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WLP Technology from Kulicke & Soffa
WILLOW GROVE, PA.
Spheron wafer level package (WLP) technology from Kulicke & Soffa Industries Inc. expands the capability and performance of the company's WLP product family. Spheron technology delivers improved coupling capacitance because the under bump metallization (UBM) and solder structure reside on top of a 5 micron low-k dielectric film. The film was developed for low modulus, high elongation value, adhesion to organic and inorganic materials, and tolerance to exposure manufacturing tolerances.
(October 15)
Concoat Systems Thermal Profiling Software
PEPPERELL, MASS.
The latest version of SoldaPro Wizard thermal profiling software from Concoat Systems is for determining optimum reflow profiles and corresponding oven settings. The user attaches the thermocouple probes of a SoldaPro thermal profiler (or data logger) to an assembly, runs it through an oven, and SoldaPro Wizard will reveal the exact zone settings for the optimum profile of that PCB and its components, without any form of guesswork. At the software's core is a multi-dimensional adaptive matrix -- more commonly known as a Neural Net -- that continually learns for itself how an oven behaves thermally.
(October 15)
Flomerics Software Tool
SOUTHBORO, MASS.
Flo/MCAD software tool from Flomerics Inc. is designed to take production-quality CAD files and simplify them for thermal analysis within Flotherm, the company's thermal management package. Flo/MCAD can read files from virtually any 3-D solid modeling program via STEP, IGES and SAT formats, and allows users to control exactly how much detail is retained for the thermal analysis, giving them the power to decide the complexity of the final data they receive.
(October 14)
RF Solutions Power Amplifier
NORCROSS, GA.
RFS P2020 power amplifier from RF Solutions Inc. has the WLAN industry's highest efficiency and range for 802.11b and g (draft) products. The multimode P2020 is a high-performance InGaP HBT integrated circuit, and maintains its efficiency with on-chip self-regulating dynamic power control, eliminating the need for external control circuitry to regulate current consumption. The result is maximum efficiency at both low and high power levels in 11b and 11g modes, extending system battery life.
(October 14)
Cascade Microtech CV Probing Solution
BEAVERTON, ORE.
S300 semiautomatic probing solution for 300mm wafers from Cascade Microtech features off-wafer, thermally isolated SOL calibration standards; off-wafer system reference capacitors; and high frequency probes and accessories. When used with the company's patented MicroChamber, a localized measurement closure and the AttoGuard guard shield, on-wafer capacitance is assured.
(October 11)
Tra-Con Epoxy
BEDFORD, MASS.
TRA-DUCT 921M01 two-part, electrically conductive heat-curing epoxy from Tra-Con Inc. exhibits a combination of good mechanical and electrical properties, and develops strong, durable bonds to a variety of substrates. The paste has a long pot life and two-day working life, which targets it for use in screen printing or automatic dispensing applications. This material comes in both pre-mixed and frozen syringes, as well as custom bipax packaging.
(October 11)
Backside Probe Station from Micromanipulator Co.
CARSON CITY, NEV.
Double-sided backside probe station from The Micromanipulator Co. has been designed to probe the backside and front side of the wafer simultaneously. The probe station is targeted for use in emission microscopy, optical device characterization and MEMS analysis. The 8000 Series probe stations are for use with 200mm (8") wafers, and the 9000 Series probe stations are for use with 300mm (12")wafers.
(October 10)
Pressure-Sensitive Adhesives from Adhesives Research
GLEN ROCK, PA.
ARclad 8314, ARclad 8901 and ARclad 7992 pressure-sensitive adhesives (PSAs) from Adhesives Research Inc. are designed for lens bonding and escutcheon bonding in mobile phone handsets, including new 2.5G and upcoming 3G mobile phone handsets. The 8314 and 8901 PSAs are both 8-mil, double-sided, high-tack acrylic pressure-sensitive bonding tapes for use with high- and low-surface energy materials typically used in handset assembly. The 7992 PSA is a 5-mil, double-sided acrylic adhesive supported by a polyester film, and is suggested for handset assembly applications requiring thinner bond lines.
(October 10)
3-D Scanning System from PPT VISION
EDEN PRAIRIE, MINN.
PPT861-SH high-speed, automated 3-D and 2-D inspection system from PPT VISION provides precise measurement of a broad range of critical device parameters. Using the patented SMI (Scanning Moire Interferometry) 3-D technology, the PPT861-SH allows 100 percent production inspection of devices in strip format by delivering comprehensive measurement results at high speeds. Designed for fast and easy changeovers, this inline or batch processing inspection system is targeted for use in small lot production or high volume applications.
(October 9)
Fishman Syringes
HOPKINTON, MASS.
Industrial polypropylene syringes from Fishman Corp. feature zero-draft barrel I.D.s and drip-free pistons for dispensing light fluids, as well as a 0.062" wide dispensing orifice to assure proper fluid flow. ANSI/HIMA MD70-1-1983 standard luer lock threads are standard. Certified silicone-free, these syringes come in three colors and six sizes for applying small dots, beads and potting.
(October 9)
Coreco Input Module
MONTREAL
Digital Input Module from Coreco Imaging for the Bandit-II RGB (AGP) and Bandit-II MV frame grabbers extend image acquisition and processing capabilities of both boards. The Bandit-II Digital Module acquires images at resolutions of up to 2,048 x 1,024 pixels from single or dual tap area scan cameras, 8-bits/pixel wide at 60 MHz or 10-bit/pixel wide at 30 MHz in dual channel mode. LVDS and RS-422 compatible, the Digital Module features four 256x8-bit and one 1,024x8-bit programmable input lookup tables (LUTs).
(October 8)
Continuity Tester from ProductionLine Testers
PLEASANTON, CALIF.
OS-32 automated continuity test system from ProductionLine Testers is a self-contained, auto programming test system that gives results of shorts and open circuits used to verify the integrity of IC package bond wires, bare and assembled printed circuit boards, and short cable assemblies. The system is targeted for production test, incoming inspection and design verification, as well as rework and repair stations. The system provides 16-bit accuracy on both the source and measurement and fast measurement switching on up to 1,000 pins, ensuring complete electrical continuity testing on all internal connections for a 100 percent test of all connections.
(October 8)
X-ray Tube from FeinFocus
STAMFORD, CONN.
Multifocus X-ray tube from FeinFocus USA Inc. provides the ability to switch between three inspection modes -- microfocus, nanofocus and high-power -- with a mouse click. This solution is designed for industries that require thorough inspection of a variety of samples differing in size and material. The tube is designed for long-term intensity control and stability, and is entirely software-driven, including automatic tuning features that allow the user to switch between and use the three different inspection modes.
(October 7)
Midcom Ceramic Transfer Technology
WATERTOWN, S.D.
Ceramic transformer technology from Midcom Inc. is based upon a highly automatable process similar to that used on multilayer capacitors, but instead uses a ferrite low temperature co-fired ceramic (LTCC) material set. The company recently released a standard product line of miniature switch mode power transformers using this technology to replace many wirewound magnetics devices.
(October 7)
DC/DC Converters from di/dt
CARLSBAD, CALIF.
SemiH family of DC/DC converters from di/dt Inc. is in the half brick format, and has a package size that is 70 percent the area of conventional half bricks, but preserves the same pinout and functionality. The SHM48T30 and SHM48T40 are the first two series of products in the SemiH family, and deliver 30 A and 40 A, respectively, of output current with minimal derating at elevated temperatures and low airflow. The 3.3 V versions have an efficiency of 92 percent at full load, and 92.5 percent at half load.
(October 4)
Cobar Solder Paste
BREDA, HOLLAND
XM5 Series solder pastes from Cobar BV are known as the "Tombstone Killer." The paste contains an anti-tombstoning combination of alloy powder particles based on Sn63 and Sn62 solders with a specially formulated polymer flux system. The solder paste formula has proven to be thermally stable, ensuring that the paste activity survives the heat of the reflow process, delivering zero-defect level soldering performance and the elimination of tombstoning.
(October 4)
Sony Visible Laser Diode from Photonic Products Ltd.
BISHOPS STORTFORD, UK
SLD1332V laser diode from Sony is being introduced by Photonic Products Ltd. The diode is a high power, high brightness visible laser diode suitable for use in machine vision, therapeutic medical lasers and measurement applications. It offers 500 mW optical power output at a wavelength of 670 nm, with internal monitor photodiode in a 9 mm package. The SLD1332V has a AlGaInP quantum well structure, which enables it to achieve the high brightness needed for machine vision applications used in autonomous vehicles, industrial inspection, medical imaging, remote sensing, surveillance and transport.
(October 3)
SIS System from ULVAC
METHUEN, MASS.
Self-ionized sputter (SIS) system from ULVAC Technologies Inc. is for dual damascene copper wiring. The SIS sputtering technology deposits barrier metal/Cu seed films, and guarantees complete filling of Cu seed interconnects at the 90 nm device node. In addition, the company is developing new SIS technology for the 70nm geometry that deposits very uniform barrier metal and seed layers. SIS technology improves sputtering functionality and efficiency at lower cost than CVD technology.
(October 3)
Kulicke & Soffa Fine Pitch Epoxy Probe Card
WILLOW GROVE, PA.
DuraPlus fine pitch epoxy probe card from Kulicke & Soffa Industries Inc. is designed to reduce cost of ownership while potentially increasing bond yields. A dramatically reduced scrub signature is achieved through use of a new tip radiusing process and by minimizing scrub variation between layers using optimized probe geometries. When combined with a non-destructive cleaning process, the net result is less bond pad damage, improved signal integrity, decreased cleaning cycles and increased card life.
(October 2)
Fox Electronics Oscillators
FORT MYERS, FLA.
LV-PECL oscillator series from Fox Electronics measures 7 x 5 mm, and is available with stabilities as tight as plus or minus 20 ppm. The series is targeted for telecommunications applications including SONET, gigabit ETHERNET and Fibre channel. The 3.3 V oscillators feature a standby function for low power consumption in sleep mode as well as complementary outputs. Standard operating temperature range is -10 degrees C to 70 degrees C (14 degrees F to 158 degrees F), with an optional -40 degrees C to 85 degrees C (-40 degrees F to 185 degrees F) range available for most models.
(October 2)
Flex Circuit Design Guide from Samtec
NEW ALBANY, IND.
Flex circuit design guide from Samtec Inc. is for the company's Sudden Flex line of flex circuit interconnects. Capabilities range from standard and high-speed data links to completely custom circuits populated with traditional connectors. Custom capabilities include single and double-sided circuits and multilayer circuits. Maximum panel size is 12 x 18" (300 x 450 mm) with tin, hard gold, nickel or HAL solder finishes.
(October 1)
DC/DC Converter Catalog from DATEL
MANSFIELD, MASS.
DC/DC converter catalog from DATEL Inc. functions as a Web site guide, and navigates 425 products, pointing to PDF datasheets available in two clicks. Twenty new products include 15 A 1/8th bricks, SMT 1/4 bricks and 96 percent efficient point-of-load converters. The catalog is available in printed or interactive PDF format.
(October 1)
Epoxy System from Master Bond
HACKENSACK, N.J.
EP30LTE-LO epoxy system from Master Bond Inc. features low shrinkage, high dimensional stability and a low coefficient of thermal expansion. The system has passed ASTM 595 for low outgassing, and is now being used in applications requiring vacuum compatibility, sealant or encapsulant. EP30LTE-LO offers a 10:1 mix ratio by weight with a room temperature cure.
(September 30)
Denver Semiconductor Equipment Flip Chip Bonder
MOORPARK, CALIF.
Model 850 flip chip bonder from Denver Semiconductor Equipment Corp. is designed for flip chips, chip scale devices and bare die used in entry level low-volume production and development project environments requiring placement accuracies of plus or minus 12 micron. The bonder may be ordered with a Model 870 attachment for reworking flips.
(September 30)
Test Interface Units Brochure from Kulicke & Soffa
WILLOW GROVE, PA.
Brochure from Kulicke & Soffa Industries Inc. describes the company's capability in the design, production and assembly of test interface units that interconnect IC packages to automated test equipment for packaged IC test and verification. This includes the design and production of test sockets and contactors; ATE boards and adapters; the assembly of the components into a single, integrated unit; and examples of several different test interface units for different IC test applications.
(September 27)
Molex Socket
LISLE, ILL.
Micro PGA socket from Molex Inc. allows the user to achieve high-density ball grid array packaging for the Intel Mobile Pentium 4 Processor-M series. The socket is available in 478 circuits and also can be used with Intel Mobile Celeron processors for applications such as blade servers or thin notebook PCs. The socket's BGA solder balls are self-centering and help to prevent bent leads that can occur with standard SMT tails, especially in high pin count applications. BGA processing also provides good thermal control between components and the PCB for stable reflow soldering.
(September 27)
Marking System from GSI Lumonics
WILMINGTON, MASS.
CSP300 wafer-level CSP marking system from GSI Lumonics Inc. marks WLCSPs and bare die on 300mm wafers. The high throughput, highly accurate CSP300 is fully automated for "in line" production marking of 200mm to 300mm wafers. It provides the marking accuracy required for sub-1mm integrated circuit sizes regarded as critical to portable electronics, and marks only good die as determined by information downloaded from prober wafer maps.
(September 26)
Creative Materials Conductive Ink and Coating
TYNGSBORO, MASS.
The 122-22 screen-printable, electrically conductive ink and coatingfrom Creative Materials Inc. is particularly useful for plated through-hole applications. The system is designed to maintain stable viscosity during all application methods, and has a low odor. The product adheres to FR2, FR3 and FR4, PCB substrates, and Kapton, Mylar, glass and a variety of other substrates. Applications include electroless plating and EMI/RFI shielding of polyimide flexible circuits.
(September 26)
Photonic Products Laser Diode
BISHOPS STORTFORD, UK
HL6512MG high output red laser diode from Photonic Products Ltd. features a rated optical output power of 50 W cw (70 mW pulsed) at 658 nm. The AlGaInP laser diode features a multi-quantum well (MQW) structure. Its beam divergence (parallel to the junction) has a small variation to the optical output power. This characteristic makes it possible to suppress the variation of spot size between higher and lower output powers. It is suitable as a light source for large capacity rewriteable optical disc memories, such as DVD-RAM, and various other types of optical equipment.
(September 25)
Spincoat System from Specialty Coating Systems
INDIANAPOLIS, IND.
The G3 Series spincoat systems from Specialty Coating Systems accurately coats materials on planar substrates, including photoresists, polyamides, metallo-organics, dopants and silica firms. The series includes 8", 12" and 15" bowl models in three compact enclosure sizes. The 8" model is available in both non-programmable and programmable versions, while the 12" and 15" models are available as programmable units only. All models feature safety interlocked covers, and the programmable units incorporate a provision for external control via a communication port.
(September 25)
Combo Connector from Kycon
SAN JOSE, CALIF.
Combo connector from Kycon Inc. consists of three RCA phono jacks and one S-Video connector. The RCA phono jacks are available in the color combination red, white and yellow, and the S-Video connector comes in black. This combo connector is designed for use in audio and video multimedia applications, such as game consoles, VCRs and set-top boxes used for satellite, cable and terrestrial TV services. The combo connector is available in PCB mount, and in vertical and horizontal configurations. The main housing and the colored washers are made from ABS thermoplastic, and the contacts are made from brass and steel.
(September 24)
Mandrels from Applied Plastics
NORWOOD, MASS.
Teflon-coated stainless steel or nitinol forming mandrels from Applied Plastics Co. feature a 0.05 coefficient of friction for optimum release properties. The mandrels feature a uniform, non-flaking coating that provides a smooth, slippery surface that is chemically inert and withstands up to 500 degrees F operating temperatures. These mandrels will increase the manufacturing output of stent delivery systems and related medical parts.
(September 24)
Potting Gel from Fiber Optic Center
NEW BEDFORD, MASS.
OPTICAL JEL LS-3238 from Fiber Optic Center Inc. is manufactured by Lightspan and is a soft encapsulation material designed for protection of sensitive photonics and fiber optics modules from mechanical or thermal shock, dust and moisture. The product has a refractive index of 1.38 for aiding total internal reflection in silica fiber, as well as optical glass and plastic substrates. The gel's optically clear composition permits post-cure inspection of delicate assemblies.
(September 23)
SFP Optical Transceivers from Stratos Lightwave
CHICAGO
Small form-factor pluggable (SFP) optical transceivers from Stratos Lightwave Inc. now are available in multimode versions for fast Ethernet, ESCON and OC-3. The transceivers are a lower-cost alternative to single-mode devices, and allow users of these common communications protocols to expand their networks using multimode fiber, which may already be in place. Since the new multimode transceivers are hot-pluggable, they allow for field configuration of routers and switches, in the user's choice of single-mode or multimode operation.
(September 23)
Aries Shortform Catalog
FRENCHTOWN, N.J.
New 7th Edition shortform catalog from Aries Electronics Inc. covers a broad range of interconnection and packaging products. The 12-page catalog includes the Correct-A-Chip technology and products, which enable designers to convert virtually any package type or footprint to any other. Typical Correct-A-Chip products include DIP-to-PLCC adapters, standard DIP adapters, DIP-to-SOIC adapters, SMD-to-DIP adapters, PGA adapters, and countless other "from-to" configurations, while enabling designers to upgrade without board redesign or rework.
(September 20)
Design Guide from Natel
CHATSWORTH, CALIF.
Design guide from Natel Engineering Co. on die attach techniques in microelectronics design provides a series of die attach comparisons that, if reviewed before layout, can help microelectronic designers choose the right method for their particular application. Die attach involves connecting an IC module to a substrate. Errors often can occur during this process, such as the misapplication of paste epoxy where film epoxy should be used, and vice versa. Using a quick reference format, the guide provides specifications on each die attach method including film, liquid and paste epoxies; film adhesive; and solder and eutectic bonding.
(September 20)
MARKEM Automated Tray Handling System
KEENE, N.H.
Model U-1481 automatic direct laser marking and tray handling system from MARKEM Corp. is fully automated and capable of handling up to 25 standard or 40 thin JEDEC trays. The system takes up 1.45 sq. meters of factory floor space, and has exceptionally quiet operation when compared to other tray marking systems. The modular design of the U-1481 allows for it to be configured with pre-mark or post-mark vision inspection. The U-1481 also can be configured in a tabletop semi-automatic configuration for lower volume applications.
(September 19)
Leica Stereomicroscope
BANNOCKBURN, ILL.
MZ16 A high-performance stereomicroscope from Leica Microsystems Inc. is the first stereomicroscope that offers motorized zoom, automatic and pre-calibrated measurement functions at every magnification, and a digital LED information display. The MZ16 A also allows users to image 3-D structures as small as 600 nanometers for the first time. With motorized zoom and optional motorized focus, the stereomicroscope can be controlled easily and precisely with just finger or foot movement, and also via computer.
(September 19)
Transene Electronics Cleaning Materials
DANVERS, MASS.
Specially formulated for electronics and semiconductor applications, high-purity cleaning products from Transene Co. include Transene 100, Transene ultrasonic detergent, LGC-300 lab glass cleaner and Sequestrox. Solvent-based and aqueous systems sequester and remove a variety of contaminants and oils without leaving a residue.
(September 18)
CAD Library from Dorner
HARTLAND, WIS.
Dorner Manufacturing Corp.'s updated 2-D CAD library includes the company's Modular Plastic Belt Series (MPB) of conveyors. In addition to the MPB Series, the updated 2-D CAD library also includes the 2200 Series conveyor -- flush mount gear motor and multiple tier support stands. Other conveyors and accessories in the 2-D CAD library include the 2100 Series, 3100 Series, 4100 Series, 6100 Series, LPZ, gravity rollers, gearmotor mounting packages and the IMPAC 100 controller.
(September 18)
Silver Epoxy Adhesive from Tra-Con
BEDFORD, MASS.
TRA-DUCT 916H03 room-temperature high conductivity silver epoxy adhesive from Tra-Con Inc. cures at room temperature, and can be used as a "cold solder" for heat-sensitive components when hot soldering is impractical. It also can be used for the assembly and repair of electrical modules, printed circuits, wave guides, flat cable and high-frequency shields. This epoxy system provides strong bonds to gold- and nickel-plated substrates.
(September 17)
Vision System from PPT Vision
EDEN PRAIRIE, MINN.
IMPACT high-speed machine vision "micro system" from PPT VISION sets all-new industry standards for inspection power and flexibility, achieving a price/performance ratio unavailable in vision sensors or smart cameras. The system's power comes from its high-speed, dedicated processor and sub-pixel software algorithms for a broad range of inspection tasks, including Pattern Find, Blob, Edge Find, OCV, OCR, Gauge and Contrast Sensing. IMPACT can achieve 60 full-frames/sec image capture rate, and even greater speeds are achieved using the system's built-in support for partial scanning.
(September 17)
LCR Meter from QuadTech
MAYNARD, MASS.
Model 7600 full-featured laboratory LCR meter from QuadTech Inc. is for precision impedance measurements of resistive, capacitive and inductive components and materials. The instrument is suited for applications in R&D, quality control, incoming inspection or pass/fail production testing. The meter features a unique measurement function, where any of its 14 measurement parameters can be displayed in graphical or tabular form versus test frequency, voltage or current. This feature allows a sweep display to be shown on the instruments' front panel LCD display for fast verification of component response without any complex programming.
(September 16)
Kulicke & Soffa Dicing Blades
WILLOW GROVE, PA.
Endoro series of 2" nickel hub dicing blades from Kulicke & Soffa are specifically designed for singulating plastic CSP packages and BGA strips mounted on tape. The new blades are capable of achieving 1,000 to 3,000 meter cut lengths with maximum cut quality. The blades are available in 40 to 130 mil exposures (lengths) to process varying substrate thicknesses. Blade thicknesses can range from 6 to 13 mils, allowing the highest level of kerf width precision while delivering maximum strength and stability.
(September 16)
Adhesive/Sealant from Master Bond
HACKENSACK, N.J.
Polymer System X5HT is a one-component contact type adhesive/sealant featuring toughness and flexibility with a service temperature range of -75 degrees F up to 500 degrees F. In order to cure X5HT, it should be applied to each substrate, and then put under some pressure followed by curing at 300 to 400 degrees F for as little as 15 to 30 minutes in a properly vented oven. The amount of pressure required depends on the hardness of the substrates being bonded and is generally less than 50 psi. Bonding methods can include hot presses or vented ovens while the assemblies are clamped or fixtured. X5HT has a good storage stability at room temperature and a shelf life of six months.
(September 13)
I&J Fisnar Foot Pedal Dispenser
FAIR LAWN, N.J.
DB815 foot pedal dispensing system from I&J Fisnar Inc. features a simple operation. By pressing the neutral resistance foot pedal, regulated pneumatic air pressure is transmitted to a material syringe via a hose and syringe adapter. The rugged design of the DB815 provides years of maintenance-free operation. Two versions are available -- DB815 Standard and DB815-SB with "suck back," preventing material drool.
(September 13)
Bump Stepper from Ultratech Stepper
SAN JOSE, CALIF.
Saturn Spectrum 300e2 bump stepper from Ultratech Stepper Inc. was developed in response to the growing need for thick photoresist-exposure capabilities in 300 mm bump applications. The stepper features a new dual-lamp illumination option and edge processing capabilities designed specifically to deliver superior yield, imaging and throughput for advanced flip-chip and wafer-level packaging applications.
(September 12)
Asymtek Pump
CARLSBAD, CALIF.
DV-8000 Series pump from Asymtek is the newest model in the Heli-Flow pump series and is designed for high-speed dispensing of thick or compressible materials for lid seal and dam applications. The pump has optimized fluid delivery and increased production throughput by incorporating key structural modifications. The pump uses a fixed instead of a floating head, and a stiffened fluid path, reducing its compression effects and allowing for increased auger speeds and a higher flow rate. Applications include wire bond and packages with a lid seal such as microprocessor LCD displays and optical assemblies.
(September 12)
MARKEM Laser Marking System
KEENE, N.H.
Model 3010CR CodeRunner direct laser marking system from MARKEM Corp. is suited for use on a variety of non-metallic materials, which targets the system for marking variable identification codes onto PCBs, semiconductor packages and carriers, connectors, as well as passive and electromechanical devices. The MARKEM LaserSmith 3000 software is Windows-based, and incorporates all the features normally associated with the marking software packages of more expensive laser systems. With it, the CodeRunner can produce the highest-quality CO2 prints in the industry, and can be linked directly to the factory's network, allowing for full host interface capabilities. (September 11)
Diamond Heat Spreaders from Morgan Advanced Ceramics
NEW BEDFORD, MASS.
Diamonex CVD Diamond heat spreaders from Morgan Advanced Ceramics are targeted for use in high power device applications, such as laser diodes, microwave FETs and MMICs, and advanced multi-chip modules (MCMs). Due to diamonds' extremely high thermal conductivity, Diamonex CVC Diamond heat spreaders improve performance by reducing junction temperatures, allowing for increased power output, speed and reliability. The material also has a high electrical resistivity, which allows top-to-bottom isolation in the package design.
(September 11)
Aremco Washaway Adhesive
VALLEY COTTAGE, N.Y.
Crystalbond 555 low melting point thermoplastic adhesive from Aremco Products Inc. is used for the temporary mounting of materials such as ceramic substrates, semiconductors and optical crystals, which require dicing, polishing and other machining processes. It bonds to ceramics, glasses and metals, and becomes flowable at 120 degrees F. It also is transparent in thin cross-sections, enabling the user to observe the part during processing.
(September 10)
X-ray System from Dage
FREMONT, CALIF.
XT6600 sub-micron resolution X-ray inspection machine from Dage Precision Industries is for semiconductor and PCB manufacturing applications. The system offers a system magnification of up to 5,800X (4,800X as standard) and feature recognition of less than a single micron over its entire 458 x 407 mm inspection area. The level of inspection analysis is controlled by the company's operating software, which is driven by a completely intuitive point-and-click interface.
(September 10)
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