Advanced Packaging - NEW PRODUCT HIGHLIGHTS

On-Wafer Solution from Cascade Microtech
BEAVERTON, ORE.
Turnkey on-wafer solution from Cascade Microtech Inc. includes dual high-performance characterization probes, a differential ISS (calibration standards), an Agilent ENA Series RF network analyzer, and the company's 200mm and 300mm probing systems. This approach enables design engineers to measure the performance of devices and circuits under each of their desired modes of operation, thereby reducing modeling and design cycle times.
(July 17)

X-ray System Upgrade from FeinFocus
STAMFORD, CONN.
Upgrade to the FXS-160.40 (T.I.G.E.R.) system from FeinFocus USA Inc. is for significantly increased resolution and magnification, as well as improved ease of use and image processing. Originally designed for the rigorous demands of the PCB assembly industry, the FXS-160.40 is the optimal X-ray machine for inspection of component devices such as ball grid arrays (BGAs), solder interconnects, hybrid components and other encapsulated electromechanical components. The system improvements include the company's exclusive auto isocentric motion (AIM) technology, upgraded FIP-600NT version 1.7 software, and X-ray tube enhancements.
(July 17)

Phoenix Contact Mini Spring Cage Blocks

HARRISBURG, PA.
Line of ST mini spring cage terminal blocks from Phoenix Contact Inc. includes knife disconnects, multi-level terminal blocks, a pluggable system, and a 5 x 20 mm fuse block. Knife disconnects come in two-, three- and four-wire terminals, and multi-level terminals are available in three- and four-level versions. The 5 x 20 mm fuse terminal block matches the profile of the company's 6.2 mm feed-through block, and uses the same dual bridge system. The 20 A and 300 V ST-Combi plug system makes the rated line current of a 2.5 mm² wire pluggable in a component just 5 mm wide.
(July 16)

White Electronic Multi-chip Package
PHOENIX
The WEDPS512K32-XBX and the WEDPS512K32V-XBX 4 Mbyte SRAMs from White Electronic Designs Corp. are 5 V and 3.3 V core voltage versions, respectively, of 512 K x 32-bit SRAM, which are designed to save 74 percent board space as compared to an equivalent design using SOJ components. Each integrates four 512K x 8 SRAMs into a single 16 x 18 mm, 143 PBGA package. Both products are available in speed ranges from 12 ns to 20 ns, targeting them for use in high-end, high-reliability embedded applications that require a 32-bit wide solution.
(July 16)

PVA Syringe Dispenser
HALFMOON, N.Y.
Syringe dispensing capabilities from PVA are for handheld applications in the industrial, electronic, medical products and fiber optic industries. The company offers both digital and analog benchtop controllers for these handheld processes. Each system has a built-in regulator, gauge, foot pedal and timer. Manual or timed shot modes can be processed at the operator's discretion to satisfy any specific application. The syringe dispensers are targeted for any material packaged in syringes such as solder paste, UV adhesives and masking material. (July 15)

Metcal Rework Tips
MENLO PARK, CALIF.
Micro fine rework tips from Metcal Inc. are designed to make it easier for operators to rework miniature components such as 0402s and 0201s on compact, high-density boards. The range includes the STTC-X90, which is specifically designed for the soldering and touch-up of micro components down to 0201s. The SMTC-X171 is a micro tip that works from a topside angle for improved microscopic viewing, while the SMTC-X172 is designed for fine drag and point-to-point soldering. The SMTC-X174 is a long-reach micro hoof with a small surface area, and the SMTC-X175 is a micro hoof top with a small surface area.
(July 15)

Micromanipulator RF/Microwave Manipulator
CARSON CITY, NEV.
WAVE100 and WAVE200 RF/microwave manipulators from Micromanipulator Co. feature direct leadnut coupled drives and magnetic assisted vacuum bases. The stability of a vacuum base, combined with the security of a magnetic base, provides added protection against manipulators tipping and causing damage to RF/microwave probe tops. The rugged rectilinear manipulators have a lead screw pitch of 40 threads per inch (tpi). The secure massive mounts provide stability, even with semi-rigid coaxial cables attached to the probes. The rigid probe head link arms are available in two styles to permit simultaneous use of four probes. Theta and planarity adjustments of the probes are standard. (July 12)

phoenix|x-ray X-ray System Option
CAMARILLO, CALIF.
The low-dose|mode option for analyzer and inspector series X-ray systems from phoenix|x-ray Systems + Services Inc. is specifically designed for inspection of high-reliability components and boards. Applications include use in satellites, aerospace, military, medical and fail-safe industrial processes. The new option upgrades the X-ray inspection system to have the ability to block the unnecessary radiation exposure during movement and manipulation of parts and boards under test. It further eliminates the powering down and resetting of the X-ray source that systems without this option are required to do to meet the lower radiation requirements. (July 12)

Toshiba Surface Mount Package
IRVINE, CALIF.
VS-8 8-pin surface mount package from Toshiba America Electronic Components Inc. is for use as a power MOSFET. The package is ideal for power management switching and DC-to-DC conversion in portable computers, portable phones, PDAs and other emerging applications where space is at a premium. The VS-8 package has a 30 percent smaller footprint than its existing 6-pin VS-6 package, reducing mounting area and saving valuable board space. The package's thickness is 0.85 mm, compared to similar packages currently available with a 1.1 mm thickness.
(July 11)

Morgan Diamond Source
WORCESTERSHIRE, UK
Diamonex Closed-drift (CD) Source from Morgan Advanced Ceramics (MAC) is a flexible source targeted for use in a wide range of manufacturing processes that benefit from high flux ions, including substrate cleaning, reactive ion beam etching and ion beam-assisted deposition of thin films. It also is a useful tool for high-rate, reliable deposition of DLC coatings. The gridless design of the Diamonex CD Source allows a high ion flux, and the substrate will not be contaminated by particles released by the grid. The CD Source includes an integrated, on axis hollow cathode electron source (HCES), eliminating filaments that burn out or contaminate substrates.
(July 11)

Ultra-Bright LEDs from Vishay
MALVERN, PA.
TLC Series bright LCDs from Vishay Intertechnology Inc. are offered in red, blue, yellow and true green versions. The LCDs offer luminous intensity as high as 20,000 mcd, making them an energy-saving alternative to incandescent lamps for central high-mounted stop lights in automobiles, and for outdoor applications including panels, displays, lighting, traffic signals and traffic signs. Built on ultra-bright AllnGaP (for red and yellow) and InGaN (for blue and true green) technologies, the TLC devices offer a choice of 8 degrees (TLC.58xx) or 18 degrees (TLC.51xx) emission angles. (July 10)

CIP Production Units from Engineered Pressure Systems
HAVERHILL, MASS.
Cold Isostatic Press Production Unit (CIP) from Engineered Pressure Systems Inc. is for use in the ceramic, carbon, plastics and powder metals industries, and can be customized to suit application-specific needs. The CIP is capable of operating at pressures up to 100,000 psi (approximately 700 MPa), with control of pressurization and decompression, which result in products of uniform density, reducing internal stresses, cracks, strains and laminations. The CIP is available in a variety of sizes, from pilot to large production units, and features top closure and load handling systems designed to meet the customer's production requirements. (July 10)

Leak/Flow Standards from Cincinnati Test Systems
VILLAGE OF CLEVES, OHIO
Series 520 calibrated leak/flow standards from Cincinnati Test Systems Inc. is available in five mounting assemblies: I-Inline Assembly, G-General Assembly, 21-Straight Thread Assembly (for Sentinel B-21 and I-21 instruments), C20-CPC Assembly (for Sentinel C-20-S instruments), and C20F/C-Miniature Assembly (for Sentinel C-20-F/C instruments). Individually sized and manufactured to ISO 17025 within 0.5 to 50,000 sccm range and within -14.7 to more than 500 psig range, each calibrated orifice is certified as an air leak or flow standard in the company's A2LA accredited laboratory and sealed in a specified mounting assembly.
(July 9)

Fluorescent Lighting Control IC from International Rectifier
EL SEGUNDO, CALIF.
IR2166 ballast control IC with integral power factor correction (PFC) for linear fluorescent lighting ballasts from International Rectifier is a one-chip solution that replaces a separate ballast control IC, gate driver IC, PFC IC and additional discrete circuitry to cut the ballast cost by up to 30 percent. The new ballast chip features a patent-pending critical-conduction-mode boost PFC control method that maximizes PFC performance by dynamically adapting to the mode of the ballast control. This method produces a total harmonic distortion (THD) less than 10 percent, and has a power factor greater than 0.99 at 120 V line voltage, exceeding most European and other countries' regulations, as well as the performance of stand-alone PFC ICs.
(July 9)

DWDM Module Manufacturing from Natel
CHATSWORTH, CALIF.
Advanced production capabilities for high bandwidth DWDM modules are available from Natel Engineering Co. These modules allow for the simultaneous transmission of a number of non-interfering optical signals over a single fiber. For designers seeking production of these modules, Natel provides the precision process control needed to ensure the integrity of the end product. With automated assembly, Natel provides high-speed production for high-volume needs, resulting in rapid time-to-market as well as time-to-volume. (July 8)

Amacoil/Uhing Linear Drive Assembly
ASTON, PA.
Linear drive assembly from Amacoil/Uhing provides mechanical control over linear speed and travel direction. Used in a variety of converting applications including slitting, rewinding, scanning, packaging operations, coating and spraying, the assembly provides automatic, instantaneous reversal without complex electronic controls or programming. The drive head travel speed and direction are mechanically controlled independently of the motor, without clutches, cams or gears. (July 8)

Proximity Sensors from Balluff
FLORENCE, KY.
HyperPROX 4X sensors from Balluff Inc. incorporate patented cutting-edge technology to overcome the challenges of maintaining consistent sensing over varying temperatures. Balluff uses an on-board temperature compensation IC that eliminates the impact of temperature on sensing distance. The extra range of the HyperPROX 4X allows the sensors to be mounted farther away from the target, increasing permissible machine tolerances and minimizing the risk of mechanical damage. In addition, the 4X sensing range allows machine manufacturers to use smaller sensors and save space on the machine, or to locate the sensors in previously inaccessible areas. (July 5)

Panelview LCD Displays
BEAVERTON, ORE.
ENH104XP-450 and ENH104XP-800 enhanced thin film transistor (TFT) LCD displays from Panelview Inc. are designed with high resolution, high performance and high contrast, and are suited for outdoors in any high-bright environment. Some markets include ruggedized handheld tablet PCs, marine navigation and GPS systems. The ENH104XP-450 offers 450 nits with 8 W power draw, and the ENH104XP-800 offers 800 nits with 14 W power draw. The key to the ENH104XP displays is the use of Index Matching (IM) laminations, which absorb high ambient light.
(July 5)

Tra-Con Conductive Adhesive
BEDFORD, MASS.
Tra-Duct 921U02 one-part electrically conductive adhesive from Tra-Con Inc. features a shore D hardness of 90. The silver-filled epoxy's one-part construction helps to speed up production time by eliminating the need for mixing.
(July 3)

Cincinnati Automation Literature
Literature from Cincinnati Automation Ltd. describes the company's machine vision and robot guidance system. The EZVision I4C system uses industry-leading vision hardware and software, along with EZVision operator interface in a Windows 2000 environment. As with Cincinnati's other products, the complete system includes user-friendly software, data file storage, industrial-grade PC, vision processing software and PCB, I/O board, light, and camera. The company sets up the first inspection routine for the customer.
(July 3)

Spot/Wand Light from Dymax
TORRINGTON, CONN.
BlueWave 200 W UV spot/wand light from Dymax Corp. provides uniform illumination for curing adhesives and coatings from 0.75 x 0.75 sq. in up to 5 x 5 sq. in. Uniform curing of adhesives in highly sensitive optical applications eliminates or minimizes movement of critically aligned parts and imperfections in optical coatings due to uneven intensity. With initial intensity output of 20 W/sq. cm of UVA, 15 W/sq. cm visible and 4.5 W/sq. cm UVB, the BlueWave 200 has sufficient intensity to cure adhesives and coatings through rod lens assemblies.
(July 2)

Saint-Gobain Silicone Rubber Catalog
WAYNE, N.J.
COHRlastic silicone rubber catalog from Saint-Gobain Performance Plastics features details and specifications on silicone products that include solid rubber, reinforced solid rubber, sponge rubber, Strip-N-Stick tape, F-12 foam, coated fabrics, and thermally and electrically conductive products. COHRlastic is a Saint-Gobain trade name for high-performance silicone products. Flexible, resilient silicone rubber has a unique chemical structure, which gives it high temperature stability and general inertness. (July 2)

FeinFocus X-ray Inspection System
STAMFORD, CONN.
The FOX-160.25 nanofocus X-ray inspection system from FeinFocus Inc. features a tri-mode Mini/Micro/Nano-Focus X-ray tube, allowing the user to choose any of the three operating ranges with the touch of a button. Capabilities include geometric magnification of 2,400X (total magnification of up to 7,200X), a focal spot size of less than 1 micron, and feature recognition of 500nm, as well as high-precision manipulation through joystick controls of five axes. Complementing the technological advances in this system are a modular cabinet design and ergonomic console featuring the FIP-600NT Image Processing System. (July 1)

DC-DC Switcher IC from Power Integrations
DPA-Switch DC-DC switcher IC from Power Integrations Inc. is the first highly integrated high-voltage power conversion IC designed specifically for use in DC-DC converters and distributed power architectures (DPAs). The chip eliminates up to 50 external components for the design of a typical discrete DC-DC converter, resulting in a shorter design cycle, smaller board size, lower system cost, and higher reliability. (July 1)

MSC Constrained Layer Composite
ELK GROVE VILLAGE, ILL.
NRG Damp from MSC Engineered Materials and Solutions Group is a sound-damping and vibration-reducing composite material that is made up of two or more metallic substrates surrounding an engineered viscoelastic core. The material is designed to quiet and reduce vibration in racks, chassis, enclosures and other components. The unique material functions my micro shear deformation of the viscoelastic core, which dissipates vibrational energy and also accepts welding, secondary finishing and various fastening methods. (June 28)

Pulse RF Balun Transformers
SAN DIEGO, CALIF.
Model CX2024, CX2078 and CX2081 of RF balun transformers from Pulse, provide a low insertion loss, a wide bandwidth, and a good return loss with industry standard footprints. The transformers match a balanced to an unbalanced circuit and various impedance ratios are available. With their small footprint, the new series is suitable for a wide range of applications including CATV distribution equipment, set-top boxes, cellular base stations and residential gateways. (June 28)

Silicon Wafer from International Wafer
PORTOLA VALLEY, CALIF.
International Wafer Service Inc. introduced a thin 30 µm, double-sided polished silicon wafer. These single crystal silicon wafers enable innovative electronic system designs in sensor manufacturing, smart cards, MEMS, micromachining, MST and SOI manufacturing. The wafers can be manufactured in diameters from 100 mm through 22 mm, by using various silicon types, as well as be supplied on a UV release membrane. (June 27)

Fishman Pneumatic Dispenser
HOPKINTON, MASS.
The Fishman Mini-8 Pneumatic Dispenser from Fishman Corp. is a foot pedal-controlled, tabletop pneumatic dispenser for manually dispensing long beads, potting, and other large applications. The 7.5 x 5.5 x 2.72" dispenser features dial-adjustable air pressure controls to the syringe, a locking press regulator, and adjustable vacuum controls. Additionally, the tabletop unit weighs 2.6 lb and requires 90/120/220 VAC input voltage with 90-psi shop air. (June 27)

inTEST Test Manipulator
CHERRY HILL, N.J.
in2Pro Talon Universal Positioning System from inTEST Corp. is a manipulator designed specifically to use with the Eagle ETS-600 Tester, manufactured by Eagle Test Systems Inc. The manipulator provides faster, easier test set up times to optimize the speed of IC testing in the semiconductor manufacturing industry. The manipulator is available in both manual and motorized versions. In manual mode, each axis of motion requires no more than 10 Kg of force to move through its entire range of travel. The motorized version includes a convenient remote pendant for controlling manipulator movements. (June 26)

Epoxy Adhesive from Master Bond
HACKENSACK, N.J.
Supreme 3HT-80 from Master Bond Inc. is a one-component, heat-curing epoxy adhesive that exhibits both high-shear and high-peel strength. The adhesive offers resistance to impact, thermal shock, vibration and stress fatigue cracking. The no mix compound has an unlimited working life and cures within 30 minutes at 175 degrees F. Additionally, the epoxy has a service operating temperature range of -100 degrees to 350 degrees F. (June 26)

Melcor Thermoelectrics
TRENTON, N.J.
The High Power Density cooling series from Melcor Corp. includes new thermoelectric coolers, as well as and expanded packaging and testing capabilities. The line of thermoelectrics includes a new class of thermoelectrics built to perform cooling previously only possible with much larger or multiple thermoelectrics. The series includes thermoelectrics constructed with strong porch style lead attachment, high heat-pumping capacity and solid-state reliability. Available in both standard and high-temperature construction, the series offers heat-pumping densities up to 11.5 W/cm square of cooling, which is double the heat pumping of standard thermoelectrics.
(June 25)

TT electronics 24-page Catalog
CORPUS CHRISTI, TEXAS
TT electronics's IRC Advanced Film Division introduced its Wire Bondable Silicon Dice Catalog. The catalog provides design engineers with a premier selection of bare dice to facilitate chip and wire assembly for individual packaging such as hybrid circuitry. The 24-page catalog showcases the company's latest silicon die resistive products, including several previously only available in packaged form. The catalog includes listings for the following products: three- and four-pad voltage dividers; isolated resistor array, bussed resistor array, high-frequency line terminator; AC line terminator; T-filter network; and IEEE 1284 parallel port.
(June 25)

Anti-reflective Coatings from Honeywell Electronic Materials
SUNNYVALE, CALIF.
DUO Bottom Anti-reflective Coatings from Honeywell Electronic Materials are designed for use in semiconductor manufacturing to improve and extend photolithographic processes. The coatings, with formulations available for both 248 nm and 193 nm photolithography, absorb light passing through the photoresist layer. Absorption is required to remove scattered light reflecting back up into the photoresist, improving the photolithographic process by eliminating standing wave, jagged edges or reflective notching.
(June 24)

PVA Dispensing Valve
HALFMOON, N.Y.
The FC300 dispensing valve from PVA is designed for high-volume fluid applications. The system is a stainless steel front closing valve compatible with virtually any chemistry. Viscosity ranges between 1 cps and paste can be processed with this valve resulting in maximum fluid pressures of 600 psi. An adjustable flow control allows the operator to dial in specific flow rates, and the divorced valve design prevents contamination of the air body by separating the aluminum air section from the stainless wetted material body.
(June 24)

Tecate Ceramic Capacitors
POWAY, CALIF.
Type CMT multilayer ceramic chip capacitors from Tecate Industries Inc. are ideal replacements for larger, leaded film capacitors in a broad array of communications systems and networks. Type CMT is comprised of capacitors in seven EIA sizes ranging from 0805 to 2225. They offer low ESR, good high-frequency filtering and improved temperature performance over film capacitors. (June 21)

Infrared Camera from Indigo Systems
SANTA BARBARA, CALIF.
The Omega thermal imaging camera from Indigo Systems is a small, light infrared camera that weighs 3.5 ounces and is less than 4 cubic inches in size. The camera provides powerful features and high performance in a package small enough to fit into applications with extreme size, weight or power limitations. The camera also features SmartScene video output, which maximizes picture quality, frame-by-frame, by automatically adjusting the conversion algorithm. (June 21)

Aremco Epoxy System
VALLEY COTTAGE, N.Y.
Aremco-Bond 526N from Aremco Products Inc. is a new high-temperature epoxy system used to bond ceramic feed-thru and nozzles used in electrical and electronic high-vacuum applications to 570 degrees. Exceptional mechanical properties include a flexural and tensile strength of 16,000 and 2,800 psi, respectively. The system mixes easily in a 1:1 ratio, providing a mixed viscosity of 4,000 cps and pot life of 2.5 hours. (June 20)

Software Upgrade from GraphiCode
MOUNTLAKE TERRACE, WASH.
GC-PowerPlace v.2.1.2 from GraphiCode is a significant upgrade to GC-Place. GC-PowerPlace delivers integrated features, such as the ability to automatically find the centroids of parts, including BGAs and off-angle components. Users can create template apertures based on a part's extents, and an improved user interface includes customizable toolbars. (June 20)

Assembléon Component Mounter
EINDHOVEN, THE NETHERLANDS
A wafer feeder option is now available from Assembléon for its Topaz-XiII and ACM component placement machines. The feeder enables manufacturers to bring wafer feeding on-line at a low cost per placement. Implemented on the Topaz-XiII, the feeder delivers bare die placement speed of around 6,300 cph with an accuracy of 20 micron at 1 sigma. The ACM with the feeder can place up to 3,000 cph with an accuracy of 3 micron at 1 sigma. Additionally, the wafer feeder can handle wafers from 5" to 8", and five tool bits cover a range of die sizes from 2.5 to 18 mm square and 0.07 to 0.5 mm thickness. (June 19)

Sonoscan Single Frequency Imaging
ELK GROVE VILLAGE, ILL.
Sonoscan's Virtual Sample Mode from its FFT-filtering software takes advantage of the multiple-frequency echoes of acoustic micro imaging. The individual-frequency FFT-filtered images can be viewed serially, or can be displayed simultaneously. Single-frequency images give crisp definition and accurate analysis, and can detect difficult features. (June 19)

FKI Tray Sorter
FREDERICK, MARYLAND
The S-3000E Tilt Tray Sorter from FKI Logistex Crisplant Inc. is ideal for various applications. The electronic tilt design feature allows the sorter to reach high speeds. The feature can be specifically programmed to tilt/discharge between 5 and 45 degrees for greater discharge accuracy, higher discharge control and lower maintenance costs. (June 18)

Stages and Actuators from Polytec
AUBURN, MASS.
A new line of micro-positioning products from Polytec PI, NanoPositioning Group, was added to its range of piezoelectric nanopositioning stages. The micro-positioning line includes micro-translation stages, ball screw driven linear actuators, rotation stages and elevation stages. The stages and actuators provide typical minimum incremental motion of 50 nanometers and below. Optional PZT drivers also are available for even higher resolutions. (June 18)

Dispensing Pen from I&J Fisnar
FAIR LAWN, N.J.
The JC1015 from I&J Fisnar is a convenient, lightweight dispensing tool that operates by pressing a finger-switch to actuate a needle valve. Most low- to medium-viscosity fluids work well with the system, except liquids that react with metal. Material is fed from a cartridge or reservoir, while the finger control instantly opens and closes the material flow. The dispensing pen is ideal for potting applications, because microdots and beading is possible with precise control. (June 17)

Dymax Selector Guide
TORRINGTON, CONN.
A new product selector guide from Dymax Corp. describes a line of high-performance adhesives for a range of fiber optic assembly applications. The selector guide includes three low-shrink, opaque positioning adhesives and eight adhesives designed for use in the optical path. Also included in the brochure are various UV curing lamps that are matched to adhesive output to optimize the curing process. (June 17)

IC Package Inspection System from Electro Scientific Industries
PORTLAND, ORE.
Model 8810 from Electro Scientific Industries Inc. is a 3-D IC package inspection system that inspects BGAs and CSPs handled in trays. The system uses a proprietary laser sensor, enabling it to inspect devices at high speeds. The modular design provides a separate station for mark inspection so the 3-D sensor is efficiently optimized for inspecting devices. An easy-to-use graphical interface enables quick setup for high-volume production, and it allows customized data reports for SPC. Additionally, the system is equipped with an integrated chip handler system, and also features three pickup heads to obtain maximum sorting speed. (June 14)

Dage Bond Tester
FREMONT, CALIF.
The Dage-4300 from Dage Precision Industries is a semiautomatic bond tester for the shearing of bumps on 300-mm wafers. The wafers are manually loaded into a frame or automatically placed and removed. After a semiautomatic alignment onto the X-Y stage, the operator can initiate a fully automated bump shear test routine. After testing, an optional image capture system can be used. (June 14)

Modular Conveyors from Palomar Technologies
VISTA, CALIF.
A new line of modular conveyors from Palomar Technologies can be used in the design and manufacture of automated assembly equipment that consists of a set of standard, pre-engineered, and pre-tested building modules. Conveyor features include off-the-shelf adjustable width conveyors, configurable speed, and programmable pitch indexers that allow for quick change. Part tooling features include a standard lift mechanism for cold and heated/hot rail tooling with a standard mounting plate, dowel pins, and three-point adjustable leveling points. These conveyors use a common control system and a programmable operator screen touch that can be used for all the modules. (June 13)

Fine-pitch Quad Flat Packages from Advanced Interconnect Technologies
PLEASANTON, CALIF.
Very Thin Fine Pitch Quad Flat Packages-No Leads (VFQFP-N) and Very Very Fine Pitch Quad Flat Packages-No Leads (WFQFP-N) from Advanced Interconnect Technologies combine performance benefits of array packaging with the cost-effectiveness of a lead-frame approach. The small size of these packages, coupled with good thermal and electrical performance, make them ideal for handheld and portable communications. They are available in wire bond and flip chip configurations, and can be both used as alternatives to low lead count array packages as well as leaded packages. (June 13)

Electroglas Yield Management Software
SAN JOSE, CALIF.
YieldManager 4.0 from Electroglas Inc. features a new user interface and navigation, expanded yield analysis functions and the capability to handle next-generation data sizes. The system also can be accessed from remote locations. New graphical analysis flow tools allow users to design the flow of analysis visually, including decision branching and to save as a macro script that can be edited and executed. A Web-based querying capability for SPC data acquisition and analysis and customizable SPC monitoring rules also are available. (June 12)

Loctite Flexible Damming Material
ROCKY HILL, CONN.
Hysol FP6401 from Loctite Corp. is a black, low-viscosity, flexible damming material designed to be a flow control barrier around areas of bare chip encapsulation. The liquid epoxy material exhibits low modulus, making it ideal for use on devices that are stress sensitive or have tight coplanarity requirements. The material adheres to both flexible and rigid circuit substrates. The material also features minimal slumping and yields a cured height/width aspect ratio of 0.70. Curing in 30 minutes at 165 degrees C, this epoxy damming material should be co-cured with the mating encapsulation material. (June 12)

Add RSS Feed