps Flip Chip Bonder
SAN JOSE, CALIF.
An ultrasonic flip chip bonder, FJ 510 from Hesse & Knipps is said to enable new possibilities for size and weight reduction in microelectronics assembly. The bonder consists of a wafer handling system, a four axis bond head and the substrate handling system. Wafers of 4, 6 or 8" can be processed. The chip is removed from the wafer by ejecting the die from the "blue tape" with a special eject head. The die collet is mounted on a flip arm capable of rotating the die 180 degrees. The substrate handling is said to consist of automatic product feeding to the preheat and bonding stations, temperature control and automatic unloading of bonding substrates.
www.hesse-knipps.com.
(September 16)

SUSS MicroTec Substrate Bonders
MUNICH, GERMANY
SB6e and SB8e from SUSS MicroTec are enhanced substrate bonders for the development of MEMS applications, compound semiconductors and advanced packaging. SB6e processes 6" substrates, while SB8e handles 8" substrates. Reportedly ideally suited for laboratories and small-series production, the bonders reportedly can facilitate high device yields by providing good process control. Both bonders offer more temperature and force uniformity than competitive tools, and can maintain 1.5 percent uniformity of temperature set point across the wafer, which is twice the rate of uniformity provided by competitive tools. The bonders are semiautomatic, computer-controlled, stand-alone systems that are said to feature rigid vacuum-pressure chambers, upper and lower independent heaters, and wafer-stack loading arms. Additionally, they can be equipped with tooling and alignment fixtures that support all known bonding processes.
www.suss.com.
(September 16)

Test Socket from Aries Electronics
FRENCHTOWN, N.J.
Aries Electronics offers a high-frequency center probe socket that features a floating guide plate with a built-in hard stop to help protect the probes during rest, and eliminating damage to the package leads. The test socket is said to be for automated handler testing and can be used for packages with a pitch of 0.50 mm or higher for devices up to 55 mm wide in applications with speeds from 1 to more than 10 GHz. The decoupling pockets of the center probe test socket reportedly can be placed within 1.0 mm of the probes. This allows the customer to place biasing or decoupling components next to the probes, resulting in less noise and faster test time. For mounting on and removal from the load board, the socket features solderless, pressure-mount compression spring probes, located by two molded plastic alignment pins and secured with four stainless steel screws.
www.arieselec.com.
(September 15)

Contact Probes from Ardent Concepts
HAMPTON, N.H.
Redundant Contact from Ardent Concepts is contact technology for RF testing of various package types including QFN packages, PCB, as well as all other CSP, flip chip, substrate and other packaged IC interconnections. Reportedly, the contact technology is a compliant wire-form interconnect technology that offers short test heights, low self-inductance, high bandwidth, and cycle life without the shortcomings of spring pins or conductive rubber. Additionally, the contact is said to have unparalleled performance in signal loss, and is capable of replacing high node count conductive elastomers or spring-pin sockets with a more consistent, lower force connection. The technology can accommodate various applications in area-array and peripherally leaded interconnect designs, and can achieve pitches of 0.25 mm.
www.ardentconcepts.com.
(September 15)

Wafer Bond Inspection from Phoseon
BEAVERTON, ORE.
An automated optical inspection system for advanced packaging applications, Phoseon's MX 1000 is a wafer-level seal inspection system for MEMS devices. The system reportedly uses company-developed vision enhancement algorithms in conjunction with appropriate wavelength light source-enabling inspection of not only seal defects, but also any device misalignment. The wafer bond seal inspection algorithm identifies bubbles, seal width and seal boundary. Additionally, the system can be configured to automatically inspect locations defined in a card file with user-defined pass/fail criteria, or be set up so that the system automatically steps to desired location but waits for an operator to determine pass/fail or each device. An output file of defects is said to be generated automatically during the inspection process.
www.phoseon.com.
(September 12)

Silicone Dispenser from EFD
EAST PROVIDENCE, R.I.
UltraSaver 1200 air-powered dispensing systems from EFD reportedly makes it easy to apply accurate, consistent amounts of thick room temperature vulcanizer (RTV) silicones without hand fatigue, rework or cleanup. This economical benchtop unit operates on compressed air and electricity, and uses controlled air pressure to apply RTVs and other thick assembly fluids faster and more uniformly than caulking guns, squeeze tubes and hand syringes. Using air power instead of hand power to dispense thick materials is said to eliminate awkward squeezing motions that can lead to Carpal Tunnel Syndrome and other repetitive stress injuries.
www.efd-inc.com.
(September 12)

Fine-pitch Bond Tester from Dage Precision
FREEMONT, CALIF.
Designed to meet the demands of testing ultra-fine-pitch wire bonded devices, Series 5000 Bondtester from Dage Precision Industries is reportedly capable of testing bonds at pitches of 50 micron and below. The series reportedly includes many advances such as leading-edge optical systems to help operators align and grade bonds, low-force transducer systems, and shear and pull tooling to minimize lead and ball damage. The tester offers many features including easily adjustable optics mounting, low-force/high-resolution load cartridges, "quick guard" load tools, borescope image system, high-precision X, Y sample manipulation, antivibration mount and cavity shear.
www.dageinc.com.
(September 11)

Nikon Measuring Instrument
MELVILLE, N.Y.
VMR-H3030 is the latest model in this company's NEXIV line of measuring instruments. Reportedly the fastest, most precise video measuring tool available, the system provides unsurpassed resolution and expanded work range ability. Built to serve as a laboratory's master instrument, it is said to offer superior measurement and versatility through the newly released VMR-Z120X Maximum Magnification Module, a dual optical system that delivers a range of magnifications from 36 to 4,320X. This advanced optical system provides a range of solutions from semiconductor wafer applications to mechanical geometric features. Additionally, the system offers stage scale resolutions that have been enhanced to 0.01 m and wide illumination options to ensure precise edge detection in complex parts.
www.nikonusa.com.
(September 11)

Scalable Automation Platform from Universal Instruments
BINGHAMTON, N.Y.
Polaris Jr. from Universal Instruments focuses on the lower end of robotic and nonrobotic assembly processes. Building on the success of Polaris Servo Gripper for odd-form component assembly and Polaris Multi-Process for combined final assembly operations, the platform reportedly offers single-process final assembly automation. These processes include dispensing, screwdriving and pick-and-place packaged onto a standardized tool interface, and use a pre-existing selection of more than 20 tool modules. The platform concept is said to have been applied to the new system in a unique way to allow cell sizes from 500 mm to 2.5 m while using common structure and controls. The benefit to the end-user is the economy of scale and faster lead time of a standard machine vs. complete custom cells.
www.uic.com.
(September 10)

X-ray Inspection from FeinFocus
STAMFORD, CONN.
An X-ray inspection system with microfocus sealed tube technology, FMS-080.20 is based on the company's .20 series system and reportedly is designed for contract manufacturers, failure analysis labs and other customers who require smaller systems with simpler functionality than the standard high-magnification microfocus units available. The proprietary sealed tube is said to operate at voltages up to 80 kV, with a maximum target power of 15 W, and offers a focal spot size of approximately 10 m. Because of the sealed nature of the tube, a vacuum system and separate high-power generator are not necessary, reducing maintenance, system weight and cost. Additionally, the system is suited for lead-free solder joint inspection.
www.feinfocus.com.
(September 10)

Micromanipulator Co. Portable Emission Microscope
CARSON CITY, NEV.
AFA-2000 Emission Microscope System is said to represent the latest technology in a compact and portable system suitable for analytical probe station, ATE tester or benchtop configurations for front and backside testing applications. The system is said to enable engineers to move their failure analysis work from the lab directly to the test floor. The NIR-enhanced CCD detectors produce a portable system for high-speed, functional testing. The microscope offers a 1.3 million pixel high-resolution low-noise camera with a pixel/binning option for higher sensitivity. Additionally, the fast frame allows easy focus and positioning in real time. The emission camera assemblies are available with three computer options: roll-around mini 19" rack mount, portable computer with ruggedized case, keyboard and mouse, or mini-tower standard computer with optional anthrocart.
www.micromanipulator.com.
(September 9)

Desktop Bonders from Unitek Miyachi Corp.
MONROVIA, CALIF.
A new series of desktop bonders, the Desktop Series reportedly uses pulsed heat technology and can be used for hot bar reflow soldering, ACF bonding, heat-seal bonding and heat staking. Additionally, the series is said to provide a versatile and reliable production method for joining flexible circuits, edge connectors, ribbon cables and PCMCIA connectors to PCBs or substrates. The bonders are modular systems that are designed for maximum flexibility and speed when making connections. The basic unit consists of a pulsed heat power supply, pneumatic bonding head and a quick connect block with thermo-plane thermode. All modules reportedly are mounted on an adjustable frame construction. The basic unit can be upgraded with a left-right or front-rear slide as well as a manual or pneumatic two-position index table.
www.unitekmiyachi.com.
(September 9)

BTU's Convection Belt Ovens
NORTH BILLERICA, MASS.
The Paragon series of convection belt ovens reportedly meets the thermal processing needs of advanced semiconductor packaging applications, especially where a highly uniform thermal reflow precision atmosphere control is needed. The series is said to be comprised of flexible, workhorse reflow ovens for multiple semiconductor packaging processes such as die attach, wafer bump reflow and curing. Additionally, the oven reportedly provides low oxygen ppm levels, low nitrogen consumption, a 400 degreesC maximum temperature rating for lead-free processing, and forced impingement convection for efficient and consistent heat transfer. The convection ovens have been custom configured for semiconductor packaging applications, including a 14" tunnel width with 1" product clearance option that can reduce the user's overall nitrogen consumption while increasing the purity of the atmosphere.
www.btu.com.
(September 8)

Probe Assembly from W.L. Gore
ELKTON, MD.
Designed as a high data rate alternative for the company's standard spring loaded probe pin interconnects, the 10 GHz probe assembly device is said to be suitable for use in automated test equipment, typically as an interface to the DUT board. The interface can be conformed to various signal ground patterns. It also provides the frequency required for testing next-generation high-speed chip sets. The probe assembly reportedly provides performance at higher frequencies with VSWR less than 1.35:1. The impedance of the probe interface varies by less than 3 Ù from 50 Ù with a 40 ps input signal risetime. Assembly insertion loss is approximately 1.8 dB per foot, with risetime degradation of less than 10 ps per foot. Ganged assemblies can be configured to contain any number of signals.
www.gore.com/electronics.
(September 8)

Polyimide Curing Tool from Despatch Industries
LAKEVILLE, MINN.
For increased productivity and throughput in electronics device and wafer-level packaging applications, the double chamber design of the Polyimide Curing Tool reportedly ensures tight control of process parameters. Available in versions to accommodate 150 and 200 mm wafers, the oven features a "chamber in a chamber" design that is said to reduce particulate contamination and oxygen concentration, while maintaining tight temperature uniformity (plus or minus 2.5 degrees C at 400 degrees C). The oven injects filtered nitrogen into the curing chamber, which flows down and surrounds the wafers to provide uniform distribution of heat and gas efficiency. The ultra-low particulate count and precise thermal control of the oven provides consistent process results and improved yields.
www.despatch.com.
(September 5)

Advanced Thermal Solutions Heat Sinks
NORWOOD, MASS.
Low-profile and high-performance, powerICE heat sinks reportedly optimize thermal management of PCB-mounted power modules in spatially constrained applications with inadequate airflow. Using the heat sinks is said to enable circuit designers to achieve higher PCB performance levels than possible with conventional, over-sized heat sinks, which may have excessive spreading resistance. Ideal for bypassed and unducted flow conditions, the heat sinks save space, and their light weight reduces cost by eliminating the need for supplemental mechanical mounting clips.
www.qats.com.
(September 5)

Fully Integrated SiP from ASAT Holdings
FREEMONT, CALIF.
ASAT Holdings' fully integrated system-in-package (SiP) is said to integrate multiple components into a single high-performance module. The package includes flip chip and wire bond assembly processes and spacerless stack die. Multiple mold cap configurations from 0.5 to 2.0 mm support various component geometries including crystal SAW filters and traditional surface mount passive components. Substrates include traditional multilayer BT laminate and higher performance lead frame solutions.
www.asat.com.
(September 4)

Mimot's Dip-flux Feeder
IRVINE, CALIF.
The Dip-Flux Feeder from Mimot reportedly facilitates flip chip assembly by accurately and precisely fluxing flip chips and other component types prior to placement. The feeder picks up a component from a waffle tray, stick feeder or tape feeder, and then dips the component, leads or BGA balls into the rotating flux bath. It then places the component or flip chip onto the board or substrate. The high accuracy of the system is said to enable it to pick pre-flipped flip chips. Component wetting occurs through precisely controlled movement and material control that ensures repeatability. A fixed squeegee in a rotating flux bath ensures constant flux wave height. Additionally, laser sensors detect approaching components and halt squeegee rotation for the duration of the dipping process.
www.mimot.com.
(September 4)

Novx Corp. Process Equipment Monitor
SAN JOSE, CALIF.
Series 6000 digital workstation and process equipment monitor reportedly now is capable of communicating with industry-standard particle counters and particle detectors with the ability to report data using RS485 and ModBus Protocols. Additional capabilities are said to include detection of field charge with automatic or manual decay testing, EMI magnitude and pulse counting, dual-channel ground monitoring, and operator voltage or body current detection. These features all have programmable alarm thresholds via a PC interface. The instrument is designed with a modular construction, allowing users to add optional plug-in process enhancements as required.
www.novxcorp.com.
(September 3)

Electroglas Test Handling System
SAN JOSE, CALIF.
Sidewinder from Electroglas reportedly is for production handling of packaged semiconductor components in panel or lead frame format, and the first strip test handling system based on 300 mm wafer prober technology, The tester is said to leverage the company's prober technology to deliver high throughput and accuracy for the final test market. Additionally, the system uses linear motor, air bearing stage technology that enables wear-free, frictionless performance at high speeds. Proprietary high-speed handling and machine vision deliver good strip-to-strip index time. The system can be equipped with a large thermal soak area, which provides wait-free testing, even at maximum throughput.
www.electroglas.com.
(September 3)

Backlit Calibration Station from GPD Global
GRAND JUNCTION, COLO.
The Backlit Calibration Station from GPD Global reportedly is for precise vision alignment prior to dispense. This feature is said to eliminate ghosting from dispensed dots as well as dot sheen when calibrating materials with reflective properties, and results in a more accurate dispense outline for the vision alignment system calibration. Backlit calibration is said to be capable of being combined with topside lighting for additional alignment control. A continually refreshed calibration area is made possible by an auto feed paper system.
www.gpd-global.com.
(September 2)

DL Technology's Updated Encoder Count
HAVERHILL, MASS.
DL Technology's enhanced encoder count on their Micro Valve, reportedly increases the precision and repeatability for micro volume dispensing applications The programmable encoder, which reportedly controls rotation of the auger, has been modified to provide 200,000 counts per 360º revolution, more than three times the count of the standard encoder. This is said to allow the valve to repeatably dispense 5.5 mil volumes, depending on material and application requirements. The valve is said to be the only one on the market that can deposit repeatable micro volumes using a standard dispensing platform, making it ideal for high-density interconnect, optoelectronics and semiconductor packaging applications.
www.dltechnology.com.(September 2)

Cognex Retrofit Kit
NATIC, MASS.
In-Sight 1700 Series Prober Retrofit Kit reportedly reads alphanumeric and 2-D matrix codes for the purpose of tracking wafers through the production process. The enhanced code reading and networking capabilities of the wafer readers reportedly can benefit the fab by increasing prober performance and useful life for a high return on investment. The reader's algorithms and electronically-controlled lighting are said to improve wafer ID efficiency by reducing no-reads on hardmarked, softmarked or super-softmarked codes that have been degraded by process effects.
www.cognex.com.
(August 29)

Kester Solder Spheres
DES PLAINES, ILL.
Ultra-Spheres are reportedly engineered to resist surface darkening induced by transit tumbling as well as ball placement equipment. Surface-darkening resistance reportedly eliminates vision systems error readings that may result in the unnecessary scrapping or rework of acceptable product. The sphere distribution is said to exceed industry expectation and eliminates unwanted sphere sizes, as well as supports high-yielding ball-attach processes. The spheres are available in many solder alloys, including eutectic tin/lead and high lead typical for ceramic BGA packages, as well as many lead-free solder alloys. Additionally, a range of sphere diameters for BGA and CSP ball-attach applications are available from 0.012 to 0.035". Kester, Northrop Grumman Corp
www.kester.com.
(August 29)

Electroglas Probing Technology
SAN JOSE, CALIF.
Electroglas' NETprobing technology delivers a networked system of "smart" probers that reportedly improves overall test floor efficiency through remote monitoring and control, as well as automated data collection, analysis and reporting. This functionality, dispersed across a sort floor, can help chipmakers get faster answers to critical questions about device quality, manufacturing performance and corrective action needed. Additionally, the technology is said to allow sort floor managers to view the status of and take control over any wafer prober, worldwide, from their desktops. Yield and bin information can be tracked, machine status monitored, live video images viewed and probing recipes changed from a Web-based user interface.
www.electroglas.com.
(August 28)

Newport Corp. AP Die Bonder
IRVINE, CALIF.
Providing advanced assembly solutions for epoxy die attach, eutectic and flip chip bonding, Newport's MRSI-605 AP Advanced Packaging Die Bonder is targeted to end users in the semiconductor and electronics packaging markets, including manufacturers of MEMS, advanced semiconductor packages, MCMs and more. The granite platform supports the placement head from above so that no mechanisms are cantilevered, reportedly providing optimal stability. The thermally and mechanically stable machine delivers 10 μm placement accuracy. Additionally, the six head "feather-touch" tool turret is said to deliver increased cycle rates in die bonding and component assembly processes. This enhancement makes six separate tools constantly available on the robot heat, allowing tool change to occur on the fly while moving from process point to process point.
www.newport.com.
(August 28)

ASAT Holdings Ltd. System-in-Package
FREMONT, CALIF.
ASAT's fully integrated system-in-package (SiP) reportedly integrates multiple components into a single, high-performance module. The SiP includes flip chip and wire bond assembly processes and spacerless stack die. Multiple mold cap configurations from 0.5 to 2.0 mm are said to support various component geometries, including crystals, SAW filers and traditional surface mount passive components. Substrates include traditional multilayer BT laminate and higher performance and lower cost lead frame solutions using the company's TAPP or LPCC.
www.asat.com.
(August 25)

W. L. Gore & Associates Microvia Material
ELKTON, MD.
W. L. Gore's MICROLAM 630 dielectric is said to be the lowest-loss microvia material affording the best cost/performance solution for high-frequency microvia modules and PCBs. This high-performance material consists of standard BT resin in a continuous toughening matrix. The dielectric reportedly provides thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities and surface planarization for high-density applications. Its low dielectric constant (2.6) and low tangent (0.004) are stable throughout a range of frequencies (1 MHz to 40 GHz) and temperatures (-55° to 200°C). Additionally, its low dielectric constant allows thinner dielectric layers, offering improved microvia aspect ratios and laser drilling throughput three times faster than glass prepegs.
www.gore.com/electronics.
(August 25)

Milara Inc. Ball Placement System
MEDFIELD, MASS.
A ball grid array placement system, Milara's BGA-2000 is a large manual desktop BGA placer for rapid as well as low-volume prototyping. Reportedly marketed to the packaging field, the system is for fluxing and placing BGAs on semiconductor packaging. Low cost with a manual hand print function, the placer features quick setup for both ease of use and quick cleanup. Additionally, it is said to be capable of holding up to a 12 x 12" stencil. The system can handle compact desktop design as well as X, Y, Z and Theta height adjustments. With a print area of 8 x 10", the placer offers registration repeatability of ± 0.0005", X-Y adjustment of ± 0.750" and Theta adjustment of ± 10°. The system also features a hand squeegee and is simple to use.
www.milarasmt.com.
(August 21)

Thermagon Inc. Thermal Gap Filler
CLEVELAND, OHIO
Thermagon's T-flex 200 V0 Series is said to be a cost-effective commercial grade gap filler that meets the UL 94 V0 flammability rating. The material combines good thermal conductivity with high compressibility to produce even lower thermal resistance than its predecessor, T-flex 200. Additionally, the filler is tacky and reportedly does not need an additional adhesive coating that can inhibit thermal performance. It is available in thicknesses of 20 to 200 mil, and is electrically insulating. Applications for the material include plasma display panels, RDRAM memory modules, high-speed mass storage drives and wireless communication hardware.
www.thermagon.com.
(August 21)

Kester, Northrop Grumman Corp. Capillary Underfill
DES PLAINES, ILL.
Kester, Northrop Grumman Corp.'s SE-CURE 9208 capillary underfill is targeted for the fast throughput assembling of flip chip devices on rigid and flexible substrates. A filled one-component, snap cure underfill epoxy material, it reportedly exhibits good strength properties with a wide, robust process window, which increases the reliability of flip chip interconnections through stress management. Through elimination of resin bleedout, the material is said to allow for a more uniform, void-free encapsulation under the die for gaps of 0.001 to 0.005". Additionally, the underfill is readily compatible with flexible or rigid printed wiring board surfaces as well as ceramic substrates and a variety of die passiviations.
www.kester.com.
(August 20)

GPAX Packaging and Feeding System
COLUMBUS, OHIO
A tape-and-reel packaging and feeding system that is versatile enough to handle delicate mechanical components, GPAX's TekPAX is said to protect components by placing each one in a custom-designed tape carrier. Because the components are packaged separately, they do not interact with each other, preventing scratching, nesting and damage, which is critical for components that interlock. On the production floor, the reel, or "ammo box", packaging reportedly allows operators to staple splice the tape together and then deliver parts seamlessly through the component feeder system. The dimensional capability of the system ranges from less than 0.5 to 8" long. With increased sensitivity to component integrity, the system offers wrapped automation-friendly packaging of delicate components.
www.gpax.com.
(August 20)

Juki Automation Systems High-speed Mounter
MORRISVILLE, N.C.
A high-speed flexible mounter, Juki Automation Systems' KE-2060 provides one multi-nozzle laser head with four nozzles and one high-resolution head for fine-pitch component placement. Reportedly enabling quick programming and fast changeover, the system can deal with any board type and bill-of-materials, especially the fine-pitch or odd-shape components prevalent in today's boards. Additionally, the machine is said to provide a dual component recognition system using both vision and laser technology. The mounter's vision centering system features bottom, side and back lighting for both ball and split recognition. A 1,024 x 1,024 pixel high-resolution camera option provides a wider range of component handling at higher accuracy than previous models. The machine is capable of placing up to 12,500 cph for the multi-nozzle laser head and up to 1,850 fine-pitch IC component placement for its high-resolution laser head. Component size placement capabilities range from 0201 to 50 x 150 mm.
www.jas-smt.com.
(August 19)

YESTech X-ray Inspection
SAN CLEMENTE, CALIF.
YESTech's YTX-3000 is a high-resolution X-ray inspection system that is said to enable electronics assemblers and semiconductor packagers to reduce costs, improve quality and increase throughput. Based on the company's proprietary machine vision software, which includes real-time sharpening, the system offers fully automated inspection of BGA and flip chip devices, solder joint quality, die attach, bond wires and electronics assembly verification. Additionally, the system's X-ray tube features a 5 µm spot size for high-resolution image quality. It is available with a four- or five-axis manipulator with 18 x 20" X-Y travel for samples weighing up to 5 lb. The system also offers 360° of sample rotation, and an optional 30° title for oblique views. Stepper motor drives reportedly provide a range of motion, from ultra-slow use at high magnifications to high speed for travel over longer distances. All systems come with a control module and programmable motion for automated inspection.
www.yestechinc.com.
(August 19)

Metcal Array Package Rework
MENLO PARK, CALIF.
Metcal's APR-5000-XLS Array Package Rework System is for large-to-small PCBs and is designed for the precise rework of a range of component types, including BGA, CSP, LGA, micro SMD, MLF and bumped chip component packages. The system reportedly is capable of handling boards 24.5 x 24.5" and up to 0.25" thick. Using the same design technology as the APR-5000, this system uses a single reflow/placement head and a stationary PCB that is centered over enhanced, dual-stage preheaters capable of handling both large and small boards. With the use of five thermocouple inputs and closed-loop RTD temperature control, the system is said to allow for meticulous temperature control across a rework area of up to 0.25" thick. Able to remove and replace components down to 0.020 x 0.010", the system uses motorized control of X, Y, Z and Theta axis for adjustability.
www.metcal.com.
(August 18)

GOEPEL Electronic GmbH Dual-mode System
JENA, GERMANY
GOEPEL Electronic's combination of automated optical inspection (AOI) and boundary scan test technologies reportedly has been enhanced for use in an in-line production environment. The amalgamation of two test technologies in a single system allows fault detection that cannot be identified by AOI alone. Particularly, the system is said to be capable of testing hidden solder joints on complex components such as BGAs. The combined system consists of the company's boundary scan software and hardware integrated into their OptiCon AdvancedLine and SpeedLine in-line AOI systems. A universal contactor connects power supplies and the JTAG bus to the unit under test (UUT) in an in-line process. Test coverage is extended by a test probe mounted on the camera for checking boundary scan IC pins that do not have any connections to other boundary scan pins. A fully programmable power supply monitors the UUT's power consumption during testing.
www.goepel.com.
(August 18)

Unaxis Semiconductors Dry Etch Tool
ST. PETERSBURG, FLA.
A concept in ICP dry etch equipment technology for 65 nm mask making, Unaxis Semiconductors' Mask Etcher IV reportedly provides good ICP process solutions over previous Gen 3 systems, including the industry's best particle control, ultra-low CD etch bias, CD uniformity and feature size linearity. It is said that process performance results commensurate with 65 nm mask technology requirements, which are ahead of the ITRS Roadmap.
www.unaxis.com.
(August 15)

Cognex Training/Inspection Upgrade
NATICK, MASS.
Cognex expanded the capabilities of its VisionPro PC-based machine vision systems with the addition of vision software tools. The tools are said to reduce setup time, improve process yield and provide new options for pattern training in a range of semiconductor and other manufacturing applications that require general-purpose machine vision for inspection, measurement, identification and guidance. In addition to a full array of machine vision software, the upgraded suite now includes Synthetic PatMax, which is object location software. When an acquired image is unavailable or unsuitable for training, this can generate reference models without relying on image data. Also, the suite includes PatInspect, which is said to be a fast and accurate defect detection tool that locates objects with high precision under a range of conditions and then detects differences in the object compared to the trained image.
www.cognex.com.
(August 15)

Dimensions Consulting Elastomer Socket
SANTA CLARA, CALIF.
Providing higher speed with an inductance of 0.1 nH, Dimensions Consulting's sockets reportedly are for high-frequency (beyond 15 Ghz), mixed-signal and low-voltage applications. Additionally, the socket is said to be suited for customers looking for the low inductance of an elastomer socket but with higher insertion rates than are typical for this type of socket. Other elastomer sockets generally break down after 100 to 2,000 insertions; however, this line gives an average of 50,000 to 200,000 insertions.
www.dci-us.com.
(August 14)

KIC Thermal Shield Solutions
SAN DIEGO, CALIF.
KIC's thermal shield solutions in various sizes and models fit individual shielding needs. The standard thermal shield is 1/8" thick and is shipped with all SlimKICs. Additionally, the 1/4" shield is available and reportedly offers better thermal protection than the standard shield. The next shield type — the Low-Rider — is a SlimKIC cover that is for processes that have low height clearance and where the standard shield is too tall to pas through. This shield reportedly can be used in combination with other shields to provide added thermal protection. The Lead-free shield is the largest thermal shield and is designed for long duration — 30 to 60 minutes. Like both the standard and 1/4" shields, this is said to be capable of withstanding temperatures up to 300°C.
www.kicthermal.com.
(August 14)

Cascade Microtech Test Probe
BEAVERTON, ORE.
Cascade Microtech's 110-GHz Infinity Probe is said to be the first characterization probe that offers both high-frequency performance and low, stable contact resistance on aluminum pads. The contact area of the probe tips is approximately 12 x 12 µm, allowing probing of pads that are less than 50 x 50 µm. Additionally, after a single touchdown, the series enables the extraction of the equivalent circuit parameters of devices and structures that are the most sensitive to contact resistance variation: inductors, capacitors and interconnects.
www.cascademicrotech.com.
(August 13)

Cadence Design Systems Design Software
SAN JOSE, CALIF.
Cadence Design Systems' Cadence 15.0 PCB and IC packaging design environment reportedly includes enhancements and innovations spanning the integrated flow. Additional advances that are said to enhance productivity include a new capability for the automated design of stacked-die SiPs; unified and automated library part creation, validation and management; dynamic, real-time copper pour, plow and editing; and advanced simulation capabilities for signal integrity model verification. The multiple stacked-die design and editing environment and an automatic wire bond creation capability are said to speed the design process, helping manufacturers get products to volume production quickly.
www.cadence.com.
(August 13)

Kinetic Systems Optical Tables
BOSTON
Kinetic Systems' Large Optical Tables are constructed to exacting standards and provide users a flat, stiff, highly damped surface with high natural frequency. Ranging in size to 6 x 16', with larger sizes available on request, the tabletops are designed with a honeycomb core and feature the company's proprietary Spillpruf design. The tables are available in four performance levels: Optilane is for critical research applications; Labplane is for precision laboratory procedures; Valuplane is for applications in which vibration is nominal to low; and Econoplane is for minimal to low vibration environments but has a thinner top skin.
www.kineticsystems.com.
(August 12)

Cookson Electronics Equipment Microdot Dispenser
FRANKLIN, MASS.
Cookson Electronics Equipment's Camalot XyflexPro Dispenser features a proprietary dabbing process that reportedly offers manufacturers building devices, such as SiPs, WLPs, 0201s and more, a cost-effective, accurate method of dispensing dots as small as 150 micron in diameter at high-volume production rates. The advanced machine controls are said to enable the dabbing process, in which a small volume of material is built up onto the tip of the needle. The size of this meniscus is controlled accurately by a high-resolution dispense unit. Additionally, the dispenser's high-accuracy gantry and CCD laser height sensor control the needle gap from the substrate. The combination of these actions produces repeatable microdots that are as small as half of the needle's diameter. Using this process, 6 mil dots can be dispensed with 27 to 28 gauge needles.
www.cooksonee.com.
(August 12)

Multi-Seals Epoxy Preforms
MANCHESTER, CONN.
Multi-Seals' Uni-form epoxy preforms are available in a low-cure temperature epoxy called DC-202LT. The preforms are said to cure in as fast as five minutes at 175°C or at temperatures as low as 100°C for two hours, making the epoxy ideal for sealing components that cannot withstand the cure temperatures of typical heat-activated epoxies. The faster cure also is a benefit for large-scale sealing operations that require quicker cure schedules. An additional advantage reportedly is that the preforms maintain low flow during cure. The high viscosity provides a greater control of epoxy movement, which prevents the sealant from covering unwanted areas of a component. The preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from contaminants.
www.multi-seals.com.
(August 11)

Amkor Technology Test Solution
SAN JOSE, CALIF.
Amkor Technology's RF test platform, RFt, reportedly offers RF chipmakers a decreased cost of production test when compared to traditional test solutions. The platform is said to be for low complexity RF devices because it does not have the unnecessary functionality and features that typically are included with traditional larger test systems. Additionally, inherent with the platform is a set of proprietary RF test techniques that reportedly shorten test development time, as well as the resulting production test time, while maintaining required test coverage and accuracy.
www.amkor.com.
(August 11)

Aries Electronics Test and Burn-in Socket
FRENCHTOWN, N.J.
Aries Electronics' BGA/CSP test and burn-in socket is for devices with pitches from 0.50 mm and larger in applications of up to 1 GHz. The socket is said to feature a standard molded socket format that can accommodate any device package up to 13 mm2. Designed for test and burn-in of CSP, microBGA, DSP, LGA, SRAM, DRAM and flash devices, the socket reportedly incorporates solderless pressure-mount compression spring probes located by two molded plastic alignment pins and secured with four stainless steel screws. This makes for easy mounting to and removal from the burn-in board. The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness.
www.arieselec.com.
(August 8)

Kulicke & Soffa Industries Hub Blade
WILLOW GROVE, PA.
Kulicke & Soffa Industries' Nova hub blade enables the dicing of various low-k wafers with high yield and good productivity, using current dicing equipment and practices. By incorporating specific formulations of diamond concentration and nickel bond, the blade reportedly addresses the needs of various low-k wafers to minimize chipping and peeling during the dicing process. High yields are said to be achieved even while advancing wafers through the process at standard production feed rates.
www.kns.com.
(August 8)

FeinFocus X-ray Inspection Technology
STAMFORD, CONN.
FeinFocus' TIGER (FXS-160.40) X-ray system is said to offer proprietary true X-ray intensity (TXI) control to assist operators in identifying production anomalies with 100 percent consistent X-ray images. Unlike conventional techniques for maintaining image consistency that control the input level of high-voltage and X-ray tube current, the technology reportedly controls the output level of X-ray intensity automatically during the image acquisition process to guarantee stable and permanent image quality. Additionally, the technology provides immediate and steady X-ray intensity after auto-start, long-term stability of X-ray intensity, constant image contrast and brightness for recurring inspection tasks, repeatability during automated BGA analysis routines, and more.
www.feinfocus.com.
(August 7)

Palomar Technologies Wire Bonder
VISTA, CALIF.
A high-speed thermosonic ball-and-stitch wire bonder, Palomar Technologies' Model 8000 is said to be capable of placing eight wires per second with a table repeatability of better than ±5 µm. With a 12 x 16" X-Y bond area, the bonder can handle large hybrids, MCMs or several smaller devices simultaneously. A combination of the advanced Cognex 8000 vision system and dual-source programmable LED lighting reportedly facilitates accurate targeting and placement. This level of accuracy, along with highly repeatable ball formation, enables tight spacing between wires. Typical uses for the bonder are wire bonding for microelectronic packaging, including most semiconductor-based interconnect applications.
www.palomartechnologies.com.
(August 7)

TRUMPF Laser Marking System
FARMINGTON, CONN.
A precision laser marking system, TRUMPF's VectorMark compact 6 is said to achieve high-quality, high-contrast marks on most plastics and synthetic materials without requiring additional additives to the materials. The system's UV wavelength is advantageous in applications such as marking electronics components, in which added pigment might change the materials' dielectric properties. The frequency-tripled, diode-pumped, solid state laser system reportedly laser marks plastics at a higher quality and faster processing speeds than traditional plastics marking. Additionally, the system's UV wavelength increases the range of synthetic materials that can be marked with high quality and contrast.
www.us.trumpf.com.
(August 6)

Pac Tech USA Electroless Bumping Equipment
SANTA CLARA, CALIF.
A fully automatic, wafer-level electroless nickel/gold (Ni/Au) bumping system, Pac Tech USA's PacLine 200-A50 is said to provide high throughput with an average processing time of 20 minutes, which translates into 150 200 mm or 75 300 mm wafers per hour. The system is fully integrated and modular, and consists of input and output stations, a robotic handling system, an online central computer control unit, SPC, process data storage and more. The system reportedly addresses the need for low-cost electroless Ni/Au bumping of 300 mm wafers. Additionally, it is capable of handling dual batches of wafers of differing sizes for multiple batch processing.
www.pactech-usa.com.
(August 6)

Cookson Electronics Equipment Multi-piston Dispense
FRANKLIN, MASS.
Providing positive displacement and digital control, Cookson Electronics Equipment's Multi-Piston Pump provides repeatable dispense precision of ±1 percent at three standard deviations with no need for weight scale correction. Because the pump uses multiple pistons, it reportedly does not require a recharge step, allowing for maximum throughput regardless of dispense volume. Additionally, carbide inserts allow for the use of abrasive encapsulants and underfill materials. The pump is said to feature a quick-disconnect fitting for easy attachment/detachment, allowing a production line to resume operation quickly, and parts can be cleaned off-line to avoid delay. The pump is flexible and can dispense volumes to less than 1 mg, making it suitable for CSP and flip chip underfill applications, in addition to encapsulation.
www.cooksonelectronics.com.
(August 5)

Royce Instruments Pick-and-Place System
NAPA, CALIF.
Royce Instruments' A45 pick-and-place system is available for 300 mm wafers. Reportedly low-cost, the automatic system is wafer map capable. Options include visual inspection, die flipping and electrical test. Additionally, the high-speed vision processor can perform die visual inspection of several die simultaneously. Die then are picked and transferred to test stage, gel pak, waffle pak or film frame. DieSort Manager is a Windows-based user interface application that is said to control machine setup from process recipes and networks the system to device map databases. Menu-driven programming enables quick product changeover.
www.royceinstruments.com.
(August 5)

Motorola Packaging Solution
TEMPE, ARIZ.
Motorola's power quad flat pack no-lead (PQFN) package is said to boost silicon performance by eliminating limitations of existing packages. The surface mount package is designed to meet the high-power dissipation requirements of automotive, industrial, commercial and marine applications. Additionally, the package reportedly provides advantages over existing QFP no-lead packages and other existing power IC packages, including: leadless package replaces existing larger, axial leaded packages; proven solder joint reliability when surface mounted to PCBs; cost-effective solution for multichip power products; environmentally preferred packaging materials; MAP process allows electrical and physical flag isolation of multiple die; design and process flexibility in a common surface mount form factor; good thermal performance with 20 mil thick copper lead frame; and low contribution to electrical on-resistance.
www.motorola.com.
(August 4)

Particle Measurement Systems Parts Testing Station
BOULDER, COLO.
Particle Measurement Systems' SURFEX-100 is a particle extraction system for monitoring and qualifying part cleanliness. The system is an integrated testing station that reportedly measures the particle levels on complex parts. Additionally, it combines ultrasonic extraction, particle measurement, high-purity fluidics and automated software control to save time and increase throughput. The system is said to lower parts testing cost by increasing sample throughput up to 10X over traditional manual methods. Test recipes and menu-driven software eliminate data variability caused by human error. Highly reliable data with low sample-to-sample variation is ensured by establishing accurate particle baseline levels.
www.pmeasuring.com.
(August 4)

Silecs Non-porous Dielectric Materials
SAN JOSE, CALIF.
Silecs' non-porous low-k and ultra-low-k dielectric materials reportedly process like CVD TEOS while providing the extendibility of spin-on low-k materials, offering a range of k-values from 2.2 to 3.0 in a non-porous film. Integration has been proven through unit processes such as etch, ash and CMP, and in subtractive aluminum via chain structures. The materials are said to allow IC device manufacturers to produce faster chips that consume less power, while reducing their capital expenditures and cost of ownership. Additionally, the materials reportedly solve the numerous problems associated with porous dielectric films. To attain k values below 2.6, most other low-k materials must incorporate 20 to 50 percent porosity.
www.silecs.com.
(August 1)

Manufacturing Control Systems Process Management Software
LAWRENCE, MASS.
Developed by manufacturing engineers for OEM and contract manufacturers looking to improve factory performance, process control and communication, Manufacturing Control Systems' Operations Control software is said to provide a flexible yet innovative people-based factory management solution. The application reportedly tracks downtime, efficiency, changeovers, and other business rules such as paste measurements, checklists and inspections. Additionally, the software provides a real-time view to the factory internally or through the Web. The system includes an integrated notification system and more than 60 data and graphical reports detailing performance.
www.MCSystems.biz.
(August 1)

W.L. Gore & Associates Plug-compatible Cable Assemblies
ELKTON, MD.
W.L. Gore & Associates' Eye-opener 6 product family reportedly brings high bandwidth density down to the pins on a backplane connector. Low crosstalk preserves the eye pattern opening so that the cable assemblies produce the widest eye patterns available in a high-density 2 mm system. Additionally, the assembly product family can mate directly to daughter cards and backplane connectors. The family consists of Eye-opener 1 through 6, and each is said to offer low loss, low crosstalk and low skew. Additionally, the assemblies are scalable in size and performance, as well as being compatible with Teradyne Connection Systems (VHDM-HSD).
www.gore.com/electronics.
(July 31)

Kester, Northrop Grumman Corp. Capillary Underfill
DES PLAINES, ILL.
Kester, Northrop Grumman Corp.'s Se-cure 9208 capillary underfill is targeted for the fast throughput assembling of flip chip devices on rigid and flexible substrates. A filled one-component, snap cure underfill epoxy material, it reportedly exhibits good strength properties with a wide, robust process window, which increases the reliability of flip chip interconnections through stress management. Through elimination of resin bleedout, the material is said to allow for a more uniform, void-free encapsulation under the die for gaps of 0.001 to 0.005". Additionally, the underfill is readily compatible with flexible or rigid printed wiring board surfaces as well as ceramic substrates and a variety of die passivations.
www.kester.com.
(July 31)

JPSA Blue LED Wafer Scribing
NEW HOLLIS, N.H.
JPSA's ChromaDice UV diode-pumped solid-state laser system is said to deliver high-speed blue LED wafer scribing with typical yields greater than 99 percent. This system cuts a well-defined, square chip with consistently narrow cuts as small as 5 µm. With its high throughput ¿ up to 8 wafers per hour ¿ and minimal impact on LED performance, the process reportedly is tolerant of wafer warp and bow, and delivers fast scribing speed compared to mechanical scribing. With the system, there are no process consumables; higher yields are achieved at lower operating costs, with full automation possible. A single operator can run multiple systems with no impact on process yield. Additionally, automatic alignment is less than one minute to load and align with the laser's optical system.
www.jpsalaser.com.
(July 30)

Dymax Corp. UV Spotlight Curing
TORRINGTON, CONN.
Dymax Corp.'s ADAC Cure Spot 50 UV spot curing system is low maintenance, easy to use for both lab evaluation or benchtop assembly and comes with a two-year warranty. A bulb warranty of 2,000 hours and bulb life expectancy of 4,000 make the system economical. Additionally, with an intensity of 3,000 mW/cm2 and broad spectrum output in the UVA and blue light spectrum, the system reportedly is powerful enough to cure most UV adhesives in less than 10 seconds. Recommended for use in manual applications, the cure system is for electronics assembly and other industrial spot curing applications.
www.dymax.com.
(July 30)

Asymtek Dispense Platform
CARLSBAD, CALIF.
Asymtek's Dynamic Dispense Control (DCC) feature is available on the Axiom X-1020 platform series, and is said to offer precise and flexible control parameters through closed-loop servo technology. Novice users reportedly can benefit from the simple user interface, and the more advanced user can utilize the more powerful features, such as the patented Mass Flow Calibration and linear pump technology. The position of the dispense pump motor is controlled using Fluidmove for Windows NT software and a PID controller for accurate dispensing of dots and lines. Through the use of encoder control and feedback from the dispensing pump, the user can program the start up and ending ramp speeds of the pump, and accurately determine how many encoder counts the pump is allowed to turn. This high level of pump control allows for each dispense to be optimized for speed, accuracy and yield.
www.asymtek.com.
(July 29)

Asyst Technologies Equipment Information Bridge
FREMONT, CALIF.
Asyst Technologies' GW Equipment Information Bridge (GWEIB) is said to give fabs up-to-date, real-time data by implementing equipment models that allow concurrent access to equipment information by fab applications. SEMI standards currently define the equipment model and information access concept. These object-based standards preserve the legacy of SECS/GEM interface, while simultaneously supporting the implementation of advanced manufacturing application capabilities such as e-diagnostics, SPC, APC and Run-to-Run Control .The bridge reportedly is flexible and adapts to existing automation solutions, both front- and backends, including assembly and test. Additionally, the tool integrates with traditional station controllers and non-SECS equipment, in which access to information remains critical but time consuming. With the bridge, multiple commercial communication protocols are supported, providing flexible control systems integration.
www.asyst.com.
(July 29)

Newport Corp. Die Bonder
NORTH BILLERICA, MASS.
A next-generation die bonding product offering, Newport Corp.'s MRSI-605AP Advanced Packaging Die Bonder reportedly provides advanced assembly solutions for epoxy die attach, eutectic and flip chip bonding. The bonder is targeted to end users in the semiconductor and electronics packaging markets. The design is said to be based on the high-performance industry standard MRSI-505 platform. The solid granite platform supports the placement head from above so that no mechanisms are cantilevered, providing optimal stability. Additionally, the thermally and mechanically stable machine delivers 10 µm placement accuracy.
www.newport.com.
(July 28)

Kester, Northrop Grumman Corp. Reflow Encapsulant
DES PLAINES, ILL.
A reflow encapsulant material intended for flip-chip-on-flex applications, Kester's SE-CURE 9110 is a single component liquid epoxy-based flux and underfill encapsulant. Said to eliminate process time associated with traditional underfill process methods through an innovative compression flow technique, the material allows processing of normal surface mount component packages concurrently with flip chips in a single reflow profile. Additionally, the encapsulant reportedly provides a robust resin system that is both a eutectic and lead-free assembly solution with one material; mechanical properties that are optimized to provide reliability and mechanical shock protection; proven performance in touch applications; and more.
www.kester.com.
(July 28)

Shipley EIF Thick Film Liquid Photo Resist
MARLBOROUGH, MASS.
A thick film plating resist for wafer bump imaging applications, Shipley EIF's BPR-100 reportedly produces a thick resist coating in a single spin. This increases overall tool productivity, reduces materials costs and eliminates defects associated with multilayer coatings. The ability to apply 70 to 100 µm thick resist in a single-spin cycle is said to eliminate the need for "mushroom" plating and produces a more controlled bump footprint for reduced pitch designs in high-density applications. The resist also features a 1:1 resolution with standard coating, imaging and developing tools.
www.shipley.com.
(July 25)

Tru-Si Technologies Transfer Station
SUNNYVALE, CALIF.
Tru-Si Technologies' NoTouch Transfer Station is said to enable the automatic loading and unloading of wafers in and out of cassettes and wafer stacking pods. The fully integrated robotic end-effector permits automatic handling of flexible ultra-thin to rigid full thickness wafers without physical contact. Silicon, GaAs, InP, other fragile materials and uneven surfaces reportedly all can be handled within the same unit. The station is configured with an input position, an output position and a pod for separator storage. Wafers can be aligned optionally as they are moved from the input to the output stations. Automatic wafer detection in a cassette, cross-slotted wafers, wafers in a pod, separators in a pod and foam in a pod are all incorporated into the design.
www.trusi.com.
(July 25)

W.L. Gore & Associates Microwave Coaxial Assemblies
ELKTON, MD.
A family of custom microwavable assemblies in frequency ranges from DC through 67 GHz, W.L. Gore & Associates' Next Generation and Phaseflex assemblies are said to be suited for test applications, providing good phase and amplitude stability. Next Generation microwave test assemblies reportedly enhance the capabilities of vector network analyzer test equipment by extending measurement accuracy and repeatability. Their ruggedized construction allows the assemblies to be limp and flexible while still maintaining a crush resistance of 800 lbs per linear inch. Phaseflex microwave test assemblies, available up to 67 GHZ, were designed with laboratory and production applications in mind. They reportedly provide good phase and amplitude stability with flexure and over a temperature range. The assemblies also incorporate an internally ruggedized construction while remaining lightweight and flexible.
www.gore.com/electronics.com.
(July 24)

Thermoset, Lord Chemical Products Silicone Encapsulant
INDIANAPOLIS, IND.
Thermoset, Lord Chemical Products' MS-330 is a one-component, low modulus silicone encapsulant with good electrical insulation properties. It has a low dielectric constant of 2.8, reportedly making it ideal for coating electronic devices. Black in appearance, the encapsulant can be dispensed manually or by automatic equipment. The material is said to have been developed for high-frequency applications as well as coating and protecting electronics devices on polymeric and ceramic substrates. Additionally, the encapsulant exhibits a controlled flow during application, which makes it ideal for glob-top applications.
www.thermoset.com.
(July 24)

QPL Adhesion Enhancement Process
HONG KONG
Delivering moisture-sensitive level improvement to existing copper-based lead frame packages without requiring design or material changes, QPL's Adhesion Enhancement reportedly helps prevent the occurrence of "popcorn" failures associated with moisture absorption of the mold compound. Unlike additive processes that affix a coating to the lead frame surface and may require masking, the enhancement process is said to be a subtractive process that enhances the adhesion of the lead frame pad to the mold compound without masking, and is compatible with all types of mold compounds. The process is free of contaminates, foreign material, coatings and other corrosive ionics, eliminating future reliability and performance concerns while improving yield when compared to additive processes.
www.qpl.com.
(July 23)

March Plasma Systems Plasma Treatment System
CONCORD, CALIF.
Capable of both direct and downstream ion-free plasma processing for treating a range of semiconductor devices, March Plasma Systems' FlexTRAK is said to be the only commercially available, high-throughput plasma system with flexible gas dynamics. The system is for high-speed, in-line manufacturing operations, and for standalone configurations, where one plasma station supports an island or group of equipment. Its architecture reportedly accommodates various products from individual strips to magazine carriers for flip chips or CSPs. Additionally, the platform can be integrated with a wafer handling robot for treating wafers up to 300 mm or configured with other magazine/strip handling equipment. With throughput capability of 480 substrates per hour, the system's three-axis symmetrical chamber and proprietary process control provide unmatched treatment uniformity and short-cycle times.
www.marchplasma.com.
(July 23)

Aries Electronics Side-stackable BGA Socket
FRENCHTOWN, N.J.
Designated the Pin-Ball Socket, Aries Electronics' BGA socket device can be soldered side-by-side, directly to the existing footprint of a PCB. The surface mount BGA and LGA socket is said to provide 2 mm of clearance for end components and can be used for 1.00 and 1.27 mm pitch packages up to 50 mm in any footprint and on any size board. The socket incorporates the company's spring probe technology, with a spring force of 17 g at 0.25" defection. Additionally, the socket uses an Ultem insulator with stainless steel hardware, and is available with a metal cover or customized aluminum heatsink. The spring is Be/Cu alloy and the pins are gold-plated brass alloy.
www.arieselec.com.
(July 22)

W.L. Gore & Associates Microvia Material
ELKTON, MD.
W.L. Gore & Associates' MICROLAM 630 dielectric is designed for high-frequency microvia modules and PCBs. This material consists of standard BT resin in a continuous toughening matrix. Additionally, the material reportedly provides good thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities and surface planarizations for high-density applications. Its low dielectric constant (2.6) and loss tangent (0.004) are stable throughout a range of frequencies (1 MHz to 40 GHz) and temperatures (-5.5° to 200°C). Also, its low dielectric constant is said to allow thinner dielectric layers, offering improved microvia aspect ratios and laser drilling throughput three times faster than glass prepegs.
www.gore.com/electronics.
(July 22)

Cookson Electronics Equipment Dual-lane Dispense
FRANKLIN, MASS.
Cookson Electronics Equipment's Xyflex Pro DLM (dual-lane multitasking) is said to feature two independently controlled conveyors that asynchronously transport parts, eliminating transport and pre-heat bottlenecks from the production line. Additionally, its dual dispense head capability, combined with its ability to manage three zones of heat per lane, reportedly provides the flexibility necessary to handle encapsulation, dam-and-fill, epoxies, or other hybrid applications.
www.cooksonelectronics.com.
(July 21)

Rudolph Technologies Thin Film Metrology
FLANDERS, N.J.
Rudolph Technologies' ultra-II 200 and 300 metrology systems reportedly deliver the measurement accuracy, reproducibility, and tool-to-tool matching required for process control measurements in semiconductor manufacturing at the 90 and 65 nm processing node, including 193 nm lithography processes. Gate dielectric metrology advances are said to provide good measurement capabilities on advanced oxide and nitride oxide films, and these capabilities are extendable to high-k materials.
www.rudolphtech.com.
(July 21)

Mühlbauer Group Bare Die Solution
RODING, GERMANY
Mühlbauer Group's CT 8/24-RP is said to feature a forming process that applies a positive form based on the positive rotation principle. The continuing forming process has cavities with depths to 0.1 mm and a speed that reportedly reaches the 300 m per hour mark. Additionally, the carrier tape-forming machine meets customer demands for micro pockets with sharp inside contours and high-quality tapes.
www.muelhbauer.de.
(July 18)

Micromanipulator Nanometer Probing System
CARSON CITY, NEV.
A probe station with SEM optics, Micromanipulator's NANO-100 probes 100 nanometer targets and below. The prober is said to incorporate SEM optics to view structures that cannot be resolved with visible light in real-time. Additionally, it provides full probing capability unavailable in any other technology, including the ability to place up to six probes within a 1 µm square, place probes on 100 nm targets that are up to 0.5" apart and the ability to probe a full 200 mm wafer. The system's chamber is vibration isolated and electrically shielded, making it low-current ready. Integrated into a single control panel, full access to the SEM, probe and imaging capabilities reportedly are nearby due to navigation control software.
www.micromanipulator.com.
(July 18)

Mitutoyo America Video Measurement System
AURORA, ILL.
A 2-D noncontacting video measurement system, Mitutoyo America's Quick Image uses a telecentric lens, which compared to conventional optics reportedly provides a wider field of view and greater depth of focus. The result ¿ reduced focusing effort ¿ translates into error suppression and increased speed for higher measuring throughput. The system measures work pieces of varying thickness and levels and can focus simultaneously on the numerous features found on items such as tool edges. Additionally, the system is said to be selectable for high- or low-magnification depending on field of view and detail required.
www.mitutoyo.com.
(July 17)

EV Group Automated Aligner
SCHARDING, AUSTRIA
EV Group's IQ Aligner is a fully automated system for lithography and aligned wafer bonding. Targeted for the advanced packaging and MEMS markets, the system offers capabilities for topside, bottom side, large gap and darfkield alignment. As a dual-use mask and bond aligner, the system is said to provide an advanced method to perform several precision alignment techniques. Equipped with an automated handling and an automated alignment system, the aligner reportedly achieves high throughput and lowers production costs by managing multiple alignment and lithography processes in the same system.
www.EVGroup.com.
(July 17)

Gel-Pak LLC/Quik-Pak Prototype Service
HAYWARD, CALIF.
Gel-Pak LLC/Quik-Pak expanded the quickturn IC assembly prototype service by offering assembled IC units that are flattened and marked, reportedly resulting in a prototype assembled IC plastic unit that appears identical to the production transfer molded package. Cost of test is said to be addressed by flattened units that will accommodate test board and test socket fit.
www.gelpak.com.
(July 16)

Despatch Industries Clean Process Ovens
LAKEVILLE, MINN.
Despatch Industries' LCD Stackable Clean Process Oven and LCD 2-14 Reach-in Clean Room Oven are clean process ovens that reportedly offer a 350ºC maximum operating temperature while maintaining Class 100 conditions throughout the entire process cycle. The ovens are said to be for high-temperature polyimide curing applications as well as other curing and production applications in the semiconductor and electronics industries. LCD 2-14 features a chamber volume of 14 cubic feet and can hold up to 11 shelves to accommodate larger batch sizes. The stackable LCD oven offers chamber volumes of 1.6 or 5.1 cubic feet. The chambers on both ovens feature a non-corrosive steel interior, and continuously welded seams on the insulation side reportedly protect the work chamber from contamination.
www.despatch.com.
(July 16)

Smart Sonic Spray Stencil Cleaner
CANOGA PARK, CALIF.
Smart Sonic's defoamer product that allows 440-R SMT Detergent to be used effectively in spray-in-air type stencil cleaner machines. The detergent was introduced in 1990 for use with ultrasonics, which reportedly lead to ultrasonic technology replacing spray-in-air systems as the preferred method for cleaning SMT solder paste stencils. Until now, excessive foaming prohibited the use of 440-R SMT Detergent in spray machines. However, the defoamer is said to eliminate foaming concerns without diminishing cleaning efficiency. A single capful of the defoamer is all that is needed each time the chemistry is changed for routine maintenance.
www.smartsonic.com.
(July 15)

KIC Thermocouple Solutions
SAN DIEGO, CALIF.
Two KIC Thermocouple (TC) Kit Solutions have been introduced, each consisting of color-coded TC wires, aluminum tape and a thermally insulated sleeve. The colorful TC wires in both kits reportedly relate graphed profile data to the TC board location. Additionally, the aluminum tape is said to provide quick TC attachment and can be removed easily after profiling without causing damage. The thermally insulated sleeve keeps multiple TCs neat and tightly bundled during profiles. Comprised of the three elements, the thermocouple solutions are available in two kits: a standard-temperature kit for normal SMT reflow and wavesolder applications as well as a medium-temperature kit for lead-free reflow and wavesolder applications.
www.kicthermal.com.
(July 15)

Micromanipulator Portable Emission Microscope
CARSON CITY, NEV.
Micromanipulator's FA-2000 Portable Emission Microscopy workstations represent the latest technology in a compact and portable system reportedly suitable for analytical probe station, ATE tester or benchtop configurations for both front- and backside testing applications, in one modular design. The microscope is said to enable engineers to move their failure analysis work from the lab directly to the test floor. Additionally, the NIR-enhanced CCD detectors produce a portable system for high-speed, functional testing. The microscope offers a 1.3 million pixel high-resolution, low-noise camera with a super pixel/binning option for higher sensitivity. The fast frame rate is said to allow easy focus and positioning in real time.
www.micromanipulator.com.
(July 14)

Adept Technology Frame Handling Platform
LIVERMORE, CALIF.
Designed for backend metrology and advanced packaging process equipment, Adept Technology's Film-Frame Handler reportedly provides high film frame capacity and fast swap times to maximize use of any type of film frame process equipment. The system supports both 200 and 300 mm wafer film frames and can handle up to 50 film frames in a single load. The platform is said to be based on the company's linear mechanisms and distributed motion control architecture. It is designed for SEMI S2/S8, and includes intelligent integrated sensing for cassette presence, size and height.
www.adept.com.
(July 14)

Cookson Electronics Equipment Monitoring Software
FRANKLIN, MASS.
IMonitor Line Monitoring was developed by Aegis Industrial Software Corp. for use on Cookson's systems. The software uses XML protocol to deliver a seamless information cycle from production preparation through manufacturing execution, to the end of the product lifecycle in the field. Additionally, the software reportedly collects system data events and alarms, and measures production results against established standards. It provides performance views by machine, line or entire enterprise levels, delivering results through Web browsers via the Internet or local network to multiple persons at virtually any remote location.
www.cooksonelectronics.com.
(July 11)

Mühlbauer Group Die Sorter
RODING, GERMANY
Said to be the follow-up model of the company's DS 6000, Mühlbauer Group's DS 8000 is a flip chip sorter that reportedly achieves an average throughput up to 8,000 devices per hour. The sorter picks the good dice from the wafer and places them into carrier or surf tapes. Each position, including the flip position, are inspected by cameras that operators can control online with two monitors. Additionally, positioning corrections reportedly can be made during die pick-and-place. The integration of new features such as an automatic motorzoom are said to ensure easy handling of different products and short changeover times related to stored vision images.
www.muelhbauer.de.
(July 11)

SMT Resource Group Semiconductor Resource
WAKE FOREST, N.C.
SMT Resource Group's SemiResource is a resource that specializes in providing new and refurbished semiconductor equipment. Besides offering equipment, the service also accepts small items for repair, and can provide short- or long-term equipment engineering personnel. The equipment service is said to be offered at a cost lower than OEMs and provides comprehensive customer opportunity. The resource buys used semiconductor equipment from original end users and refurbishes it for resale. Potential buyers can demo the equipment before purchase. Post-sale, the resource reportedly offers various services, including financing options, acceptance of trade-in equipment, installation, service agreements, parts support and more.
www.smtresource.com.
(July 10)

EV Group Wafer Edge Inspection
SCHARDING, AUSTRIA
Designed for wafer edge defect inspection, EV Group's SmartEdge reportedly allows for defect and particle detection and classification on a wafer edge. Using new and advanced vision and image recognition components for extended inspection capabilities, the system is said to be capable of differentiating automatically between usable and reject wafers. Its high-performance results with a robotic handling system, full FOUP automation and ability to prevent wafer breakage due to edge defects in fabs result in low cost of ownership for device and wafer manufacturers. Additionally, the system is available in both 200 and 300 mm configurations.
www.EVGroup.com.
(July 10)

Kyzen Liquid Metering Pumps
NASHVILLE, TENN.
A high-concentrate industrial line of liquid metering pumps, Kyzen's Dosatron consists of DI150, DI210 and DI520. The water-powered and proportional pump line offers the advantage of water pressure and flow that do not affect operation, and waste is eliminated because the line features on-demand dispensing. Additionally, volumetric metering is said to ensure accuracy, reliability and repeatability. With a flow range from 0.05 to 11.0 GPM and connections of ¾", DI150 features an injection range of 1:100 (1 percent) to 1:20 (5 percent) and a pressure range of 4.3 to 85.0 PSI. While DI210's flow range and connections match DI150's, the injection range is from 1:50 (2 percent) to 1:10 (10 percent) and the pressure range is from 7 to 57 PSI. Finally, DI520's flow range is from 0.08 to 7.00 GPM with connections of ¾". Its injection range is from 1:20 (5 percent) to 1:5 (20 percent) and offers a pressure range of 7 to 70 PSI.
www.kyzen.com.
(July 9)

Micromanipulator Analytical Probe Station
CARSON CITY, NEV.
Featuring a keypad that permits an engineer or technical operation access to common probing functions, Micromanipulator's 9920 300 mm probe station is said to deliver the expected computer control of a semiautomatic prober in addition to much more. Tasks such as setting the die size, performing stepping sequences and returning to locations that have been stored in memory may be performed using the touch keypad. Arrow buttons on the keypad are said to permit "index" and "die" movements individually or across the stage. The keypad is built into the center-front section of the probe station, reportedly making it convenient to use. Additionally, the station comes standard with a remote pendant, which has similar features of the keypad. The pendant is said to allow the operator to control the prober remotely.
www.micromanipulator.com.
(July 9)

MicroScreen BGA Laser
SOUTH BEND, IND.
MicroScreen's Turbo II is an Nd:YAG laser used in the manufacture of stencils for printing solder paste on printed circuit boards. When a laser performs cuts on BGA-type apertures, it makes a series of holes by initiating small-segmented cuts. These circular cuts are not entirely round and, in theory, a small imperfection or deposit is left each time the shutter interrupts the laser beam, impeding the paste flow through the stencil and resulting in open solder joints. With the laser system, it reportedly is possible to make perfect circles by optically cutting past 360º. Instead of moving the laser or material, a rotating optic moves the beam, cutting round hole sizes between 80 and 800 µm.
www.microscreen.org.
(July 8)

US Digitaltest High-Speed Test Heads
CONCORD, CALIF.
US Digitaltest's MTS 500 Condor flying prober test system can reportedly reach an acceleration of greater than 20 g. The four-headed design is driven by servo motors, and permits movements of 6 mm in less than 12 milliseconds. By reducing the time required to move the heads, test times can be reduced. Because completed assemblies often require thousands of probings during testing, the time saved can be significant. Using the technology in moving parts, the test heads reportedly are flying on an air cushion that enables high-speed requirement with almost no friction. Additionally, the incorporation of this technology is said to allow for maintenance-free operation and reliable long-term operation in the production environment.
www.digitaltest.net.
(July 8)

Aqueous Technologies Cleanliness Tester
RANCHO CUCAMONGA, CALIF.
Aqueous Technologies' Zero-Ion Ionic Contamination (Cleanliness) Tester is said to test electronics assemblies for ionic contamination. The tester automatically removes and detects contamination on an assembly, and reportedly provides quantitative contamination measurements. Additionally, it uses a dynamic technology that is said to provide automatic regeneration of the machine's test solution, maintaining test solution sensitivity. Capable of storing 50 test parameters within its internal controller, the tester is equipped with a built-in printer that records cleanliness testing results. When connected to a PC via optional PC interface software, the tester is capable of storing unlimited quantities of testing results.
www.aqueoustech.com.
(July 7)

StratEdge Hermetic Packaging
SAN DIEGO, CALIF.
StratEdge's G1111M and G1010M packages reportedly offer low-cost hermetic surface mount packages for high-reliability applications. The packages are available with lead profiles meeting JEDEC standards. Assembled using a glass-to-metal seal process, the packages are rugged and reliable. The hermetic seal is said to provide enhanced reliability for semiconductor devices and offers protection from environmental conditions. G1111M is a 3 x 3 mm outline with an internal cavity of 0.9 mm, and is supplied with six leads. G1010M, however, is a 2.5 x 2.5 mm outline with an internal cavity of 0.75 mm, and is available with two leads.
www.stratedge.com.
(July 7)

Ultratech Metrology Tool Addition
SAN JOSE, CALIF.
Ultratech's UltraMet 100 is said to be the industry's first metrology system developed to measure any (or every) die on a wafer, providing full-wafer validation of the company's Nanotech 160 DSA stepper. The tool measures the alignment of an image on the backside of a wafer to an image on the front-side. Additionally, the system uses the MVS imaging system, which reportedly eliminates the requirement for the special metrology targets required by other DSA-capable metrology tools, and provides improved measurement capability compared to other currently available back-to-front metrology tools.
www.ultratech.com.
(July 3)

SUSS MicroTech Full-field Lithography
MUNICH, GERMANY
SUSS MicroTech's SupraYield is said to provide a high-performance solution for advanced thick-resist applications, such as WLP, MEMS and optoelectronics. Systems enhanced with the tool reportedly can double throughput, achieve 1 µm resolution and submicron overlay, and reduce lithography costs by up to 66 percent (compared to steppers). The technology ensures that 1XFLL systems can meet the demands of several future design generations, fulfilling requirements and enabling higher yields with the throughput and cost efficiency provided by full-field tools.
www.suss.com.
(July 3)

EV Group Bonding/Debonding Technology
SCHARDING, AUSTRIA
EV Group's EVG850 temporary bonding and debonding systems reportedly offer advanced capabilities for reliable backside processing of thin and fragile wafers. Polymer and wax bonding (spin-on adhesives) and adhesive film bonding and debonding can be performed. The system offers features such as backside, edge and perforated wafer handling. Additionally, increased materials and process flexibility is achieved by the system's modular design. The system platform can integrate pre- and post-processing steps such as coating, protective film removal, film frame mounting and cleaning. Unique to the bonding/debonding system is the capability to manage different substrate/carrier combinations up to 300 mm, which adds more options for device manufacturers.
www.EVGroup.com.
(July 2)

Cascade Microtech RF Probing Station
BEAVERTON, ORE.
Cascade Microtech's probing solution includes high-performance characterization probes, a series of dedicated dual ISSs, ENA Wafer Call calibration software, an Agilent ENA Series RF network analyzer and probing system. The calibration software reportedly provides productivity enhancements to ensure RF engineers, in addition to achieving both accurate and repeatable calibrations, can perform the entire procedure up to 10 times faster than using a front panel. Additionally, the software wizard guides the user through the setup and calibration processes, thereby eliminating the need for the user to navigate the system's internal menus.
www.cascademicrotech.com.
(July 2)

Electronic Materials UV/Heat Curable Material
BRECKENRIDGE, COLO.
A UV light and/or heat-curing adhesive, Electronic Materials' EMCAST 4100 is available for sampling. This 100 percent solids, medium-viscosity, one-component epoxy-based formulation reportedly can be cured by exposing to UV light in the 320 to 380 nm wavelength range or with heat above 110ºC to cure the shadowed areas. The material cures to rigid with a Shore D hardness of 92. Additionally, it features a CTE of 25 * 10-6/ºC and a 150ºC Tg. The material is said to exhibit good adhesion to various metal and ceramic surfaces and does not need to be shipped refrigerated.
www.electronicmaterialsinc.com.
(July 1)

Leica Microsystems Microscopy Platform
WETZLAR, GERMANY
Leica Microsystems' platform has intelligent automation that allows the user to configure complex procedures by pressing a button. This will permit users to concentrate on what is being examined more completely; there is no need for time-consuming illumination adjustment. Various management functions reportedly relieve users of most manual work, and the microscope is capable of switching to optimal settings automatically.
www.leica-microsystems.com.
(July 1)

White Electronic Designs SSRAM Devices
PHOENIX, ARIZ.
White Electronic Designs has two high-density, SSRAM devices: the first offers a total density of 72 Mb, organized as 1 M x 72 and the second also is a x72 device but features a total density of 36 Mb and is organized as 512 K x 72. The x72 Mb no bus latency (NBL) reportedly provides high-density, speed and flexibility, allowing OEM design engineers to reduce overall active memory device count, reduce power and improve PCB space utilization.
www.whiteedc.com.
(June 30)

PolarFab BCD Process Devices
BLOOMINGTON, MINN.
PolarFab's BCD Process Devices reduce die size and chip costs for its PBC4 0.5 µm BiCMOS-DMOS (BCD) process. The addition of a high-power driver with a low specific on resistance (RSP) of 25 O mm2 reportedly permits the production of smaller die sizes and lowers chip costs. The N-channel medium volt DMOS large-angle body device also features a 1.3 µm gate length, a threshold voltage of 2.0 V and a maximum operating voltage of 13.2 V.
www.polarfab.com.
(June 30)

Pac Tech USA Solder Ball Bumping
SANTA CLARA, CALIF.
Pac Tech USA's SB2-Jet is an advanced, fully automatic, high-speed sequential solder ball attach machine with integrated laser reflow. In addition to providing a solder ball placement capability, the system also is for reflow and rework. The bumper reportedly can place 10 balls per second and offers numerous additional advantages, including its ability to handle solder balls ranging in diameter from 80 to 760 µm and a range of solder alloys. Other benefits are its high throughput, and ability to handle wafers up to 300 mm and substrates. Additionally, the system reduces thermal and mechanical stress by heating with laser pulses for only a few milliseconds duration.
www.pactech-usa.com.
(June 27)

Teradyne, Assembly Test Div. ICT Solution
NORTH READING, MASS.
Teradyne, Assembly Test Div. introduces the availability of SafeTest production technologies on its line of TestStation ICT systems. The protection technologies are said to protect today's newest low-voltage devices against exposure to the over-voltage and over-current conditions common to conventional ICT systems. The protection technologies combine the company's UltraPin digital pin electronics and software features for accurate, reliable and safe powered-up testing. Features include: automatic driver verification, background current sensing, closed-loop driver, multi-level digital-isolation software, per-pin programmable logic thresholds and timing, programmable backdrive current and duration thresholds, and specialized digital controller.
www.teradyne.com.
(June 27)

The Micromanipulator Co. Wafer Probing System
CARSON CITY, NEV.
The Micromanipulator Co.'s Double-sided, Backside wafer probe system is said to be less destructive than typical wafer probers because engineers can access the test site directly from either side of the wafer. Additionally, the system is designed to probe both the back- and front-side of the wafer -- simultaneously, if necessary. The 8000 Series probe station is for 200 mm wafers and the 9000 Series is for 300 mm wafers to be used as the base for the double-sided backside system. The backside probing capability reportedly opens a new view seen through the station microscope. The front side is viewed with a camera mounted on the standard prober X-Y stage. The wafer front also may be probed with a probe card that is attached to the station platen.
www.micromanipulator.com.
(June 26)

Tecknit Interconnection Products Slide Lock Socket
CRANFORD, N.J.
Tecknit Interconnection Products' Tornado Heat Transfer Socket reportedly is constructed of materials that have a highly conductive nature and can be used where convection cooling is needed for hot device applications. A built-in fan and custom-machined air channeling baffle plate is said to generate a "tornado" effect to remove heat buildup during testing. The socket's small footprint design and slide lock mechanism ensure quick load and release where board space is at a minimum.
www.fuzzbuttons.com.
(June 26)

Surface Technology Systems MEMS Platform
NEWPORT, WALES, UNITED KINGDOM
Surface Technology Systems' Pro family of plasma etch and deposition tools is said to be capable of accelerating the transition of MEMS technology into volume production. Designed to enable a cost-effective transition to MEMS manufacture, the philosophy of the platform is to address the challenge of shifting MEMS out of the "technology-driven" era to volume production at a viable cost per wafer. The platform reportedly is compatible with the company's Advanced Silicon Etch technology, which achieved the anisotropic deep etched structures in silicon required to fabricate micromachine devices.
www.stsystems.co.uk.
(June 25)

Royce Instruments Wafer Bump Tester
NAPA, CALIF.
Royce Instruments' 580-300 universal bond test system is available for shear testing bumps on 300 mm wafers. Reportedly capable of controlling tool shear height to better than 1 µm, the tester enables rapid, repeatable evaluation of wafer bump adhesion. Optional image capture is said to save a digital image of the failure site for future reference. BondTest Manager, a Windows-based user interface application, performs local SPC functions and networks the tester to external databases. The system also is capable of performing bond shear tests, wire bond pull tests and die shear tests to Mil Specs. The tester is set up automatically when test modules are interchanged, and menu-driven programming enables quick product changeover.
www.royceinstruments.com.
(June 25)

Mitutoyo America Linear Height Gage
AURORA, ILL.
A high-productivity linear height gage, Mitutoyo America's QM-Height increases measuring efficiency by incorporating a red/green back-lit display that indicates immediately whether a measurement is in or out of tolerance. The gage is said to use the company's absolute-type linear encoder, eliminating the reset of origin on start up. Additionally, increased accuracy of ±(2.8+5 L/1,000) µm results from a more rigid column and a smoother floating slider motion. Both the 14 and 24" models reportedly feature selectable resolutions of 0.00005, 0.00001 and 0.00002" depending on the workpiece.
www.mitutoyo.com.
(June 24)

Royal Philips Electronics Diode Technology
EINDHOVEN, THE NETHERLANDS
Royal Philips Electronics' PMEG series Schottky diodes are designed to further enable miniaturization of equipment, such as mobile phones and digital cameras, while improving overall electrical efficiency. The low forward volt drop and high-speed switching capabilities are said to make these diodes ideal for applications such as high-efficiency DC/DC converters. The series reportedly provides designers with packages that reduce the PCB area required for Schottky rectifier diodes to as little as one quarter of that previously occupied by devices in SMA packages. It also extends current (IF) handling capacity of SMT Schottky diodes to unprecedented levels.
www.semiconductors.philips.com.
(June 24)

Devcon Fast-curing Adhesive
DANVERS, MASS.
Devcon's fast-curing epoxy adhesives are said to require no fixturing. Available in three formulations, they are for numerous OEM assembly applications as well as for repairs. Additionally, the adhesives reportedly offer good dielectric strength and withstand service temperatures of -40º to 200ºF (dry). A general-purpose adhesive/encapsulant, 5 Minute Epoxy bonds metals, fabrics, ceramics, glass, wood and concrete in all combinations and is suitable for potting or encapsulating electronic components. With a mixed viscosity of 150,000 cps, 5 Minute Epoxy Gel is a thixotropic, nonsagging gel with gap-filling properties and has a working time of 3 to 6 minutes at room temperature. A thixotropic, nonsagging gel, it bonds to metals, glass, fiberglass and ceramics, and can be used to repair cracks or fill holes.
www.devcon.com.
(June 23)

GPD Global Illuminator Controls
GRAND JUNCTION, COLO.
GPD Global's programmable illuminator controls for their liquid dispensing systems reportedly provide enhanced fiducial/feature recognition. By changing the color and/or intensity of the illuminator on the vision alignment system prior to pattern recognition, the systems can compensate for various substrate colors, reflective properties or textures. This is said to allow for more accurate and repeatable dispensing on such substrates as FR4, gold and ceramic, critical for advanced applications in the high-density and semiconductor packaging markets.
www.gpd-global.com.
(June 23)

Sonoscan Tray Inspection System
ELK GROVE VILLAGE, ILL.
Designed to scan up to six JEDEC-style trays of packaged IC components simultaneously, Sonoscan's Polytray Autoscan tray inspection system features an accessible scan area of 24 x 24". A single tray reportedly may hold 200 or more components, giving the system the capacity to screen more than 1,000 components at a time. Additionally, the system is said to meet the needs of assemblers wishing to screen relatively large numbers of components but who do not need high throughput. While coming near to production throughput rate, the system also permits detailed analysis of individual components.
www.sonoscan.com.
(June 20)

ST Assembly Test Services Flip Chip Addition
SINGAPORE
ST Assembly Test Services' Flip Chip Ball Grid Array with Buildup Substrate and Heat Spreader (FCBGA-HB) is for high-performance communication and computing applications. The new package is part of the company's total flip chip solution, which comprises in-house thermal/electrical simulation, wafer bumping, 300 mm wafer front-end assembly and complete test capabilities for such high-performance packages. The addition features a one-piece heat spreader on a four- to eight-layer buildup substrate. Additionally, the package is said to be targeted at high-performance applications used in enterprise servers, network switches/routers, next-generation network processors and wireless base stations.
www.stts.com.
(June 20)

Dymax UV Curing
TORRINGTON, CONN.
CE compliant and PLC compatible with two-way communication, Dymax's BlueWave 200 spot/wand curing system is fitted with a four-pole wand and is said to offer a combination of longer bulb life and higher density through multiple wands. Fitted with an efficient mechanism for light division, the system captures intensity and provides more even disbursement between each wand, allowing for 360º cures with an intensity above 5 W/cm2. Additionally, with a four-pole lightguide attachment, output at the end of each wand reportedly delivers intensity levels above 4+ W/cm2 for up to 2,000 hours.
www.dymax.com.
(June 19)

Ajedium Film Group High-performance Films
NEWARK, DEL.
Ajedium Film Group's line of 48" wide extruded films and thin sheets range in thickness from 0.001 to 0.50", with some materials available as thin as 0.00025". The films and sheets are said to be flat-die extruded, using a closed-loop production process that ensures in-tolerance, flat and stress-free parts. Films are available in master rolls or slit to desired widths. Additionally, the sheets are available in 24 x 48" or 48 x 96" sizes.
www.ajedium.com.
(June 19)

Newport Rotation Stage
IRVINE, CALIF.
Newport's RGV100 Direct-Drive Motorized Rotation Stage is said to bring higher speeds, greater reliability and higher precision, in addition to a low profile, to semiconductor wafer inspection and related applications. The direct-drive technology reportedly eliminates the worm gear of traditional rotation stages, providing faster rotation speeds, reliability and enhanced sensitivity to applications that include precision metrology, semiconductor wafer inspection, micro-robotics, MEMS, and more. Additionally, the stage features a DC torque motor with earth magnets to supply a ratio of torque per volume for high acceleration rates with minimum stage heating. Precision is ensured by a high-resolution glass scale with 18,000 line counts per revolution that reads the position of the rotating platform.
www.newport.com.
(June 18)

Aqueous Technologies Defluxing System
RANCHO CUCAMONGA, CALIF.
Aqueous Technologies' SMT800-LD Aqueous Cleaning/Defluxing System reportedly is for removing all post-reflow solder pastes, including lead-free. The cleaners are said to be fully networkable, allowing observation or operation from any PC with the user's network. Additionally, the cleaning system is equipped with a four-sided, 36 nozzle spray system, powered by two high-performance stainless steel spray pumps for tough cleaning applications such as lead-free. Completely automatic, the system provides wash, rinse, cleanliness testing and drying at the touch of a button.
www.aqueoustech.com.
(June 18)

Kulicke & Soffa Chamfer Capillary
WILLOW GROVE, PA.
Kulicke & Soffa's Contained Inner Chamfer (CIC) is a capillary that permits the use of thicker wires in fine-pitch and ultra-fine-pitch (UFP) applications for improved production yields and bonding performance. The capillary reportedly contains most of the additional gold generated from free air ball during bonding in its inner chamfer, instead of allowing the gold to exceed the bond pad area during the first bond formation. By reducing the production of large ball diameters, the capillary is said to enable the use of thicker wire bonding for UFP applications (50 µm and below), reducing the problem of wire sweeps and short failures associated with thinner wires.
www.kns.com.
(June 17)

Transene Semiconductor Coatings
DANVERS, MASS.
Transene's series of high-temperature junction coatings for power resistors, diodes and rectifiers, reportedly offer environmental protection and high-reliability performance. Coating Type I is a one-part system with high dielectric strength. Coatings 3811 and 3812, however, are said to be for preventing electrical breakdown and minimizing junction surface leakage.
www.transene.com.
(June 17)

BTU Muffleless Furnace
NORTH BILLERICA, MASS.
For processes ranging from thick film metallizing, sintering and brazing to electronics packaging and assembly, BTU's high-temperature muffleless Fast Fire II furnace is available in five models. The furnace reportedly incorporates an advanced furnace control algorithm for precise and balanced temperature control, an improved drive system to ensure uniform belt tension and WINCON oven control software, a Windows-based operating system. The furnace has no muffle, which is said to allow it to heat and cool rapidly. It can reach 900ºC from ambient in less than 20 minutes. With a maximum operating temperature of 1,050ºC and a cross-belt temperature uniformity of ±2ºC at 850ºC, the furnaces operate with either air or Nitrogen atmospheres.
www.btu.com.
(June 16)

Matec Micro Electronics Scanning Microscope Software
YARDLEY, PA.
Introduced for the company's scanning acoustic microscope, Matec's library of analysis software offers various features, including an auto dynamic contrast control button, signal peak detection selection, graphic interpolation modes for the C-Scan images, instant C-Scan image conversion, scan and index location display, and more. These features are said to expand the operator's capability to better analyze scanned parts. Now new software, Multi-Gate Zone Inspection, is available to collect data and analyze with multiple data gates within a prescribed area. The number of gates to be generated reportedly can be selected by the operator. Each sub gate generates an image per the selected peak detection mode.
www.matec.com.
(June 16)

Datacon Technology Single-chip Die Attach
RADFELD, AUSTRIA
Designed for high-precision single-die applications, Datacon Technology's GAMMA reportedly is for processing small and large chips, as well as for any kind of matrix applications -- even on warped substrates. Depending on the required precision and chip size, the system can process up to 4,000 uph, and adhesive can be applied via stamping or dispensing. Additionally, the system is said to be capable of processing wafers up to 8". It offers a wafer-changing system that handles up to 25 wafers. Chips with edge lengths of 0.17 to 35.00 mm can be processed and fitted onto 0.1 to 1.0 mm thick lead frames or strips.
www.datacon.com.
(June 13)

DEK International Ball Placement
FLEMINGTON, N.J.
DEK International offers DirEKt Ball Placement, a fully automated wafer handling solution, and Virtual Panel Tooling. These solutions are said to be capable of being incorporated in a production line individually or in combination with each other to enhance productivity. The placement technology reportedly uses imaging technology to place solder balls as small as 0.3 mm onto substrates or wafers with fine-pitch accuracy and first-pass yields consistently better than 99 percent. The process begins with flux deposited at each interconnect site using flux imaging technology. The panel tooling technology reportedly allows numerous substrates to align independently and simultaneously to create a virtual panel that can be imaged in a single cycle, creating multiple, accurately processed substrates at high speeds.
www.dek.com.
(June 13)

Instron's Microtest Systems
CANTON, MASS.
Instron's Model 5848 MicroTester reportedly is for testing microelectronics devices, MEMS, photonic and other small components. Additionally, the system provides precise load and displacement measurement capability combined with good cyclic performance. With a load capacity of 2 kN, the tester is said to provide the submicron position measurement accuracy and ultra-high-precision load and position control capability required for static testing of microcomponents and the performance necessary for cyclic fatigue testing. The design includes a rigid frame, capable of use in either horizontal or vertical orientations, which ensures accurate and repeatable deformation measurements.
www.instron.com.
(June 12)

ESEC's Wire Bonder
CHAM, SWITZERLAND
Featuring a rotating bondhead, ESEC's Tsunami Wire Bonder 3100 reportedly can break existing performance barriers and deliver high levels of speed and accuracy. The company's TY technology links rotational to linear motion to create a theta/y-movement, which is said to allow for the rotating bondhead. Additionally, the system features a 45 µm production capability and can cope with a range of lead frame and organic substrate applications. With an improved statistical process control system, the system monitors and analyses relevant process parameters, intervening in the bonding process if necessary.
www.esec.com.
(June 12)

Master Bond Epoxy Adhesive
HACKENSACK, N.J.
Master Bond's EP21ANHT is a two-component room temperature curing epoxy adhesive with a thermal conductivity of more than 22 BTU/in/ft2/hr/ºF. It reportedly features a 1:1 mix ratio by weight or volume and has good electrical insulation properties. The adhesive is said to be recommended for high-temperature applications. The service operating temperature range is from -60º to 400ºF. Additionally, the product has a high bond strength to a wide variety of substrates. It has a low shrinkage, low coefficient of expansion and dimensional stability. Bonds are durable and resist water, oils, fuels and many solvents. Shore D hardness is greater than 85 and volume resistivity is more than 1013 O/cm.
www.masterbond.com.
(June 11)

Amkor Technology RF Tester
CHANDLER, ARIZ.
A low-cost tester for RF components, Amkor Technology's Radio Frequency Tester (RFT) is said to be a high-reliability RF only test system to address high-volume RF test requirements at minimal cost. The tester reportedly provides semiconductor companies with shorter test development cycles, allowing a faster response to customer requests. The tester is designed for low pin count, high-performance RF devices and can perform both continuous wave and pulsed measurement.
www.amkor.com.
(June 11)

Palomar Technologies Eutectic Die Bonder
VISTA, CALIF.
Palomar Technologies' Model 6500 eutectic die bonder combines speed and a compact equipment footprint. With a eutectic placement accuracy of less than 1.5 µm, 3 sigma and a cycle time less than seven seconds per placement, the bonder is said to be capable of automating assembly for the most advanced applications. The system, 38 x 48" with a height of 70", offers a bond area of 12 x 6". The system has six smart programmable pick tools on a bidirectional rotating tool turret, which reportedly can be changed on the fly. Additionally, it can be customized for any type of presentation media such as automated waffle pack loaders, tape-and-reel feeders or automated gel-pak loaders.
www.palomartechnologies.com.
(June 10)

Dymax Corp.'s High-Intensity UV Curing
TORRINGTON, CONN.
360º UV cures with an intensity above 5 W/cm2 are possible using Dymax Corp.'s BlueWave 200 spot/wand curing system fitted with a four-pole light wand. CE compliant and PLC compatible with two-way communication, the material is said to offer a combination of longer bulb life and higher intensity through multiple wands. Fitted with an efficient mechanism for light division, the four-pole system reportedly captures maximum intensity and provides even disbursement between each wand. With a four-pole lightguide attachment on it, the system light output at each end of the wand delivers intensity levels above 4+ W/cm2 for up to 2,000 hours.
www.dymax.com.
(June 10)

Chomerics Conductive Adhesive
WOBURN, MASS.
Chomerics' CHO-BOND 584-29 conductive adhesive is available in a syringe system for easier mixing and more precise application. Compared to two-part, flexible divider pouches, the syringe system is said to simplify the mixing of resin and hardening components, and improves dispensing accuracy. The adhesive has a low viscosity, reportedly allowing easier application through fine-gauge needles. With its silver filler, the compound provides a low-volume resistivity of 0.002 O/cm when used as a highly conductive pathway in circuit repair, EMI shielding systems, ground paths and other applications. The system features a pair of syringes, one containing a hardener and one with the conductive resin, separated by a connector.
www.chomerics.com.
(June 6)

Teradyne Assembly Test Div.'s Optical Test System
NORTH READING, MASS.
An optical process test system for post-placement, inline defect detection and process measurement, Teradyne Assembly Test Div.'s Optima 7210 reportedly replaces user judgment with built-in knowledge of SMD process and variation compensation to enable the completion of production-ready test programs in as little as one hour. This allows for shorter manufacturing cycle times, reduces time to first article validation and improves outgoing prototype product quality. Based on Configural Recognition object recognition and image analysis technology, the system is said to provide true noncontact testing with rapid programming, reductions in false flag rates and the elimination of nonstop program maintenance required to resolve them.
www.teradyne.com.
(June 6)

March Plasma Systems Plasma Treatment Enhancements
CONCORD, MASS.
Enhancements have been made to March Plasma Systems' XTRAK in-line plasma treatment system that are said to result in overall performance and throughput improvements. The transport software has been modified to allow plasma processing of single or multiple parts simultaneously, increasing throughput two-fold for many applications. Additionally, the system's SMART Tune management system provides closed-loop plasma control that reduces turning time to less than one second. The system automatically recycles to a plasma-ready state, compensating for changes in vacuum pressure, temperature and varied lot sizes.
www.marchplasma.com.
(June 5)

Anadigics RF Module Packaging Capability
WARREN, N.J.
Anadigics developed an RF module packaging capability that is said to support customer efforts to produce lead-free products that meet European and Japanese environmental legislation. The laminate-based packaging technology for RF SiP modules also is said to surpass the latest JEDEC performance requirements by providing Level 3 moisture resistance at 260ºC. The capability will be applied to many of the company's wireless products, providing customer benefits, including increased board-level solder reflow temperatures, as the switch to lead-free is made.
www.anadigics.com.
(June 5)

Aries Electronics Side-stackable BGA Socket
FRENCHTOWN, N.J.
Aries Electronics' Pin-Ball Socket reportedly can be soldered side-by-side directly to the existing footprint of a PCB, improving packaging density. The surface mount BGA and LGA socket provides 2 mm of clearance for end components and can be used for 1.00 and 1.27 mm pitch packages up to 50 mm in any footprint on any size board. The socket incorporates a spring force of 19 g at 0.25" deflection, and uses an Ultem insulator with stainless steel hardware. The spring is Be/Cu alloy and the pins are gold-plated brass alloy.
www.arieselec.com.
(June 4)

Henkel Loctite Die-attach Adhesive
DUSSELDORF, GERMANY
Henkel Loctite's QMI 550EC is a next-generation, silver-filled conductive die-attach adhesive that bonds ICs and components to advanced substrates such as PBGAs, CSPs and array packages. Hydrophobic and stable at high temperatures, the adhesive is said to produce a void-free bond line with interfacial adhesion strength to a wide variety of organic and metal surfaces. This material reportedly is formulated to provide high cohesive energy, adhesive strength and elongation at break. The fast cure adhesive is available with optional spacers for consistent bondline control.
www.loctite.com/electronics.
(June 4)

Dymax Corp. UV Potting Compounds
TORRINGTON, CONN.
Dymax Corp.'s line of two-part UV curing potting compounds, Trigger Cure, reportedly features an instant UV curing feature with the ability to cure at room temperature to depths of an inch or more, and in areas under components where the light does not reach. The 1:1 two-component products are for ease of application through typical disposal tip static mix dispensers. Following dispensing, exposure to longwave UV light cures the products to a depth of a quarter inch in 20 seconds or less. The remaining liquid resin gels in seven to 20 minutes. Full cure is achieved in 24 hours at room temperature.
www.dymax.com.
(June 3)

Micro Substrates Corp. Tungsten/Gold Vias
TEMPE, ARIZ.
Micro Substrates Corp. announces a tungsten/gold via-fill as a new addition to their standard tungsten/copper filled-via Via/Plane substrates. The new fill material is said to have been implemented successfully in 99.9 and 96.0 percent alumina, aluminim nitride and quartz substrates. Additionally, it allows manufacturers to use more universal thin-film processes and metal stack-ups. The fill reportedly consists of approximately 75 percent tungsten and 25 percent gold with a CTE of about 6.9 and thermal conductivity of 190 W/mK. Vias are lased and filled using a bimetal process, which ensures a void-free via.
www.microsubstrates.com.
(June 3)

KIC Lead-free Kit
SAN DIEGO, CALIF.
KIC's SlimKIC 2000-LF Kit is a profiler and process development tool whose capabilities are said to be designed for optimizing the lead-free thermal process. The kit incorporates up to 12 thermocouples and reportedly has both real-time and datalogging options. The system comes standard with a stainless steel thermal shield and thermocouples rated to handle the higher temperatures required for the lead-free reflow process. Additionally, the product includes the company's software platform with a built-in library of commonly used materials and their suggested process limits. For lead-free applications requiring higher processing temperatures and smaller process windows, the kit offers Navigator and Auto-Focus, two options that can simplify the lead-free reflow process setup.
www.kicthermal.com.
(June 2)

Polytec PI Microscopy System
AUBURN, MASS.
An integrated laser Doppler vibrometry and stroboscopic video microscopy system for full-field 3-D characterization of MEMS dynamics, Polytec PI's MMA-300 reportedly combines a scanning laser vibrometer with a planar motion analyzer. The system is said to map out-of-plane vibration while simultaneously measuring in-plane motion. Additionally, the system offers a measurement range from near-DC to 30 MHz, including FFT and time-domain processing. Whole-field vibration response is animated for specific frequencies or in the time domain. A laser vibrometer measures any vibration waveform in real-time, including transient and random.
www.polytecpi.com.
(June 2)

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