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Cham/Switzerland, July 17, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC's customers and will insure more accurate bonding performance and overall superior results.
ESEC qualifies the placement accuracy of their high-precision Die and Flip Chip Bonders with a newly developed, 0.5 µm high-resolution measuring tool. It is capable of taking thousands of unattended measurements over the entire bond range, under production conditions. To obtain this result, ESEC has combined its ceramic beam / air bearing gantry concept with advanced motion control. The placement accuracy is effective over a work envelope of 240x200mm. "We think ESEC's high-accuracy placement solution fulfills an important market request, specifically for optoelectronic packages, MEMS and advanced flip chip requirements," states Andre Nipkow, Product Director for ESEC. "Where other competitive offerings are accurate only in the immediate bond region, ESEC offers 5 µm placement accuracy across a large work area. This insures more stable bonding performance and overall superior results."
ESEC Micron - versatile platform for a multitude of applications
The Micron machine combines outstanding functionality on one platform. It not only serves for high-end flip chip bonding but also accommodates new processing technologies, such as direct chip attach on printed circuit boards, multi-chip modules, optoelectronics and MEMS (Micro-Electro-Mechanical Systems) assembly.
Micron 5003 to be seen at this years' Semicon Wes
ESEC is demonstrating the Micron 5003 with 5 µm placement accuracy at booth #10016 at Semicon West 2002. This trade fair, the premier annual event focused on the technology and business of semiconductor manufacturing, opens at the San Jose Convention Center on July 17. Semicon West 2002 will feature more than 1,460 exhibitors from around the world.
Those companies will occupy more than 362,000 net square feet of floor space and present the latest developments in semiconductor equipment, materials, services and technology. Last year, more than 60,000 people attended the show, making it one of the largest trade expositions in the Bay Area and Silicon Valley.
About ESEC
ESEC is a leading provider of chip-assembly equipment and system solutions for the semiconductor industry. The core businesses of ESEC are devoted to the fields of Die Attach (Die Bonders and Flip Chip Bonders) and Wire Bonding. ESEC employs more than 700 individuals in 8 countries throughout the world and is listed on the SWX Swiss Exchange (ticker symbol: ESEN). For more information visit www.esec.com.
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