Advanced Packaging - INDUSTRY NEWS TODAY

Hans Wunderl New Chief Executive Officer of ESEC
CHAM, SWITZERLAND
The Board of Directors of ESEC has appointed Hans Wunderl as chief executive officer as of October 1.

He will succeed Jurgen Knorr, who has been acting as the interim CEO since March 2002. Knorr will now focus on his tasks as vice chairman of the Board.

Wunderl has extensive experience and a proven track record in the front and back-end sectors of the semiconductor industry. His career has included various senior management positions in international companies, including IBM, Data General and ASMI.
(August 26)

Electronica 2002 Expands Focus on Embedded Systems
CHICAGO
electronica 2002, the world's largest electronics trade show, is expanding its focus on the growing embedded systems industry which is playing a big role in post-September 11 security devices in the U.S.

The Embedded Systems Conference runs November 11 through 13, concurrent with electronica 2002 in Munich, Germany. The conference features speakers, seminars and practical training targeted to engineers and engineering managers developing microprocessor-based electronic systems. General topics include architecture selection and specification, software design, programming and debugging, and hardware/software integration.

The conference is free with admission to electronica 2002, which takes place November 12 through 15 at New Munich Trade Fair Centre, and is expected to draw 85,000 international visitors.

In addition to the conference, electronica for the first time ever has an entire hall devoted to embedded systems exhibitors showcasing the latest products and trends.

Embedded systems consist of one or more microprocessors and software used in the operation or control of equipment and electronic devices. Embedded systems come in a variety of shapes and forms and impact several industries important in the U.S., including automobiles, airplanes, cell phones, trains, cameras, consumer and office appliances, toys, and machine tools.

Among the key topics at electronica 2002 is applications for identification and security devices. This is an important topic for U.S. technology companies who are competing for government contracts since September 11, including the Transportation Security Administration contract. There is an increased demand for leveraging technology to enhance security -- including smartcards -- that provide traveler identity and assess security risks.

In addition to embedded systems, electronica 2002 will cover the entire spectrum of electronics. Exhibits will cover topics including semiconductors, sensors and microsystems, passive components, displays, and power supplies. The field of automotive electronics will be presented in broad scope in the Automotive Innovation Arena, an area where exhibitors can present live applications, and the 3^rd International Congress for the 42-V PowerNet.
(August 23)

ChipPAC Reports Second Quarter Results
FREMONT, CALIF.
ChipPAC Inc., one of the world's largest and most diversified providers of semiconductor assembly and test services, has announced results for the second quarter ended June 30, 2002.

Revenues grew to $97.1 million, a 22.6 percent increase from the prior quarter and an 11.1 percent increase from the same quarter a year ago of $87.4 million. Gross margin improved to 18.3 percent, up 623 basis points from 12.1 percent in the prior quarter and an improvement of 518 basis points from 13.1 percent in the same quarter a year ago. Increased factory utilization rates, continued cost management, favorable product mix and price stability contributed to the improvement in margins. The company achieved operating income of $5.5 million in the second quarter, a more than threefold improvement from the prior quarter, ahead of original estimates. The company narrowed its loss before extraordinary item to $4.1 million or (5 cents) per diluted share. An extraordinary expense of $3 million was recorded for the write off of debt issuance costs related to the early repayment of term loans during the quarter. Revenues and loss before extraordinary item were both ahead of the company's initial guidance.
(August 22)

Semiconductor Assembly Council (SAC) November Meeting to Focus on Chip Scale Packaging (CSP), New Package Technologies and Materials
SUNNYVALE, CALIF.
The Semiconductor Assembly Council (SAC) semi-annual meeting will be held November 13 through 14, 2002, at the Four Points Sheraton Hotel here.

The meeting will offer the opportunity to network with semiconductor industry leaders and participate in technology discussions. The meeting agenda will include certification activities, technology sessions and committee updates. Attendees are invited to participate in technology sessions focused on chip scale packaging and materials including laminates, tape, lead frames and wafer level packaging.

At present, there are 18 SAC-certified organizations. All semiconductor manufacturers, material suppliers, equipment manufacturers and end-users are encouraged to participate in the organization.

SAC is a semiconductor industry organization comprised of manufacturers (AMD, National, Philips, etc.); end user companies (Qualcomm, Sun Microsystems, Daimler-Chrysler, Honeywell, etc.); assembly and test subcontractors (Amkor Technologies, ASE, ASAT, Carsem, etc.); and most recently material suppliers (Cookson, Loctite, QPL, Sumitomo). Its member companies represent at least three tiers of the supply chain who agree on one set of quality system requirements, and promote the effective use of quality tools.
(August 21)

Ziptronix Announces Room-Temperature, Non-Adhesive Wafer Bonding Technique
RESEARCH TRIANGLE PARK, N.C.
Ziptronix, a company spun from the Research Triangle Institute, has introduced a process that achieves permanent, covalent bonding of semiconductor materials at room temperature without adhesives.

The ZiROC technology allows aligned wafer-to-wafer and die-to-wafer bonding using standard process equipment, in ambient fab conditions. Initial applications include custom engineered substrates for temperature compensation and other thermal management needs. Moreover, the ZiROC bonding technique enables wafer-scale, hermetic encapsulation of MEMS and other surface-sensitive devices. Combined with Ziptronix' post-bonding interconnect process, the technology enables the 3-D integration of existing devices and, ultimately, the fabrication of custom solid-state systems architected in three dimensions.

"Our technology clears a new path to low-cost, high-performance system design," said Doug Milner, Ziptronix CEO. "Custom engineered substrates will enable new RF device applications. Wafer-scale, hermetic MEMS encapsulation moves a critical packaging step back into the fab and unleashes new, low-cost configurations."
(August 20)

Ismeca SA Selects Agilent Technologies to Partner in Providing Semiconductor Manufacturing Inspection Solutions
PALO ALTO, CALIF.
Agilent Technologies Inc. will integrate its leading machine vision suite and inspection solutions into Ismeca SA's semiconductor test handler equipment as part of an OEM agreement between the two companies.

The agreement is expected to result in the creation of a single, integrated solution that is superior in quality while maintaining high yields for small- to medium-sized components on Ismeca's test handlers.

Ismeca will integrate three Agilent Semiconductor Package Vision Inspection products into Ismeca's NT-16 and M-32 series test handlers. The Agilent LV8000 2D and 3-D Lead Inspection System modules are both high-speed machine vision inspection systems for final inspection and measurement of IC leads that help to improve final manufacturing output quality and ensure that products are shipped according to specifications. The MV8000 Mark Inspection Station is a high-speed PC-based solution that detects and classifies both simple and advanced mark defects to improve manufacturing yield, and is based on Windows NT.
(August 19)

ECTC Releases Call for Papers
NEW ORLEANS
The 53^rd Electronic Components & Technology Conference will be held at the Sheraton New Orleans Hotel here on May 27 through 30, 2003.

This conference offers papers covering a wide spectrum of topics, including not only electronic components, but also new developments in all areas of electronics technology (for example, electronics assembly, packaging, systems packaging, optoelectronics, reliability and materials). In 2002, more than 290 papers and posters and 14 short courses were presented by companies, universities and research institutions from around the world. The audience included representatives from a multitude of universities and companies eager to stay abreast of the rapidly changing and emerging technologies.

Abstracts must be received by October 15, 2002. Submissions must include the mailing address, business telephone number, facsimile number and e-mail address of the presenting author and the names and affiliations of all authors, and indicate no more than two Program subcommittees that should consider the paper for presentation and publication in the Proceedings. Acceptance of the paper will be based on the judgment of the subcommittees. Authors will be notified of paper acceptance with instructions for publication by December 15, 2002. Manuscripts are due in final form for publication in the Conference Proceedings by February 3, 2003. At the discretion of the program committee, abstracts may be considered for poster sessions. In addition to a printed copy conforming to the ECTC format, a computer file for the CD-ROM is needed in the preferred Microsoft Word format. Please check the Web site for information on alternate formats and for details on how to submit papers electronically.

The 53^rd ECTC conference is sponsored jointly by the Electronic Components, Assemblies, and Materials Association (the electronic components sector of the Electronic Industries Alliance) and the IEEE Components, Packaging and Manufacturing Technology Society.
(August 16)

Wall Street's View of the Global Semiconductor Equipment Industry Focus of SEMI New England Breakfast Forum
BOSTON
A distinguished panel of industry executives and analysts will explore the investment opportunities in the semiconductor equipment and materials industry during the next SEMI New England Breakfast Forum, Wednesday, September 25, 7:30-10:30 a.m., at the Boston Marriott Burlington in Burlington, Mass.

The breakfast forum is presented by Semiconductor Equipment and Materials International (SEMI).

Mitch Tyson, Brooks-PRI Automation, will moderate the discussion of the panel, which includes James Covello, analyst, Investment Research Department, Goldman Sachs; Douglas Kingsley, managing director, Advent International; Robert Stern, CFA, Needham & Co.; Edward C. White, managing director, Equity Research Department, Lehman Brothers; and Fred L. Wolf, managing director, director of research, Adams, Harkness and Hill Inc.

SEMI Reports Second Quarter 2002 Silicon Wafer Area Shipments
SAN JOSE, CALIF.
Worldwide silicon wafer area shipments improved by 26 percent during the second quarter 2002 when compared to the first quarter 2002 area shipments, according to Semiconductor Equipment and Materials International (SEMI) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 1,273 million square inches during the most recent quarter, up from the 1,011 million square inches shipped during the previous quarter. The new quarterly total area shipments represent a 29 percent improvement compared to the second quarter 2001 area shipments, but are 13 percent below the peak of 1,457 million square inches in the third quarter 2000.

"The positive growth in wafer shipments is a good sign for the industry following a dreadful year," said Stanley T. Myers, president and CEO of SEMI. "The silicon wafer manufacturers remain concerned that the current quarter shipments do not reflect recent news indicating a weaker than originally anticipated second half for the chip manufacturers. The lack of visibility for the remainder of this year, with respect to both corporate and consumer end market spending, is obviously a concern impacting the entire semiconductor industry."
(August 14)

Motorola Sells Equipment Manufacturing Assets to Zen Voce Manufacturing
SCHAUMBURG, ILL.
SINGAPORE
Motorola Inc. has entered into an agreement to sell some equipment manufacturing assets of Motorola Manufacturing Solutions -- Asia to Zen Voce Manufacturing Pte Ltd (Zen Voce), a wholly owned subsidiary of Zen Voce Holdings Pte Ltd.

Motorola also entered into an IP agreement to allow Zen Voce to design and manufacture the MSA250A-Plus Sphere Attach System.

Under the agreement, Zen Voce will manufacture and support Motorola's MSA250A-Plus Sphere Attach System out of its current facility at the Science Park in Singapore and will continue to provide warranty and post-warranty support to its current customer base.

The MSA250A-Plus is a fully automated equipment system used across the world in the fabrication of ball grid array package (BGA) and chip scale package (CSP) semiconductor packages.
(August 13)

Advanced Interconnect Technologies and Nakaya Microdevices Form Joint Venture
TOKYO
PLEASANTON, CALIF.
Advanced Interconnect Technologies (AIT) and Nakaya Microdevices Corp. of Japan have signed a memorandum of understanding to establish a joint venture to provide subcontract assembly and test services to Japan.

Under the agreement the two companies have formed AIT Nakaya Singapore PTE Ltd. AIT is the first U.S.-Based sub-contract assembly and test company to enter into a joint venture with a Japan-based sub-contract assembly and test company.

The objective of the joint venture is to channel the assembly and test demands of Japanese integrated device manufacturers (IDMs) to the high-volume, low-cost facilities AIT has located in Batam, Indonesia and Hong Kong. Nakaya has long-standing relationships with the major Japanese IDMs and their experience in assembly and test makes them the ideal partner for AIT.
(August 12)

Techcet Makes Sematech's Critical Materials Reports Available to Industry
GENOA, NEV.
For the first time, the Critical Materials Reports complied by Techcet, LLC for International SEMATECH are being offered to the semiconductor industry at large.

By agreement with International SEMATECH, the reports are now available from Techcet, a firm specializing in market forecast and technical trend analysis for the semiconductor materials and process industry.

Available at www.techcet.com, the Critical Material Reports consist of 12 individual reports that can be purchased separately or as a complete set. The cost per report varies from $995 to $1295 depending on the quantity and year.

Subjects covered in the reports include chemical mechanical polishing, gases, masks and reticles, wet chemicals, advanced interconnect materials (low k dielectrics and Cu electroplate), laminate packages, graphite parts, sputter targets, quartz, photoresist, photoresist ancillaries, and silicon carbide. (August 9)

TEL Plans to Begin Deliveries of Next Generation 300mm Process Coater/Developer in January 2004
TOKYO
Tokyo Electron Ltd. has developed the next generation 300mm process coater/developer targeting the 300mm wafer market.

This project represents TEL's continued investment in research and development to meet future needs.

The new system will combine technologies accumulated through TEL's world market-leading resist coater/developers, the CLEAN TRACK ACT series, with the most advanced technology acquired through TEL's research and development activities. TEL plans to release this next generation 300mm process coater/developer, which is currently under development, in January
2004.

With the experience and knowledge on 300mm wafer processes gained though the success of the CLEAN TRACK ACT 12, TEL's new system will not only provide the most advanced process capability and highest levels of productivity for 300mm, but also offer commercial advantages such as reduced lead-times and start-up periods and quicker service support in order to meet the customer's expectations. With this new system, TEL also plans to provide the most advanced solutions for fab automation and network implementation.
(August 8)

Shadow Moire Testing Forms Solid Foundation in Pacific Rim
ATLANTA
AkroMetrix and its exclusive agent for Japan, Cermatronics Boeki Co. Ltd., have received a growing list of confirming orders for the TherMoire(r) in-process warpage analysis system.

Recent orders include Shinko Electric Industries (Nagano), Denso Corp. (Aichi) and Sanyo Electric Co. (Gunma).

TherMoire system is for temperature-dependant warpage characterization of substrates, packages and assemblies. Additionally, Eastern Co. Ltd. (Chino) issued a confirming order for the LineMoire automated flatness inspection system. The LineMoire will be used to perform high-speed flatness analyses of laminate chip-carriers. Data acquisition speeds of 2 sec or less (for entire JEDEC tray) are achievable.

The TherMoire Model PS88 system successfully completed all CE marking initiatives. Initial units have been shipped/installed at Infineon Technologies (Regensburg) and Philips CFT (Eindhoven).

Other notable transactions include confirming North American orders for TherMoire PS88 systems from Research in Motion (Waterloo) and Micron Technologies (Boise).
(August 7)

Quantum Performance Group, LLC Retreat in October to Discuss China Strategy
SAN CLEMENTE, CALIF.
Lisa Zeng, deputy general manager and member of the Board of Directors of the Shanghai-based consultancy CBC, will join the Quantum Performance Group, LLC's (QPG) October 18 Executive Retreat Event at Aviara Four Seasons in Carlsbad, Calif. as a special added feature.

Zeng will discuss market and business entering strategies for firms wishing to do business in China. Her presentation will discuss the reasons for the "rush" to China, traditional routes, current fads, alternatives and best basic strategies.

Zeng, an graduate of the prestigious Tongji University with a degree in electrical engineering, has acted as general manager for several multinational corporations including a Swiss quality inspection firm and a major tooling systems manufacturer.

Attending senior executives from all segments of the electronic packaging industry will also participate in presentations on succeeding in difficult times, partnering and current activities in the EMS markets.
(August 6)

OMM, Lightwave Systems to Develop Wavelength Management and Switching Modules
SAN DIEGO
OMM Inc. and Lightwave Microsystems Corp. have formed an agreement to develop a new generation of wavelength management and switching products based on micro-electromechanical systems (MEMS) and planar lightwave circuits (PLCs).

Lightwave Microsystems is a leading global supplier of planar lightwave circuits and modules for optical communications systems. OMM is a leading global supplier of advanced MEMS-based all-optical switching products. Together both companies will develop a series of hybrid-integrated modules that incorporate the benefits of both wavelength selectable filter and MEMS technologies for use in scalable optical add-drop and optical switch building blocks.

Responding to customer demand for more integration, Lightwave Microsystems and OMM are planning to deliver first samples to customers this year. Initial products will be capable of dynamic reconfigurable switching that allows provisioning of individual wavelengths in optical networks as well as network protection services.
(August 5)

Henkel Loctite Adds Seminar on Lead-free Solder Technology
INDUSTRY, CALIF.
Henkel Loctite Corp. has announced the latest in its a series of technical seminars on "Understanding Lead Free Solder."

The next seminar will be held on August 29, 2002, at Siemens Dematic, located at 3140 Northwoods Parkway in Norcross, Ga., from 8 a.m. to 4 p.m. Admission for the session is free, but advance registration is required.

Sponsored by Henkel Loctite Corp. in partnership with Siemens and KIC, this seminar will offer electronics industry engineering management and staff (design, process, system, and manufacturing engineers) an opportunity to learn about lead-free solders simultaneously from a solder developer and equipment manufacturers. The program will impart a working knowledge of lead-free solders for both assembly and packaging-related processes. Along with the seminar, there will be a demo showing the process line, rework, and building boards. The main presenters for discussions on lead-free solder technology are Malcolm Warwick, Ph.D. of Henkel Loctite and Daniel Baldwin, Ph.D. of Siemens.
(August 2)

EEMS Italia Orders Disco 300-mm DBG In-line System
RIETI, ITALY
EEMS Italia Spa, Europe's leading provider of assembly and test semiconductor services, has placed an order with Disco Corp. for a 300-mm Dicing Before Grinding (DBG) In-line system.

This will be EEMS' second 300-mm DBG In-line System. EEMS installed a 300-mm DBG In-Line System one month ago
.
EEMS claims to be the first subcontractor using Disco DBG In-line System expressly targeting 300-mm wafers. The adoption of this technology represents a major shift from the conventional "grinding to dicing" sequence to a "dicing (half-cut) to grinding" process.
(August 1)

Matec Instrument Forms Matec Micro-Electronics Division (MME)
YARDLEY, PA.
Matec Instrument Co. Inc. has formed the new Matec Micro-Electronics Division (MME), which provides sales and contract testing services for all ultrasonic inspection applications requiring high frequency testing and customer support.

This includes semiconductor packages and parts requiring micron size defect detection. MME also offers application feasibility studies of customer samples. This will support the customer's decision process when purchasing a system or contracting MME testing services. MME offers ultrasonic theory and hands-on training by certified ultrasonic experts either on-site or at training facilities in Yardley.

Manny Butera, product line manager and Jim Stradling, director of sales will manage the Yardley office. They have more than 50 years of combined ultrasonic experience and are specialists in ultrasonic scanning acoustic microscopy with Ultrasonic Level III certification.
(July 31)

Auburn University Moves to Forefront of Wireless Technology
AUBURN, AL.
This fall, Auburn University's Samuel Ginn College of Engineering will launch the nation's first bachelor of wireless engineering degree program to provide students with the tools they need to join the wireless revolution.

The new degree program complements a larger initiative -- called the Information Technology Peak of Excellence -- centered in the Ginn College of Engineering. This effort is designed to capitalize and expand on existing strengths to move Auburn engineering into a leadership position across all segments of information technology -- from gathering, communicating, processing and analyzing information, to using it to make decisions and to take action. The emphasis will be on wireless communication.

"We are thrilled to announce this degree program," says Larry Benefield, dean of the Ginn College of Engineering. "To ensure that the program addresses the full spectrum of industry needs, we worked closely with wireless industry representatives. I feel that we've created a degree that will be exciting and challenging for the students, and produce graduates ready to meet the fast-evolving demands of the workplace."

The new degree program is an interdisciplinary effort that involves faculty and programs in two departments -- Electrical and Computer Engineering and Computer Science and Software Engineering -- and offers three areas of specialization: hardware, software and networks. It builds on existing broad-based programs in both departments to provide a solid foundation of electrical, computer and software engineering fundamentals, as well as an introduction to wireless communication theories, devices, circuits, systems, networks, standards, management and applications. Through course options, students will be able to select areas of wireless specialization and will be exposed to cutting-edge research.
(July 30)

Ultratech CEO Arthur W. Zafiropoulo Elected SEMI Chairman
SAN FRANCISCO
Ultratech Stepper Inc., a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, announces that its chairman and CEO, Arthur W. Zafiropoulo, has been elected by the membership of Semiconductor Equipment and Materials International (SEMI) as chairman of the industry association's board of directors for 2002.

A SEMI board member since 1995 who served as SEMI vice chairman for the past year, Zafiropoulo succeeds Disco Corp. Chairman and CEO Sekiya Kenichi in the role of SEMI chairman.

"Receiving this vote of confidence from the SEMI membership is a great honor," said Zafiropoulo. "I look forward to working with the member companies and the other SEMI officials and board members to help our industry continue to anticipate market and technology challenges, as well as seek creative solutions."
(July 29)

Die Products Consortium and August Technology Team to Demonstrate Post-Saw Test, Inspection and Sort Solution for Known Good Die Processing
AUSTIN, TEXAS
The Die Products Consortium (DPC) is teaming with August Technology to create a project evaluating new ways to implement inspection, test and die sorting capabilities; thereby increasing the quality and lowering the cost of die products in final manufacturing.

This project is part of the DPC's ongoing effort to increase the adoption rate of die products in the microelectronics industry by developing known good die test and inspection solutions.

Instead of performing wafer test immediately after IC fabrication and before post processing operations such as bumping, pad redistribution, sawing and visual inspection - the proposed process flow positions the wafer test and visual inspection after all die manufacturing operations including wafer sawing are complete. The fully tested and inspected die need only to be sorted and shipped to the customer for assembly.
(July 26)

HANA Microelectronics Group Appoints Bruce Stromstad as President of Hana Microelectronics-US
BANGKOK
SAN JOSE, CALIF.
Hana Microelectronics Group, a leading provider of innovative solutions in high technology assembly and test services, has appointed Bruce Stromstad as president of Hana Microelectronics Inc., based in San Jose, Calif.

In this role, Stromstad will concentrate on sales management and account development for the Semiconductor Division of Hana Microelectronics.

Stromstad has more than 30 years experience in semiconductor engineering, manufacturing and international operations. He has managed wafer fabrication, assembly and test operations in both the United States and Southeast Asia. His extensive international experience includes assignments in Hong Kong, Korea, Singapore, Thailand and Taiwan. Stromstad was vice president of offshore manufacturing for Cirrus Logic Inc., president of Alphatec US, and vice president of manufacturing planning for ChipPAC Inc. He has a BSEE from the University of Wisconsin.
(July 25)

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