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MRSI Capillary Underfill Dispenser
NORTH BILLERICA, MASS.
MRSI-175UF capillary underfill dispenser from MRSI, a Newport Corp. can be configured to meet application-specific solutions. Its linear positive displacement pump design reportedly offers tight process control, high-dispense accuracy and consistent repeatability necessary for high-volume production. With closed-loop encoder feedback, the pump is said to be capable of holding precise process control tolerance over extended periods of times, reducing calibration frequency compared to competitive pumps.
(November 1)
Enhanced Packages from STATS
SINGAPORE
Enhanced Ball Grid Array Multi-Tier (EBGA-M) from ST Assembly Test Services Ltd. (STATS) is a new version of the EBGA package. The enhanced package is built with multiple wire bonding zones for power, ground and signal connection. Providing up to eight substrate layers in a die-down architecture, the package is said to offer good electrical and thermal performance. It reportedly is ideal for 1 mm ball pitch packaging requirements and strip line designs where the signal trace sits between ground planes for enhanced electrical performance.
(November 1)
Laser Marking System from Online Inc.
MCHENRY, ILL.
Index 360 fully automated laser marking system from Online Inc. provides a platform for handling any size components of virtually any material. The system is available configured with a feeder bowl, conveyor or tray/pallet handling. In addition to the lasering operation, the system features a fully automatic and programmable packaging system, which places the finished product into the final packaging container. The system is available in different laser formats for applications such as marking plastics and metals, cutting and trimming, ablating anodized aluminum, micro machining, trimming, welding, micro drilling, and more.
(October 31)
3M Static Monitors
AUSTIN, TEXAS
Two monitors from 3M are for use in static-sensitive work environments. The monitors can record ESD events in real time, supplying data for tracking operator efficiency, product reliability and documentation for ISO9000 compliance and ANSI/ESD S20.20. The brand 791W voltage wrist strap monitor grounds and monitors two dual-conductor wrist straps that plug into two separate remotes. The 791E equipment ground monitor provides three channels to continuously measure the ground connections of manufacturing equipment and ESD work surfaces.
(October 31)
Multi-Process Assembly Cell from Universal Instruments
BINGHAMTON, N.Y.
Polaris multi-process assembly cell from Universal Instruments Corp. automates many of the processes required for light mechanical and back end assembly, including dispensing, vision inspection, driving screws and assembly. Its platform design means that several processes can be performed in a single cell, or distributed across multiple cells to boost productivity. The multi-process features standard mechanical, electrical and software interfaces for the tool modules, reducing the amount of customization required to integrate new processes.
(October 30)
White Electronic Designs Disk Module
PHOENIX
DimmDrive WED7GxxxATA33 solid state single chip flash disk module from White Electronic Designs is available in densities from 16 to 768 Mbytes in a 144 pin SO-DIMM package. The module is based on SanDisk NAND Flash technology and uses the 128 Mbyte, 256 Mbyte, 512 Mbyte or 1 Gbyte memory components to provide the maximum in mobile density. The module uses a SanDisk Flash ChipSet controller, designed specifically for use as a Flash mass storage controller for the SanDisk memory devices.
(October 30)
EMI Protection Technology from California Micro Drives
MILPITAS, CALIF.
PACZIG1284 device from California Micro Devices protects parallel ports against electromagnetic interference (EMI) in PCs with frequencies from 100 MHz to 3 GHz. The devices owes its capabilities to Zero Inductance Ground (ZIG) technology, which connects the filters inside the PACZIG1284 directly to the PC motherboard through a metallic pad that protrudes through the bottom of the device package, rather than through bond wires and ground pins. This eliminates the inductance that limits other filtering solutions.
(October 29)
Relay from Power Standards Lab
EMERYVILLE, CALIF.
PQ1 power quality relay from Power Standards Lab detects disturbances on the power line, such as voltage sags, interruptions, voltage sags and high frequency impulses, that damage or disrupt wire bonding equipment controls, component placement robotics and other sensitive electronics. The tiny PQ1 features an interface of AC power in, relay contacts out. Test, inspection and diagnostic systems can use it as a diagnostic tool, or it can be built into as part of a remote diagnostic system.
(October 29)
Kulicke & Soffa Probe Cards
WILLOW GROVE, PA.
The P4 (photolithographic pattern plated probe) family of fine pitch probe cards from Kulicke & Soffa Industries Inc. is available in two extensions. A dual-DET (device under test) card permits simultaneous, at-speed testing of two die; a dual row staggered card is specifically designed for probing staggered bond pads. The P4 technology provides a solution for probing wafers that can significantly decrease the cost of test. Users that will especially benefit are those with long-life devices that can take advantage of the durability of the probe card.
(October 28)
Conductive Epoxy from Transene Co.
DANVERS, MASS.
Conductive via fill CFV-6030 from Transene Co. is applied via stencil and offers a simple, economical route to plugging vias in conjunction with a planarization process. CVF-6030 offers negligible shrinkage, low outgassing, and outstanding electrical and thermal conductivity. Applications include PWB and PBGA ones.
(October 28)
Direct Drive Rotary Tables from IntelLiDrives
PHILADELPHIA
RotoRing Series tables from IntelLiDrives Inc. feature 14" diameter center openings to allow access to every die on the 12" wafers. Unlimited table rotation capability allows assembly equipment manufacturers to perform large angle wafer alignment and die rotation on the wafer and to reduce die transfer time by rotating the wafer. The tables combine RotoLinear motor modules, which provide high positional stiffness to maintain wafer alignment during fast Cartesian wafer indexing, and planar air bearings.
(October 25)
Agilent FET
PALO ALTO, CALIF.
ATF-521P8 E-pHEMT (enhancement-mode psuedomorphic high electron mobility tranistor) field effect transistor (FET) from Agilent Technologies Inc. offers performance optimized for the second and third stages of front-end low noise amplifiers (LNAs), and driver or pre-driver amplifiers in cellular base stations in the 900 MHz, 1.9 GHz and 2.1 GHz frequency bands. It also is targeted for use for fixed wireless, WLAN and other applications calling for high performance in the 50 MHz to 6 GHz frequency range. The single supply voltage feature eliminates the need for the second supply voltage required for heterojunction bipolar transistor (HBT) and conventional PHEMT devices.
(October 25)
Thermo Nicolet Accessories
MADISON, WIS.
FT-IR accessories from Thermo Nicolet, a Thermo Electron business, include both Smart Accessories and Spectra-Tech Foundation Series. Smart Accessories integrate with Avatar and Nexus spectrometers. Spectra-Tech's Foundation Series can be used for modular, cross-platform sampling with all FT-IR spectrometers, including the Thermo Nicolet IR100, IR200 and IR300, or as a baseplate-mounted accessory configured for a specific bench.
(October 24)
Rework System from PDR
SACRAMENTO, CALIF.
IR-X400 focused IR SMT/BGA rework system from PDR SMT/BGA Rework Solutions incorporates the company's patented Focused Infra-Red (FIR) rework system technology to replace Lightmaster. Hands free and semiautomatic, the IR-X400 provides the highest level of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, uBGAs, CSPs and flip chips. The IR-X400 combines its Focused IR heating system with a Dual Zone IR PCB pre-heater, with independent component and PCB closed loop temperature control.
(October 24)
ESSEMTEC Pick-and-Place System
AESCH, SWITZERLAND
EXPERT pick-and-place machine from ESSEMTEC AG can mount small batches and prototypes of SMD assembled boards. The pick-and-place head is air suspended, moving gently and ergomically and allowing a fast and accurate work. When the component structures get to fine or if a manual alignment is impossible, such as in the case of BGA, micro-BGA or flip chip, then the MPL3100 integrated vision and placement system's double prisma optical system can display the component and the substrate overlaid on one screen.
(October 23)
Small Shot Systems from I&J Fisnar
FAIR LAWN, N.J.
The I&J10 Series from I&J Fisnar Inc. is a family of small shot systems that can dispense from 0.012 cc to 5 cc of mixed material with an accuracy of 1 percent using a Dead-Stop feature to ensure repeatability. The system can be robot mounted (I&J10R) and can be supplied with a stepping-motor drive (I&J10RS) to avoid pneumatic stroke delays and enable a variation of dispense rate to ensure consistency in bead diameter when form-in-place materials are being dispensed.
(October 23)
Software from Photon Dynamics
SAN JOSE, CALIF.
RTI 4.9 software package from Photon Dynamics Inc. is for the SV-7550 automated optical inspection (AOI) system, and the SVX-2000 automated optical and X-ray inspection system. The software includes a host of intelligent features designed to provide printed circuit board assembly manufacturers with increased performance and continued yield improvements. As compared to the company's prior software versions, RTI 4.9 now provides the highest defect coverage with the lowest false calls using advanced, intelligent algorithms and an auto-retest option.
(October 22)
MOSFETs from International Rectifier
EL SEGUNDO, CALIF.
HEXFET power MOSFETs from International Rectifier includes the IRFR3504 and IRFU3504, featuring 9.2 milliohms on-resistance. Typical applications include emerging 42 V and current 14 V automatic sub-systems such as cooling fan controls, integrated starter alternator (ISAD) circuits, synchronous rectifier alternators, electrical power steering (EPS), fuel injectors, solenoid and relay drivers, air bag systems, anti-lock brake systems, and window and door lifts.
(October 22)
Pail Pump from I&J Fisnar
FAIR LAWN, N.J.
Model 560092A manual pail pump from I&J Fisnar Inc. is a solution for extracting bulk viscous materials from 5 gal (19 liter) straight-walled pails. Examples of materials include grease and pastes. A hand lever pumps the fluid to a syringe adaptor for cartridge filling. The syringe is filled form the needle end, and the syringe fills from the bottom up, causing a polyethylene or neoprene piston to rise up. This method prevents any air from being trapped in the syringe.
(October 21)
Vishay Chip Resistor
MALVERN, PA.
CRCW0201 thick film rectangular chip resistor from Vishay Intertechnology Inc. is designed with the industry's smallest footprint to enable downsizing in applications where board space is critical. Packaged in an industry-standard 0201 case measuring 0.024 x 0.012" (0.6 x 0.3 mm) with a height profile of 0.009" (0.23 mm), the chip resistor is suited for compact end products including memory modules, cell phones, PCMCIA cards, hearing aids, sensors, frequency control devices and notebook computers.
(October 21)
Aries Electronics Adapters
FRENCHTOWN, N.J.
Line of Correct-A-Chip adapters from Aries Electronics Inc. is expanded to allow new SSOP devices to be used on boards designed for older SOWIC packages, without board rework or redesign. The adapters are now available in a new 28-pin version (part # 28-555000-00). The SSOP-to SOWIC adapters also are available in a 20-pin version (part # 20-555000-00), with other popular pin counts, including 14-, 16- and 24-pin versions currently under development.
(October 18)
Multi-Chip Packages from White Electronic Designs
PHOENIX
Double data rate SDRAM multi-chip packages from White Electronic Designs Corp. are 128 Mbyte DDR SDRAM PBGAs designed to complement high-performance memory controllers, and are available at speeds of 200 MHz, 250 MHz and 266 MHz. Each DDR SDRAM is housed in a 219 plastic ball grid array package that saves 40 percent board space over a comparable discrete approach, and has a lower profile than other high-density memory approaches. It also reduces I/O connections by up to 19 percent, and provides reduced inductance and capacitance for low noise performance.
(October 18)
PolarFab Brochure
BLOOMINGTON, MINN.
Brochure from PolarFab details the company's analog/mixed signal foundry services. The four-page brochure is a reference guide for companies evaluating outsourced foundry services to reduce their time-to-volume to bring new products to market. PolarFab's core competencies and company history are included in the new brochure, describing how the company's 30 years of experience enables the company to develop close working relationships with customers. Additionally, the brochure provides a brief overview of PolarFab's bipolar and BiCMOS wafer fabrication technologies for manufacturing semiconductors used in the analog/mixed signal communications and power management markets.
(October 17)
Catalog from Saint-Gobin Performance Plastics
BRISTOL, R.I.
Catalog from Saint-Gobain Performance Plastics describes the newest addition to the Meldin family of high-temperature polyimides, the Meldin 7000 Series. Operational temperatures are 600 degrees F (315 degrees C) for continuous operation and 900 degrees F (482 degrees C) for intermittent exposure. The Meldin 7000 Series polyimides can be processed by direct forming, a molding method similar to powdered metallurgy. Using high-pressure mold presses, automatic resin feeding systems and computer-controlled hydraulics, this direct forming process can produce complex parts in an efficient, high-volume production method.
(October 17)
Micro Control Burn-In System
MINNEAPOLIS
HPB-5 high-power burn-in system from Micro Control Co. was designed to meet the challenges of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 35 W, while supporting testing large numbers of lower-power devices. Features include individual device under test temperature control to within plus or minus 5 degrees C and 128 I/O channels per driver/receiver.
(October 16)
Connectors from ITT Industries
SANTA ANA, CALIF.
PHD multi-channel optical interconnects system from ITT Industries, Cannon now includes a new line of harsh environment connectors. These new connectors are designed specifically for military, avionics and industrial applications where optimal performance is required in severe conditions. The expanded PHD system includes the environmentally sealed PHD 38999 for military and avionics applications and the Poseidon PHD for industrial and other commercial applications.
(October 16)
WLP Technology from Kulicke & Soffa
WILLOW GROVE, PA.
Spheron wafer level package (WLP) technology from Kulicke & Soffa Industries Inc. expands the capability and performance of the company's WLP product family. Spheron technology delivers improved coupling capacitance because the under bump metallization (UBM) and solder structure reside on top of a 5 micron low-k dielectric film. The film was developed for low modulus, high elongation value, adhesion to organic and inorganic materials, and tolerance to exposure manufacturing tolerances.
(October 15)
Concoat Systems Thermal Profiling Software
PEPPERELL, MASS.
The latest version of SoldaPro Wizard thermal profiling software from Concoat Systems is for determining optimum reflow profiles and corresponding oven settings. The user attaches the thermocouple probes of a SoldaPro thermal profiler (or data logger) to an assembly, runs it through an oven, and SoldaPro Wizard will reveal the exact zone settings for the optimum profile of that PCB and its components, without any form of guesswork. At the software's core is a multi-dimensional adaptive matrix -- more commonly known as a Neural Net -- that continually learns for itself how an oven behaves thermally.
(October 15)
Flomerics Software Tool
SOUTHBORO, MASS.
Flo/MCAD software tool from Flomerics Inc. is designed to take production-quality CAD files and simplify them for thermal analysis within Flotherm, the company's thermal management package. Flo/MCAD can read files from virtually any 3-D solid modeling program via STEP, IGES and SAT formats, and allows users to control exactly how much detail is retained for the thermal analysis, giving them the power to decide the complexity of the final data they receive.
(October 14)
RF Solutions Power Amplifier
NORCROSS, GA.
RFS P2020 power amplifier from RF Solutions Inc. has the WLAN industry's highest efficiency and range for 802.11b and g (draft) products. The multimode P2020 is a high-performance InGaP HBT integrated circuit, and maintains its efficiency with on-chip self-regulating dynamic power control, eliminating the need for external control circuitry to regulate current consumption. The result is maximum efficiency at both low and high power levels in 11b and 11g modes, extending system battery life.
(October 14)
Cascade Microtech CV Probing Solution
BEAVERTON, ORE.
S300 semiautomatic probing solution for 300mm wafers from Cascade Microtech features off-wafer, thermally isolated SOL calibration standards; off-wafer system reference capacitors; and high frequency probes and accessories. When used with the company's patented MicroChamber, a localized measurement closure and the AttoGuard guard shield, on-wafer capacitance is assured.
(October 11)
Tra-Con Epoxy
BEDFORD, MASS.
TRA-DUCT 921M01 two-part, electrically conductive heat-curing epoxy from Tra-Con Inc. exhibits a combination of good mechanical and electrical properties, and develops strong, durable bonds to a variety of substrates. The paste has a long pot life and two-day working life, which targets it for use in screen printing or automatic dispensing applications. This material comes in both pre-mixed and frozen syringes, as well as custom bipax packaging.
(October 11)
Backside Probe Station from Micromanipulator Co.
CARSON CITY, NEV.
Double-sided backside probe station from The Micromanipulator Co. has been designed to probe the backside and front side of the wafer simultaneously. The probe station is targeted for use in emission microscopy, optical device characterization and MEMS analysis. The 8000 Series probe stations are for use with 200mm (8") wafers, and the 9000 Series probe stations are for use with 300mm (12")wafers.
(October 10)
Pressure-Sensitive Adhesives from Adhesives Research
GLEN ROCK, PA.
ARclad 8314, ARclad 8901 and ARclad 7992 pressure-sensitive adhesives (PSAs) from Adhesives Research Inc. are designed for lens bonding and escutcheon bonding in mobile phone handsets, including new 2.5G and upcoming 3G mobile phone handsets. The 8314 and 8901 PSAs are both 8-mil, double-sided, high-tack acrylic pressure-sensitive bonding tapes for use with high- and low-surface energy materials typically used in handset assembly. The 7992 PSA is a 5-mil, double-sided acrylic adhesive supported by a polyester film, and is suggested for handset assembly applications requiring thinner bond lines.
(October 10)
3-D Scanning System from PPT VISION
EDEN PRAIRIE, MINN.
PPT861-SH high-speed, automated 3-D and 2-D inspection system from PPT VISION provides precise measurement of a broad range of critical device parameters. Using the patented SMI (Scanning Moire Interferometry) 3-D technology, the PPT861-SH allows 100 percent production inspection of devices in strip format by delivering comprehensive measurement results at high speeds. Designed for fast and easy changeovers, this inline or batch processing inspection system is targeted for use in small lot production or high volume applications.
(October 9)
Fishman Syringes
HOPKINTON, MASS.
Industrial polypropylene syringes from Fishman Corp. feature zero-draft barrel I.D.s and drip-free pistons for dispensing light fluids, as well as a 0.062" wide dispensing orifice to assure proper fluid flow. ANSI/HIMA MD70-1-1983 standard luer lock threads are standard. Certified silicone-free, these syringes come in three colors and six sizes for applying small dots, beads and potting.
(October 9)
Coreco Input Module
MONTREAL
Digital Input Module from Coreco Imaging for the Bandit-II RGB (AGP) and Bandit-II MV frame grabbers extend image acquisition and processing capabilities of both boards. The Bandit-II Digital Module acquires images at resolutions of up to 2,048 x 1,024 pixels from single or dual tap area scan cameras, 8-bits/pixel wide at 60 MHz or 10-bit/pixel wide at 30 MHz in dual channel mode. LVDS and RS-422 compatible, the Digital Module features four 256x8-bit and one 1,024x8-bit programmable input lookup tables (LUTs).
(October 8)
Continuity Tester from ProductionLine Testers
PLEASANTON, CALIF.
OS-32 automated continuity test system from ProductionLine Testers is a self-contained, auto programming test system that gives results of shorts and open circuits used to verify the integrity of IC package bond wires, bare and assembled printed circuit boards, and short cable assemblies. The system is targeted for production test, incoming inspection and design verification, as well as rework and repair stations. The system provides 16-bit accuracy on both the source and measurement and fast measurement switching on up to 1,000 pins, ensuring complete electrical continuity testing on all internal connections for a 100 percent test of all connections.
(October 8)
X-ray Tube from FeinFocus
STAMFORD, CONN.
Multifocus X-ray tube from FeinFocus USA Inc. provides the ability to switch between three inspection modes -- microfocus, nanofocus and high-power -- with a mouse click. This solution is designed for industries that require thorough inspection of a variety of samples differing in size and material. The tube is designed for long-term intensity control and stability, and is entirely software-driven, including automatic tuning features that allow the user to switch between and use the three different inspection modes.
(October 7)
Midcom Ceramic Transfer Technology
WATERTOWN, S.D.
Ceramic transformer technology from Midcom Inc. is based upon a highly automatable process similar to that used on multilayer capacitors, but instead uses a ferrite low temperature co-fired ceramic (LTCC) material set. The company recently released a standard product line of miniature switch mode power transformers using this technology to replace many wirewound magnetics devices.
(October 7)
DC/DC Converters from di/dt
CARLSBAD, CALIF.
SemiH family of DC/DC converters from di/dt Inc. is in the half brick format, and has a package size that is 70 percent the area of conventional half bricks, but preserves the same pinout and functionality. The SHM48T30 and SHM48T40 are the first two series of products in the SemiH family, and deliver 30 A and 40 A, respectively, of output current with minimal derating at elevated temperatures and low airflow. The 3.3 V versions have an efficiency of 92 percent at full load, and 92.5 percent at half load.
(October 4)
Cobar Solder Paste
BREDA, HOLLAND
XM5 Series solder pastes from Cobar BV are known as the "Tombstone Killer." The paste contains an anti-tombstoning combination of alloy powder particles based on Sn63 and Sn62 solders with a specially formulated polymer flux system. The solder paste formula has proven to be thermally stable, ensuring that the paste activity survives the heat of the reflow process, delivering zero-defect level soldering performance and the elimination of tombstoning.
(October 4)
Sony Visible Laser Diode from Photonic Products Ltd.
BISHOPS STORTFORD, UK
SLD1332V laser diode from Sony is being introduced by Photonic Products Ltd. The diode is a high power, high brightness visible laser diode suitable for use in machine vision, therapeutic medical lasers and measurement applications. It offers 500 mW optical power output at a wavelength of 670 nm, with internal monitor photodiode in a 9 mm package. The SLD1332V has a AlGaInP quantum well structure, which enables it to achieve the high brightness needed for machine vision applications used in autonomous vehicles, industrial inspection, medical imaging, remote sensing, surveillance and transport.
(October 3)
SIS System from ULVAC
METHUEN, MASS.
Self-ionized sputter (SIS) system from ULVAC Technologies Inc. is for dual damascene copper wiring. The SIS sputtering technology deposits barrier metal/Cu seed films, and guarantees complete filling of Cu seed interconnects at the 90 nm device node. In addition, the company is developing new SIS technology for the 70nm geometry that deposits very uniform barrier metal and seed layers. SIS technology improves sputtering functionality and efficiency at lower cost than CVD technology.
(October 3)
Kulicke & Soffa Fine Pitch Epoxy Probe Card
WILLOW GROVE, PA.
DuraPlus fine pitch epoxy probe card from Kulicke & Soffa Industries Inc. is designed to reduce cost of ownership while potentially increasing bond yields. A dramatically reduced scrub signature is achieved through use of a new tip radiusing process and by minimizing scrub variation between layers using optimized probe geometries. When combined with a non-destructive cleaning process, the net result is less bond pad damage, improved signal integrity, decreased cleaning cycles and increased card life.
(October 2)
Fox Electronics Oscillators
FORT MYERS, FLA.
LV-PECL oscillator series from Fox Electronics measures 7 x 5 mm, and is available with stabilities as tight as plus or minus 20 ppm. The series is targeted for telecommunications applications including SONET, gigabit ETHERNET and Fibre channel. The 3.3 V oscillators feature a standby function for low power consumption in sleep mode as well as complementary outputs. Standard operating temperature range is -10 degrees C to 70 degrees C (14 degrees F to 158 degrees F), with an optional -40 degrees C to 85 degrees C (-40 degrees F to 185 degrees F) range available for most models.
(October 2)
Flex Circuit Design Guide from Samtec
NEW ALBANY, IND.
Flex circuit design guide from Samtec Inc. is for the company's Sudden Flex line of flex circuit interconnects. Capabilities range from standard and high-speed data links to completely custom circuits populated with traditional connectors. Custom capabilities include single and double-sided circuits and multilayer circuits. Maximum panel size is 12 x 18" (300 x 450 mm) with tin, hard gold, nickel or HAL solder finishes.
(October 1)
DC/DC Converter Catalog from DATEL
MANSFIELD, MASS.
DC/DC converter catalog from DATEL Inc. functions as a Web site guide, and navigates 425 products, pointing to PDF datasheets available in two clicks. Twenty new products include 15 A 1/8th bricks, SMT 1/4 bricks and 96 percent efficient point-of-load converters. The catalog is available in printed or interactive PDF format.
(October 1)
Epoxy System from Master Bond
HACKENSACK, N.J.
EP30LTE-LO epoxy system from Master Bond Inc. features low shrinkage, high dimensional stability and a low coefficient of thermal expansion. The system has passed ASTM 595 for low outgassing, and is now being used in applications requiring vacuum compatibility, sealant or encapsulant. EP30LTE-LO offers a 10:1 mix ratio by weight with a room temperature cure.
(September 30)
Denver Semiconductor Equipment Flip Chip Bonder
MOORPARK, CALIF.
Model 850 flip chip bonder from Denver Semiconductor Equipment Corp. is designed for flip chips, chip scale devices and bare die used in entry level low-volume production and development project environments requiring placement accuracies of plus or minus 12 micron. The bonder may be ordered with a Model 870 attachment for reworking flips.
(September 30)
Test Interface Units Brochure from Kulicke & Soffa
WILLOW GROVE, PA.
Brochure from Kulicke & Soffa Industries Inc. describes the company's capability in the design, production and assembly of test interface units that interconnect IC packages to automated test equipment for packaged IC test and verification. This includes the design and production of test sockets and contactors; ATE boards and adapters; the assembly of the components into a single, integrated unit; and examples of several different test interface units for different IC test applications.
(September 27)
Molex Socket
LISLE, ILL.
Micro PGA socket from Molex Inc. allows the user to achieve high-density ball grid array packaging for the Intel Mobile Pentium 4 Processor-M series. The socket is available in 478 circuits and also can be used with Intel Mobile Celeron processors for applications such as blade servers or thin notebook PCs. The socket's BGA solder balls are self-centering and help to prevent bent leads that can occur with standard SMT tails, especially in high pin count applications. BGA processing also provides good thermal control between components and the PCB for stable reflow soldering.
(September 27)
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