Advanced Packaging - INDUSTRY NEWS TODAY

TEL Plans to Begin Deliveries of Next Generation 300mm Process Coater/Developer in January 2004
TOKYO
Tokyo Electron Ltd. is developing the next generation 300mm process coater/developer targeting the 300mm wafer market.

This project represents TEL's continued investment in research and development to meet future customer needs.

The new system will combine technologies accumulated through TEL's world market leading resist coater/developers, the CLEAN TRACK ACT(R) series, with the most advanced technology acquired through TEL's research and development activities. TEL plans to release this next generation 300mm process coater/developer, which is currently under development, in January 2004.

With the experience and knowledge on 300mm wafer processes gained though the success of the CLEAN TRACK ACT 12, TEL's new system will not only provide the most advanced process capability and highest levels of productivity for 300mm, but also offer commercial advantages such as reduced lead-times and start-up periods and quicker service support in order to meet the customer's expectations. With this new system, TEL also plans to provide the most advanced solutions for fab automation and network implementation.
(July 19)

ElectronicChina and SEMICON China to Cooperate in 2003
MUNICH, GERMANY
Messe Muenchen International (MMI) and Semiconductor Equipment and Materials International (SEMI) have agreed to cooperate for electronicChina and SEMICON China in 2003.

Both events will take place March 11 through 13, 2003, at the Shanghai New International Expo Center (SNIEC). With this cooperative arrangement, the combined expositions will be the future platform for the electronics industry concerning electronics components and production engineering. Companies can present their expertise to the Chinese market, and talk directly to decision-makers.

Additionally, there will be an extensive conference and seminar program, the SEMICON China Technical Symposium and the PCIM China Conference.
(July 18)

SUSS MicroTec Establishes SUSS MicroOptics SA for Continued Micro-Optics Development
MUNICH, GERMANY
SUSS MicroTec has formed SUSS MicroOptics SA in Neuchatel, Switzerland.

Effective July 1, 2002, the new company will take over all activities of the SUSS MicroTec subsidiary and those of the Neuchatel-based consulting company Weible OpTech. SUSS MicroTec holds the majority of SUSS MicroOptics SA.

Reinhard Volkel will serve as CEO of SUSS MicroOptics. Martin Eisner is in charge of technology and Ken Weible is in charge of operations. Volkel has more than 15 years of experience in diffractive and refractive micro-optics, optical design and optical communication technology.

Volkel worked at the University of Erlangen-Nurnberg and the Institute of Microtechnology (IMT) in Neuchatel before he joined the SUSS MicroTec in 1998, where he was in charge of the subsidiary in Neuchatel.
(July 17)

Lumenon Pursues Fully Automated Manufacturing
MONTREAL
Lumenon Innovative Lightwave Technology Inc., a photonic materials science and process technology company offering high-quality optical devices for the global telecommunications, data communications and cable markets, and ATS Automation Tooling Systems Inc., an industry leading designer and producer of turnkey automated manufacturing and test systems, have initiated beta testing of the ATS Flexsys 2000 automated Planar Lightwave Circuit Tester (PLCT).

Engineered and built by ATS, the Flexsys 2000(TM) PLCT system is the result of a strong collaboration between the two companies. "The system combines Lumenon's ongoing commitment to provide fully automated manufacturing with ATS's strategic thrust to offer a comprehensive toolkit of standard automation products to deliver a high precision process and assembly system for advanced optical packaging," said Philippe Beaumier, Lumenon's Director of Manufacturing
Operations.

The Flexsys(TM) 2000 PLCT was showcased by ATS at the recent
Optical Fiber Communication Conference in Anaheim, Calif. in conjunction with ATS's launch of its proprietary family of standard flexible automation work cells for high precision manufacturing, trade named Flexsys.
(July 16)

Xsil Wins European Semiconductor Wacker/Siltronic Prize for Best New Company
DUBLIN
Xsil Ltd., a provider of innovative laser micromachining systems for high volume manufacturing, was awarded with this year's annual European Semiconductor Wacker/Siltronic prize for Best New Company.

Received at the JEMI Semiconductor 2002 conference in
Edinburgh, Xsil was selected from a wide variety of European companies and is the first Irish company to receive such an award.

Determined by a variety of parameters, the award is won by companies in business for fewer than five years who have distinguished themselves in the semiconductor industry. Xsil won this prize based on its scale, rapid growth to 120 people, advanced technologies, global presence, focus on R&D, and a variety of other qualifications. European Semiconductor is a premier publication and website dedicated exclusively to the semiconductor industry within Europe.
(July 15)

SECAP Hosts Wafer-Level Packaging Seminar 2002 at SEMICON West
MUNICH, GERMANY
The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) is holding a seminar at SEMICON West on Tuesday, July 23, aimed at providing the industry with a comprehensive overview on wafer-level packaging with a special focus on practical aspects of process technology.

Today, wafer-level packaging and wafer bumping are among the most dynamic areas in the evolution of semiconductor technology. Wafer-level packaging, however, entails a fundamental shift in the concept of chip packaging. Therefore, successful adoption of wafer-level packaging by the industry will require everyone involved to understand the new interdependencies between package design, process technology, manufacturing and test.

R&D and manufacturing managers, process engineers as well as packaging designers should attend the seminar to learn about new developments and trends in the industry.
Speakers from the following companies and organizations are confirmed:

APiA to Supply ACE Semiconductor with 200mm Advanced Packaging Process Line in China
SAN JOSE, CALIF.
The Advanced Packaging and Interconnect Alliance (APiA), a global group of leading semiconductor equipment and process technology suppliers, has announced an agreement to work with ACE Semiconductor to provide a 200 mm advanced packaging process line in Shanghai, China.

The process line will provide ACE with advanced packaging equipment technology to further enhance its position in the wafer level chip scale packaging marketplace and position it as a leader in the high-potential Chinese market.

The APiA expects to benefit by using the ACE facility and a share of the line capacity as a development and demonstration center to support its initiative to provide advanced packaging solutions to China. The process line is scheduled for installation in the ACE Shanghai facility in Q4 2002.
(July 11)

NEXX Systems Joins SECAP
MUNICH, GERMANY
NEXX Systems, a spin-off of ASTeX established in August 2001, and a leading supplier of PVD systems to the advanced packaging industry, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).

With NEXX Systems, under bump metallurgy (UBM) and backside metallization are added to the consortium's equipment portfolio.

"NEXX Systems' Nimbus is a unique tool, first designed specifically for UBM, backside metallization and high density substrates for the advanced packaging market," commented Richard Post, Ph.D., CEO of NEXX Systems. "The Nimbus is a mature sputter deposition system, with proven capability and a strong customer base offering the lowest cost of ownership platform, smallest footprint and elegant simplicity. The product line includes three models capable of handling wafers for 100 mm to 300 mm to meet the requirements of integrated device manufacturers (IDMs) and foundries."
(July 10)

NGK Insulators Announces New U.S. Company
SUNNYVALE, CALIF.
NGK Insulators Ltd. (Japan) has formed their new U.S. company, NGK Electronics USA Inc.

Established in April 2002, the new corporate headquarters is in Sunnyvale, Calif. As part of the NGK family of companies, NGK Electronics USA will function as the marketing and sales arm of its sister companies NGK Locke, Electronics Division (raw materials and ceramic substrates), FM Industries (FMI) (modules manufacturing for semiconductor equipment), and Optobahn Corp. (optical parallel interconnects and fiber arrays).

NGK Electronics USA will provide additional sales resources to expand the North American market for NGK Insulators, Ltd. in fiber optic arrays and ceramic modules and components, offering heightened customer service and responsiveness to customer needs.
(July 9)

SUSS MicroTec Extends Collaboration With Max Planck Institute Halle on SOI Bonding
MUNICH, GERMANY
SUSS MicroTec has expanded its collaboration with the Max Planck Institute (MPI) of Microstructure Physics in Halle, Germany, with delivery of its CL200 fusion bonder to MPI's wafer bonding research facility, Experimental Department II.
The research facility will use the CL200 for testing silicon on insulator (SOI) and fusion bond applications.

Silicon fusion bonding is a fast, front-end-compatible bond process for creating a permanent connection between two or more wafers, and addresses the growing demands placed by manufacturers utilizing SOI substrates. SOI has emerged as a promising semiconductor material for leading-edge devices, such as low power and high-speed LSIs, smart sensors and smart power devices.

"The CL200 allows SOI fabrication from two bonded substrates, and combines the microcleanroom concept pioneered in our research group and a new megasonic cleaning concept in an ideal way which clearly extends the capabilities of previously available equipment," commented Professor Ulrich M. Goesele, Ph.D., director at the MPI Halle. "The CL200 is the fifth SUSS tool the institute has acquired. It already uses a SUSS spin coater, mask aligner, wafer cleaner and a substrate thermal compression bonder."
(July 8)

Santur Secures $23 Million in Second Round of FinancingFrom Leading Venture Capital Firms and Strategic Investors
FREMONT, Calif.
Santur Corp., a privately held vertically integrated optical components company, has completed its second round of venture financing, which netted $23 million.

Thomas Weisel Venture Partners led the round, with all previous venture capital investors, including Sequoia Capital and Menlo Ventures, as well as strategic investors, contributing.

Santur will use the second-round capital to complete Telcordia qualification of its initial product -- the TL1010-C tunable laser -- as well as to accelerate product delivery and development of its tunable laser solutions.

Founded in November 2000, Santur has introduced a radically different, next-generation tunable transmission laser that lacks the complexity and high cost of competing tunable laser products. Santur's TL-1000 line of tunable lasers provide DFB-like performance delivering high power and excellent reliability, all at a cost comparable to present fixed wavelength DFBs. Santur's products will help service providers deliver high-bandwidth services with greater network flexibility and reduce total network operating costs.

"Carriers as well as equipment vendors are very interested in tunable components that enable lower costs and higher flexibility for optical networks," said Andy Sessions, partner, Thomas Weisel Venture Partners. "Santur has a highly differentiated solution that is cost-effective and easily manufacturable, while at the same time offering best-in-class performance."
(July 5)

STI Reaches Milestone with Latest Shipment of Wafer Inspection System
PLANO, TEXAS
Semiconductor Technologies and Instruments (STI) celebrates the milestone of shipping serial number 50 of their WAV product line.

Originally launched three years ago, the WAV 1000 wafer inspection system has been globally accepted as the definitive test floor's solution for probe mark and micro defect detection. A mature handling platform has made STI the vendor of choice for 300mm application, solidifying their importance in Asian foundries and European IDMs.

Recognized for years of innovation in final package inspection, STI has introduced its core competency upstream to the wafer fab.

Says Rajiv Roy, president of STI Inc, USA, "Our close relationships with semiconductor manufacturers gave us the conceptual insights required to create the optimal test floor solution. The superior price-to-performance of the WAV 1000, coupled with the committed support and advanced technologies have gained us the dominant market position for test floor applications." (July 3)

NanoVia Develops Hyper Speed Microvia Drilling Process For Next Generation 3G High Density Smart Chip Packaging
LONDONDERRY, N.H.
NanoVia, LP has developed HyperVia holographic microvia drilling technology for drilling current and next generation high-density 3G smart chip carrier packages.

The HyperVia microvia drilling technology can produce microvias on randomly pitched grid arrays at process rates exceeding 100 percent faster than current laser systems on the market; this throughput rate is anticipated to triple within the next 10 months, once a new laser technology arrives from one of its strategic laser vendors.

The new HyperVia technology is the second iteration of an optical system licensed to Hitachi Via Mechanics, Japan in a four-year exclusive license. NanoVia has already delivered several optical sub-systems to Hitachi and will begin to ship modules as the technology enters the U.S. and Asian markets.

"The growth forecast of the 3G (Third Generation) communications marketplace is substantial and will require chip scale packages with microvia densities unparallel to existing designs," explains Todd Lizotte, VP of R&D at NanoVia, LP. "Our goal is to regain lost ground on the U.S. high density technology roadmap and to deliver solid process hardware to meet the continuing demands of leading U.S. IC chip manufacturers." (July 2)

Integration of Electronic Capabilities Drives Growth in Pneumatic Component Markets, Says Frost & Sullivan
SAN JOSE, CALIF.
As manufacturers of pneumatic filters, regulators and lubricators (FRLs) increasingly integrate electronic components into their products, markets for these pneumatic devices are expected to see a steady rise in end user demand.

The inclusion of electronics with pneumatic components will deliver greater controllability and information feedback to end users while slowing the advance of electric machines into the pneumatic FRL markets.

New analysis from Frost & Sullivan (www.fluidpower.frost.com), North American Pneumatic FRL Markets, reveals that this industry generated revenues totaling $222.6 million in 2001. Total revenues could reach $299 million in 2008.

New technological advances should encourage demand. It is also expected that intense competition among manufacturers will result in decreasing average prices, consequently restraining revenue potentials of the FRL market.

"Decreasing prices due to intense competition is expected to continue throughout the forecast period as market participants continue to use pricing strategies to differentiate their products from those of their competitors," says Frost & Sullivan Industry Analyst George Turnage. "As a result, FRL sectors are becoming commodity markets." (July 1)

SEZ America Hires New Sales Director
PHOENIX
The SEZ Group's U.S. sales growth expectations for 2002 will be spearheaded by new director of sales for SEZ America, David Fitzgerald.

Fitzgerald comes from several top semiconductor equipment companies, including ASML and Ultratech Stepper, where his unique sales strategy and expertise landed these companies many new accounts as well as replacement sales during his tenure.

Fitzgerald has a successful track record of penetrating new accounts, which have resulted in $20 million in add-on sales, not to mention an increase in consumables sales in his territory by 300 percent in three years. He has managed such large accounts as Motorola, Texas Instruments and ST Microelectronics.

Following the record 133 percent rise in sales for the year 2000, the SEZ Group managed to achieve an increase in sales and positive business results in financial year (FY) 2001. The North American region increased sales by 32.2 percent, which represents a 19.4 percent of total sales versus 18.8 percent in FY 2000. In total, the SEZ Group gained six new customers in FY 2001, four of which are from the U.S. (June 28)

D2M Invests in Advanced Digital Optics
MOUNTAIN VIEW, CALIF.
D2M, Inc. a leading engineering design firm based in Silicon Valley has invested in Advanced Digital Optics (ADO).

The investment will fund ADO's expansion into the business of creating proprietary digital light engines and light projection systems for next-generation HDTV and high-resolution monitor markets. ADO is a former subsidiary of the ViewSonic Corp.

As a result of the investment, D2M president Bill Burnett will become a member of ADO's board of directors. Also participating in the spin-off of
ADO from ViewSonic are JDS Uniphase, OCLI and ViewSonic. Financial details of the investment were not disclosed.

As the era of the CRT rapidly wanes, a variety of display technologies are vying for market leadership in the desktop display, digital cinema, video projector, tablet and handheld sectors. ADO is fluent in the most promising of these emerging display technologies, including LCoS, DLP and poly-silicon, and has expertise in materials science, light engine design, and projection optics.
(June 27)

Victoria Hadfield Appointed President of SEMI North America
SAN JOSE, CALIF.
Semiconductor Equipment and Materials International (SEMI) has appointed Victoria (Vicki) Hadfield to the position of president, SEMI North America and will oversee all North American operations of the global industry association.

Hadfield, who served most recently as senior vice president of Industry
Advocacy for SEMI, has held various management positions since joining the organization in 1987.

"I'm pleased to appoint Vicki Hadfield to this important position. As one of five regional presidents, she will provide dynamic leadership for the
North American region of our global association and will focus SEMI North
America activities on our members changing needs," said Stanley T. Myers, president and CEO of SEMI.

Hadfield succeeds Bobby Greenberg, who served as president of SEMI North America for the past year. Greenberg, who has resigned from SEMI to pursue
other interests, will continue to serve SEMI in a consulting capacity.

SEMI also announced that its Washington D.C. office will be the officially designated headquarters location of the SEMI North America office in order to be in closer proximity to the public policy activity affecting SEMI North America members. SEMI continues to maintain related North American operations in Austin, Texas; Boston, Mass.; and San Jose, Calif.

Phicom Appoints Representative for Northern California
SEOUL, KOREA
Phicom Corp. has appointed Million & Associates to represent Phicom's line of probe cards and probe stations in Northern California and the Pacific Northwest.

Phicom supplies epoxy-type probe cards with up to 2,848 pins that have the ability to probe 64 chips in parallel with pitches as low as 60 microns for memory devices and 35 microns for non-memory devices such as ASICs. Phicom is also releasing a new line of advanced technology vertical probe cards for wafers that employ smaller pad size and pitches as well as higher signal speeds and pin counts. (June 25)

Datacon Ranked No. 1 Assembly Equipment Supplier
RADFELD, AUSTRIA
Datacon Technology AG, leading manufacturer of high-precision systems for semiconductor production, has received the No. 1 position in the prestigious annual VLSI Research "10 BEST Award" in the Assembly Equipment category, which is based on a global survey of semiconductor manufacturers.

Datacon's highest-rated categories were product performance and quality of results.

"Datacon has ranked among the 10 BEST since 1998," says Helmut Rutterschmidt, President and Director of the Board at Datacon. "Most of the feedback we received this year came from European customers. The top position is therefore in large part thanks to our continuing efforts and commitment towards our European customers with whom we achieved a close relationship in recent years. We have always considered customer feedback, customer satisfaction and commitment a top priority and will continue to do so in the future." (June 24)

ApiA Adds New Members
MINNEAPOLIS
The Advanced Packaging and Interconnect Alliance (APiA) has added seven new members to its organization. The companies represent equipment, materials and process technology organizations.

Joining the organization are: Albany Nanotech at University of Albany (material and process integration at 300 mm wafer R&D fab); Dynaloy (specialty chemicals for the removal of photoresist films and solder flux); EKC Technology Inc. (high performance chemicals for photoresist removal and surface preparation); Excelerate Technologies (data connectivity and analysis software); HD Microsystems (polymer coatings); Heller Industries (reflow ovens); and Sikama International (conduction/convection reflow ovens and wafer flux coaters).

"The APiA was established through successful collaboration and partnerships that will generate better and more timely solutions for the industry," said Ellery Buchanan, APiA chairman and senior vice president of marketing and corporate development for Ultratech Stepper. "Our new members will immediately be integrated into the APiA, bringing their specific expertise and resources to bear on IC packaging's most critical challenges. The diversity of our membership allows the APiA to provide the industry with risk-free advanced packaging solutions and to be the leading authority on advanced packaging and interconnect technology."

The APiA's charter is to accelerate the development and implementation of commercially viable advanced packaging solutions that address the escalating intricacies of leading edge chips. (June 20)

Add RSS Feed